Electrode and arrangement with movable shield
    1.
    发明授权
    Electrode and arrangement with movable shield 失效
    电极和可移动​​屏蔽的布置

    公开(公告)号:US08398775B2

    公开(公告)日:2013-03-19

    申请号:US11937137

    申请日:2007-11-08

    摘要: The present invention comprises an electrode arrangement for a coating device with a stationary first electrode (3) and a second movable electrode (18), whose principle surfaces are opposing each other during coating, wherein the second electrode (18) may be moved along a plane parallel to the opposing principle surfaces, wherein at least one end face of an electrode running transversely to the principal surface an electrical shield (12, 19, 13) is provided, which extends at least partially parallel to the end face of one electrode, wherein at least one part (14) of the shield is formed so as to be movable.

    摘要翻译: 本发明包括一种用于具有固定第一电极(3)和第二可动电极(18)的涂覆装置的电极装置,其主要表面在涂覆期间彼此相对,其中第二电极(18)可以沿着 平行于相对的原理表面的平面,其中提供横向于主表面延伸至少部分平行于一个电极的端面的电屏蔽(12,19)13的电极的至少一个端面, 其中所述屏蔽件的至少一个部分(14)形成为可移动的。

    ELECTRODE AND ARRANGEMENT WITH MOVABLE SHIELD
    2.
    发明申请
    ELECTRODE AND ARRANGEMENT WITH MOVABLE SHIELD 失效
    电极和布置与可移动的屏蔽

    公开(公告)号:US20090121604A1

    公开(公告)日:2009-05-14

    申请号:US11937137

    申请日:2007-11-08

    IPC分类号: H01J21/22

    摘要: The present invention comprises an electrode arrangement for a coating device with a stationary first electrode (3) and a second movable electrode (18), whose principle surfaces are opposing each other during coating, wherein the second electrode (18) may be moved along a plane parallel to the opposing principle surfaces, wherein at least one end face of an electrode running transversely to the principal surface an electrical shield (12, 19, 13) is provided, which extends at least partially parallel to the end face of one electrode, wherein at least one part (14) of the shield is formed so as to be movable.

    摘要翻译: 本发明包括一种用于具有固定第一电极(3)和第二可动电极(18)的涂覆装置的电极装置,其主要表面在涂覆期间彼此相对,其中第二电极(18)可以沿着 平行于相对的原理表面的平面,其中提供横向于主表面延伸至少部分平行于一个电极的端面的电屏蔽(12,19)13的电极的至少一个端面, 其中所述屏蔽件的至少一个部分(14)形成为可移动的。

    Encapsulation for organic device
    3.
    发明授权
    Encapsulation for organic device 失效
    有机装置封装

    公开(公告)号:US07518142B2

    公开(公告)日:2009-04-14

    申请号:US11761770

    申请日:2007-06-12

    IPC分类号: H01L35/24

    CPC分类号: H01L51/5253 H01L2251/558

    摘要: The present invention concerns a thin-film encapsulation structure for electronic devices with organic substances, especially OLEDs or other organic optoelectronic devices as well as corresponding components and a process for the production with a primary, inorganic barrier layer (5), which is directly arranged on the device or the surface to be encapsulated; a planarization layer (6) arranged on the primary, inorganic barrier layer, the thickness of said planarization layer selected such that it is thicker than the simple value of the distance between highest peak and deepest valley of the surface of the primary barrier layer or the surface of the device under the primary barrier layer or the surface to be encapsulated, as well as a secondary barrier layer (14) arranged on the planarization layer.

    摘要翻译: 本发明涉及一种具有有机物质的电子器件的薄膜封装结构,特别是OLED或其它有机光电子器件以及相应的部件,以及用于生产具有主要无机阻挡层(5)的方法,其直接布置 在要封装的设备或表面上; 布置在初级无机阻挡层上的平坦化层(6),所述平坦化层的厚度被选择为比主要阻挡层的表面的最高峰和最深谷之间的距离的简单值 主要阻挡层或待封装表面下的器件表面,以及布置在平坦化层上的次级阻挡层(14)。

    ENCAPSULATION FOR ORGANIC DEVICE
    4.
    发明申请
    ENCAPSULATION FOR ORGANIC DEVICE 失效
    有机装置封装

    公开(公告)号:US20070290201A1

    公开(公告)日:2007-12-20

    申请号:US11761770

    申请日:2007-06-12

    IPC分类号: H01L29/08

    CPC分类号: H01L51/5253 H01L2251/558

    摘要: The present invention concerns a thin-film encapsulation structure for electronic devices with organic substances, especially OLEDs or other organic optoelectronic devices as well as corresponding components and a process for the production with a primary, inorganic barrier layer (5), which is directly arranged on the device or the surface to be encapsulated; a planarization layer (6) arranged on the primary, inorganic barrier layer, the thickness of said planarization layer selected such that it is thicker than the simple value of the distance between highest peak and deepest valley of the surface of the primary barrier layer or the surface of the device under the primary barrier layer or the surface to be encapsulated, as well as a secondary barrier layer (14) arranged on the planarization layer.

    摘要翻译: 本发明涉及一种具有有机物质的电子器件的薄膜封装结构,特别是OLED或其它有机光电子器件以及相应的部件,以及用于生产具有主要无机阻挡层(5)的方法,其直接布置 在要封装的设备或表面上; 布置在初级无机阻挡层上的平坦化层(6),所述平坦化层的厚度被选择为比主要阻挡层的表面的最高峰和最深谷之间的距离的简单值 主要阻挡层或待封装表面下的器件表面,以及布置在平坦化层上的次级阻挡层(14)。