公开(公告)号：US20110069448A1

公开(公告)日：2011-03-24

申请号：US12736942

申请日：2009-05-29

申请人： Günther Weichslberger ,  Arno Kriechbaum ,  Mike Morianz ,  Nikolai Haslebner ,  Johannes Stahr ,  Fritz Haring ,  Gerhard Freydl ,  Andrea Koertvelyessy ,  Mark Beesley ,  Andreas Zluc ,  Wolfgang Schrittwieser

发明人： Günther Weichslberger ,  Arno Kriechbaum ,  Mike Morianz ,  Nikolai Haslebner ,  Johannes Stahr ,  Fritz Haring ,  Gerhard Freydl ,  Andrea Koertvelyessy ,  Mark Beesley ,  Andreas Zluc ,  Wolfgang Schrittwieser

IPC分类号： H05K7/20 ,  H05K3/30

CPC分类号： H05K1/183 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/0206 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09845 ,  H05K2201/10507 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

摘要： This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).

摘要翻译： 该出版物公开了一种电路板结构和电子模块的制造方法，其中至少一个部件（6）嵌入在绝缘材料层（1）的内部，触点（14）被连接到组件 6）电连接到包含在电子模块中的导体结构（14,19）。 根据本发明，在组件（6）附近的绝缘材料层（1）中制造至少一个将组件（6）的热传导加热的热通孔（22）。

公开(公告)号：US08789271B2

公开(公告)日：2014-07-29

申请号：US12736942

申请日：2009-05-29

申请人： Günther Weichslberger ,  Arno Kriechbaum ,  Mike Morianz ,  Nikolai Haslebner ,  Johannes Stahr ,  Fritz Haring ,  Gerhard Freydl ,  Andrea Koertvelyessy ,  Mark Beesley ,  Andreas Zluc ,  Wolfgang Schrittwieser

发明人： Günther Weichslberger ,  Arno Kriechbaum ,  Mike Morianz ,  Nikolai Haslebner ,  Johannes Stahr ,  Fritz Haring ,  Gerhard Freydl ,  Andrea Koertvelyessy ,  Mark Beesley ,  Andreas Zluc ,  Wolfgang Schrittwieser

IPC分类号： H05K3/30

CPC分类号： H05K1/183 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/0206 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09845 ,  H05K2201/10507 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

摘要： This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component (6) is embedded inside an insulating-material layer (1) and contacts (14) are made to connect the component (6) electrically to the conductor structures (14, 19) contained in the electronic module. According to the invention, at least one thermal via (22), which boosts the conducting of heat away from the component (6) is manufactured in the insulating-material layer (1) in the vicinity of the component (6).

摘要翻译： 该出版物公开了一种电路板结构和电子模块的制造方法，其中至少一个部件（6）嵌入在绝缘材料层（1）的内部，触点（14）被连接到组件 6）电连接到包含在电子模块中的导体结构（14,19）。 根据本发明，在组件（6）附近的绝缘材料层（1）中制造至少一个将组件（6）的热传导加热的热通孔（22）。

公开(公告)号：US20080032109A1

公开(公告)日：2008-02-07

申请号：US10556514

申请日：2004-05-13

申请人： Gunther Leising ,  Johannes Stahr ,  Fritz Haring ,  Ping Zhao ,  Gerhard Nauer

发明人： Gunther Leising ,  Johannes Stahr ,  Fritz Haring ,  Ping Zhao ,  Gerhard Nauer

IPC分类号： H05K3/00

CPC分类号： H05K3/061 ,  C23C22/02 ,  C23C26/00 ,  C23C28/00 ,  H05K2201/0239 ,  H05K2203/0577 ,  H05K2203/107 ,  Y10T428/31504

摘要： The invention relates to a PCB blank comprising a protective film which is resistant to acid and which is made of at least two layers which are chemically linked to each other underneath each other and/or are linked to the metal surface of the PCB blank. The invention also relates to a method for coating a PCB blank with a protective film which is resistant to acid and which is made of at least two layers.

摘要翻译： 本发明涉及一种PCB坯料，其包括耐酸性的保护膜，并且由彼此相互化学连接和/或连接到PCB坯料的金属表面的至少两层制成。 本发明还涉及一种用具有耐酸性并由至少两层制成的保护膜涂覆PCB坯料的方法。