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1.发明授权公开(公告)号：US09021985B2
公开(公告)日：2015-05-05
申请号：US13612538
申请日：2012-09-12
IPC分类号： C23C16/505 , C23C16/452 , C23C16/455 , C23C16/507 , H01J37/32
CPC分类号： C23C16/505 , C23C16/452 , C23C16/45563 , C23C16/507 , H01J37/321 , H01J37/3244 , H01J2237/3321 , H01L21/02274 , H01L21/0262 , H01L21/28556 , Y10T137/6851
摘要： Embodiments related to hardware and methods for processing a semiconductor substrate are disclosed. One example film deposition reactor includes a process gas distributor including a plasma gas-feed inlet located to supply plasma gas to a plasma generation region within the film deposition reactor and a precursor gas-feed inlet located to supply film precursor gas downstream of the plasma generation region; an insulating confinement vessel configured to maintain a plasma generation region at a reduced pressure within the film deposition reactor and an inductively-coupled plasma (ICP) coil arranged around a portion of a sidewall of the insulating confinement vessel and positioned so that the sidewall separates the plasma generation region from the ICP coil; and a susceptor configured to support the semiconductor substrate so that a film deposition surface of the semiconductor substrate is exposed to a reaction region formed downstream of the process gas distributor.
摘要翻译： 公开了与用于处理半导体衬底的硬件和方法相关的实施例。 一个示例性膜沉积反应器包括处理气体分配器，其包括等离子体气体进料入口，该等离子体气体进料入口定位成将等离子体气体供应到膜沉积反应器内的等离子体产生区域;以及前体气体进料入口，其位于将等离子体产生 地区; 绝缘限制容器，其被配置为将所述膜沉积反应器内的等离子体产生区域保持在较低的压力;以及电感耦合等离子体（ICP）线圈，其布置在所述绝缘限制容器的侧壁的一部分周围并且被定位成使得所述侧壁将 来自ICP线圈的等离子体产生区域; 以及基座，被配置为支撑半导体衬底，使得半导体衬底的膜沉积表面暴露于形成在处理气体分配器下游的反应区域。
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2.发明申请公开(公告)号：US20140073143A1
公开(公告)日：2014-03-13
申请号：US13612538
申请日：2012-09-12
IPC分类号： C23C16/505 , H01L21/31 , F17D1/00
CPC分类号： C23C16/505 , C23C16/452 , C23C16/45563 , C23C16/507 , H01J37/321 , H01J37/3244 , H01J2237/3321 , H01L21/02274 , H01L21/0262 , H01L21/28556 , Y10T137/6851
摘要： Embodiments related to hardware and methods for processing a semiconductor substrate are disclosed. One example film deposition reactor includes a process gas distributor including a plasma gas-feed inlet located to supply plasma gas to a plasma generation region within the film deposition reactor and a precursor gas-feed inlet located to supply film precursor gas downstream of the plasma generation region; an insulating confinement vessel configured to maintain a plasma generation region at a reduced pressure within the film deposition reactor and an inductively-coupled plasma (ICP) coil arranged around a portion of a sidewall of the insulating confinement vessel and positioned so that the sidewall separates the plasma generation region from the ICP coil; and a susceptor configured to support the semiconductor substrate so that a film deposition surface of the semiconductor substrate is exposed to a reaction region formed downstream of the process gas distributor.
摘要翻译： 公开了与用于处理半导体衬底的硬件和方法相关的实施例。 一个示例性膜沉积反应器包括处理气体分配器，其包括等离子体气体进料入口，该等离子体气体进料入口定位成将等离子体气体供应到膜沉积反应器内的等离子体产生区域;以及前体气体进料入口，其位于将等离子体产生 地区; 绝缘限制容器，其被配置为将所述膜沉积反应器内的等离子体产生区域保持在较低的压力;以及电感耦合等离子体（ICP）线圈，其布置在所述绝缘限制容器的侧壁的一部分周围并且被定位成使得所述侧壁将 来自ICP线圈的等离子体产生区域; 以及基座，被配置为支撑半导体衬底，使得半导体衬底的膜沉积表面暴露于形成在处理气体分配器下游的反应区域。
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公开(公告)号：US08933375B2
公开(公告)日：2015-01-13
申请号：US13535214
申请日：2012-06-27
申请人： Todd Dunn , Fred Alokozai , Jerry Winkler , Michael Halpin
发明人： Todd Dunn , Fred Alokozai , Jerry Winkler , Michael Halpin
CPC分类号： H01L21/67103 , F28D15/00 , H01L21/67109 , H01L21/68714 , H01L21/68742
摘要： A wafer processing apparatus may include a susceptor having a top side and a backside, a susceptor heater having a spacing member and a heating member, a shim removably mounted between the susceptor and the susceptor heater, a cavity formed by the susceptor backside, the susceptor heater, and the shim, a fluid inlet communicating with the cavity, and a plurality of fluid outlets communicating with the cavity.
摘要翻译： 晶片处理装置可以包括具有顶侧和背面的基座，具有间隔构件和加热构件的基座加热器，可移除地安装在基座和基座加热器之间的垫片，由基座背面形成的空腔，基座 加热器和垫片，与空腔连通的流体入口以及与空腔连通的多个流体出口。
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公开(公告)号：US20140000843A1
公开(公告)日：2014-01-02
申请号：US13535214
申请日：2012-06-27
申请人： Todd Dunn , Fred Alokozai , Jerry Winkler , Michael Halpin
发明人： Todd Dunn , Fred Alokozai , Jerry Winkler , Michael Halpin
IPC分类号： H01L21/324 , F28F7/00
CPC分类号： H01L21/67103 , F28D15/00 , H01L21/67109 , H01L21/68714 , H01L21/68742
摘要： A wafer processing apparatus may include a susceptor having a top side and a backside, a susceptor heater having a spacing member and a heating member, a shim removably mounted between the susceptor and the susceptor heater, a cavity formed by the susceptor backside, the susceptor heater, and the shim, a fluid inlet communicating with the cavity, and a plurality of fluid outlets communicating with the cavity.
摘要翻译： 晶片处理装置可以包括具有顶侧和背面的基座，具有间隔构件和加热构件的基座加热器，可移除地安装在基座和基座加热器之间的垫片，由基座背面形成的空腔，基座 加热器和垫片，与空腔连通的流体入口以及与空腔连通的多个流体出口。
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