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公开(公告)号:US20220148762A1
公开(公告)日:2022-05-12
申请号:US17598435
申请日:2020-03-16
申请人: Fujikura Ltd.
发明人: Masaki Ohsugi
IPC分类号: H01B12/06 , H01B1/08 , C23C14/46 , C23C14/08 , C23C14/22 , C23C14/34 , C23C14/16 , C23C14/58 , C25D3/38
摘要: An oxide superconducting wire includes a superconducting laminate including an oxide superconducting layer disposed, either directly or indirectly, on a substrate, and a stabilization layer which is a Cu plating layer covering an outer periphery of the superconducting laminate. An average crystal grain size of the Cu plating layer is 3.30 μm or more and equal to or less than a thickness of the Cu plating layer.
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公开(公告)号:US11621105B2
公开(公告)日:2023-04-04
申请号:US17598435
申请日:2020-03-16
申请人: Fujikura Ltd.
发明人: Masaki Ohsugi
IPC分类号: H01B12/00 , H01B12/06 , C23C14/08 , C23C14/16 , C23C14/22 , C23C14/34 , C23C14/46 , C23C14/58 , C25D3/38 , H01B1/08 , H01F6/06
摘要: An oxide superconducting wire includes a superconducting laminate including an oxide superconducting layer disposed, either directly or indirectly, on a substrate, and a stabilization layer which is a Cu plating layer covering an outer periphery of the superconducting laminate. An average crystal grain size of the Cu plating layer is 3.30 μm or more and equal to or less than a thickness of the Cu plating layer.
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公开(公告)号:US11756708B2
公开(公告)日:2023-09-12
申请号:US17598525
申请日:2020-03-16
申请人: Fujikura Ltd.
发明人: Masaki Ohsugi
IPC分类号: H01B12/06 , C23C14/02 , C23C14/08 , C23C14/16 , C23C14/22 , C23C14/34 , C23C14/46 , C23C14/58 , C23C28/00 , C25D3/38 , H01B1/08 , H01F6/06
CPC分类号: H01B12/06 , C23C14/021 , C23C14/08 , C23C14/081 , C23C14/082 , C23C14/083 , C23C14/165 , C23C14/221 , C23C14/3485 , C23C14/46 , C23C14/5806 , C23C28/32 , C23C28/345 , C25D3/38 , H01B1/08 , H01F6/06
摘要: An oxide superconducting wire includes a superconducting laminate including an oxide superconducting layer disposed, either directly or indirectly, on a substrate, and a stabilization layer which is a Cu plating layer covering an outer periphery of the superconducting laminate, and a Vickers hardness of the Cu plating layer is in the range of 80 to 190 HV.
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公开(公告)号:US20220148763A1
公开(公告)日:2022-05-12
申请号:US17598525
申请日:2020-03-16
申请人: Fujikura Ltd.
发明人: Masaki Ohsugi
IPC分类号: H01B12/06 , H01B1/08 , C23C14/02 , C23C14/08 , C23C14/46 , C23C14/16 , C23C14/58 , C23C14/22 , C23C14/34 , C25D3/38 , C23C28/00
摘要: An oxide superconducting wire includes a superconducting laminate including an oxide superconducting layer disposed, either directly or indirectly, on a substrate, and a stabilization layer which is a Cu plating layer covering an outer periphery of the superconducting laminate, and a Vickers hardness of the Cu plating layer is in the range of 80 to 190 HV.
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公开(公告)号:US20190172612A1
公开(公告)日:2019-06-06
申请号:US16324064
申请日:2017-07-27
申请人: FUJIKURA LTD.
发明人: Masaki Ohsugi
IPC分类号: H01B12/06 , C01G3/00 , C01F7/02 , C01F17/00 , C01F5/02 , C23C28/00 , C23C14/02 , C23C14/46 , C23C14/08 , C23C16/515 , C23C16/40 , C23C14/18 , C23C14/58
摘要: An oxide superconducting wire includes two superconducting laminates that are superposed on each other in a thickness direction. Each superconducting laminate includes a tape-shaped substrate, an intermediate layer disposed on one face of the substrate, an oxide superconducting layer disposed on the intermediate layer, and a protective layer covering a surface of the oxide superconducting layer. The two superconducting laminates are integrated by a metal layer that is disposed at least on both lateral faces of the two superconducting laminates in a width direction, such that the two superconducting laminates form a non-fixed portion therebetween that is not fixed in a longitudinal direction of the superconducting laminates.
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6.
公开(公告)号:US20180114638A1
公开(公告)日:2018-04-26
申请号:US15506966
申请日:2016-11-08
申请人: FUJIKURA LTD.
发明人: Masaki Ohsugi
CPC分类号: H01F41/048 , H01B12/06 , H01L39/128 , H01L39/2419 , H01L39/248
摘要: In a method of manufacturing an oxide superconducting wire, a superconducting laminated body is prepared, a tape-shaped stabilizer is folded to be divided into a first portion in which the stabilizer covers one surface of the superconducting laminated body in a thickness direction and a second portion in which the stabilizer covers both side surfaces of the superconducting laminated body in a widthwise direction and the stabilizer is disposed around the superconducting laminated body, the first portion is formed to have a width larger than that of the superconducting laminated body using a molding jig and the superconducting laminated body is covered with the stabilizer, and the superconducting laminated body and the stabilizer are bonded and a bonding material between the second portion and the superconducting laminated body is formed to have a thickness larger than that of a bonding material between the first portion and the superconducting laminated body.
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