公开(公告)号：US10014238B2

公开(公告)日：2018-07-03

申请号：US15214284

申请日：2016-07-19

Applicant: GE Energy Power Conversion Technology Ltd

Inventor： Zane Taylor Miller

IPC: H01L23/24 ,  H01L23/467 ,  H01L23/367 ,  H01L23/00 ,  H01L25/07 ,  H01L25/00 ,  H01L23/373

CPC classification number: H01L23/467 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3736 ,  H01L24/32 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/32245 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/13055 ,  H01L2924/13091

Abstract: There are provided methods, systems, and electronic assemblies for efficient thermal management in electronics applications. For example, there is provided an electronic assembly that includes a thermal management system that can include a heat sink having electronic components mounted thereon. The electronic components can be mounted on the heat sink in a staggered pattern along a centerline substantially perpendicular to a direction of flow of a coolant.

公开(公告)号：US20180025963A1

公开(公告)日：2018-01-25

申请号：US15214284

申请日：2016-07-19

Applicant: GE Energy Power Conversion Technology Ltd

Inventor： Zane Taylor Miller

IPC: H01L23/467 ,  H01L23/00 ,  H01L25/00 ,  H01L23/367 ,  H01L25/07

CPC classification number: H01L23/467 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3736 ,  H01L24/32 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/32245 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/13055 ,  H01L2924/13091

Abstract: There are provided methods, systems, and electronic assemblies for efficient thermal management in electronics applications. For example, there is provided an electronic assembly that includes a thermal management system that can include a heat sink having electronic components mounted thereon. The electronic components can be mounted on the heat sink in a staggered pattern along a centerline substantially perpendicular to a direction of flow of a coolant.