Abstract:
A method of manufacturing a photoelectric composite substrate, includes: aligning and fixing an optical element having a solder terminal to an optical waveguide for forming a path of an optical signal on a printed circuit board; mounting the optical waveguide, to which the optical element is fixed, on the printed circuit board; and welding the solder terminal to an electrode of a package installed on the printed circuit board or an electrode of the printed circuit board.
Abstract:
An optical waveguide substrate includes: a substrate body in which an optical waveguide is formed; a cable holding part configured to have a cable holding hole into which a signal cable is inserted, the signal cable having one of an incidence part and an emission part that is arranged so as to face the optical waveguide and having a first magnetic part; and a second magnetic part configured to generate a repulsive force in the cable holding hole in association with the first magnetic part.
Abstract:
A placement apparatus for an optical component includes: a suction nozzle that includes a nozzle main body having a suction surface having a suction port, an optical component being sucked to the suction port, a plurality of nozzle electrodes disposed on the suction surface, each of the nozzle electrodes being brought into contact with a corresponding one of a plurality of component electrodes provided on the optical component so as to establish electrical conduction between each of the plurality of nozzle electrodes and a corresponding one of the plurality of component electrodes.
Abstract:
A method for manufacturing an optical transmission device, includes: arranging a plurality of optical waveguides including waveguide mirrors, a transmission-side optical module and a reception-side optical module on one side of a substrate; photographing, with a photographic device, at least one waveguide mirror, and the transmission-side optical module or the reception-side optical module corresponding to the waveguide mirror, from another side of the substrate via an opening formed in the substrate; detecting optical-axis centers of the transmission-side optical module or optical-axis centers of the reception-side optical module, and central positions of reflective surfaces of the waveguide mirrors corresponding to the detected optical-axis centers, from a result of the photographing; and aligning and fixing a position relationship between the optical waveguides and the transmission-side optical module or the reception-side optical module based on a result of the detecting.
Abstract:
A housing includes a first case and a second case configured to be joined together to make a housing space; and a double-sided adhesive member having a first surface and a second surface, the double-sided adhesive member including an impermeable, elastic base material, and a plurality of binder layers formed on either surface of the base material, the binder layers on the first and second surfaces being bonded to the first and second cases, respectively, wherein an adhesive force between the first case and the first surface of the double-sided adhesive member is greater on an outer side of the first case than on an inner side of the first case, and wherein an adhesive force between the second case and the second surface of the double-sided adhesive member is greater on an inner side of the second case than on an outer side of the second case.