摘要:
The resin composition for forming plated layer disclosed herein comprises a polyamide composed of a dicarboxylic acid component recuring unit and a recurring unit derived from a diamine component unit having an alkylene group of 4 to 25 carbon atoms and at least one inorganic filler. There are also disclosed the resin molded article having plated layer formed thereon, the electromagnetic wave shielding material, the decorative resin molded article and the connecting material produced by forming plated layer on the surfaces of the resin molded articles formed from said resin composition. Further, there is disclosed the printed circuit board produced by forming selectively metallized layer in wiring circuit portion on the surface of the resin molded article formed from said resin composition and the method for plating to form these articles having the layer plated thereon.
摘要:
This invention concerns a polyolefin resin composition composed essentially of(A) a polyolefin resin,(B) an alkyl disulfide compound represented by formula [I]R.sup.1 --S--S--R.sup.2 [I] wherein R.sup.1 and R.sup.2 are the same or different and each denotes an alkyl group with 10 or more carbon atoms,(C) a triazine compound represented by formula [II] ##STR1## and/or a benzene compound represented by formula [III] ##STR2## According to this invention, there is provided the stabilized polyolefin resin composition that can resistant to heat ageing for a long period of time without discoloring.
摘要:
A catalyst composition consisting essentially of a molded article comprising an anhydrous inorganic potassium compound and metallic sodium and metallic potassium dispersed on the surface of the molded article, said molded article further containing 0.7 to 3% by weight, based on the weight of the inorganic potassium compound, of elemental carbon, the atomic ratio of metallic sodium to metallic potassium being in the range of from 20:80 to 90:10. This catalyst composition is useful for the dimerization or codimerization of alpha-olefins.
摘要:
Unsaturated compounds having at least 4 carbon atoms, including unsaturated alicyclic compounds having at least 4 carbon atoms, unsaturated aliphatic compounds having at least one carbon-carbon unsaturated bond and having at least 4 carbon atoms and unsaturated aromatic compounds having at least one carbon-carbon unsaturated bond in the branched chain thereof and (ii) aldehydes or ketones having at least 4 carbon atoms are catalytically co-oxidized with an oxygen-containing gas in a liquid phase to form a cleaveged product or products of unsaturated bond of the unsaturated compounds at a high yield. This co-oxidation reaction is carried out in the presence of a heavy metal containing iron, cobalt, nickel, ruthenium, rhodium, palladium, osmium, iridium, platinum, copper, silver, chromium, molybdenum, tungsten, manganese and rhenium and the compounds thereof.
摘要:
The cycloolefin resin compositions of the present invention comprise a thermoplastic resin containing an olefin polymer having an alicyclic structure, specific stabilizers selected from phenolic stabilizers, organic thioether stabilizers, organic phosphite stabilizers, UV-ray absorbers and hindered amine stabilizers. The cycloolefin resin compositions show excellent thermal aging resistance and weathering resistance by the use of specific stabilizers, and therefore they are favorably used for forming optical instrument parts. Furthermore, the thermoplastic resin may be prepared from an olefin polymer having an alicyclic structure and a flexible polymer or flexible polymers. The incorporation of the flexible polymer especially improves the mechanical strength of the resultant products, and therefore the resin compositions are favorably used for machine parts, electronic parts, automobile parts, etc.
摘要:
Compositions comprising (A) cycloolefin random copolymer containing an ethylene component, and a cycloolefin component represented by the general formula [I] or [II] and having an intrinsic viscosity of 0.05-10 dl/g as measured at 135.degree. C. in decalin and a softening temperature (TMA) not lower than 70.degree. C., and (B) a cycloolefin random copolymer containing an ethylene component, and a cycloolefin component represented by the general formula [I] or [II] and having an intrinsic viscosity of 0.01-5 dl/g as measured at 135.degree. C. in decalin and a softening temperature (TMA) of below 70.degree. C., the weight ratio of said (A) component/(B) component ranging from 100/0.1 to 100/10.The composition is particularly useful for molding an information recording base board.