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公开(公告)号：US10823858B2
公开(公告)日：2020-11-03
申请号：US15881221
申请日：2018-01-26
Applicant: General Electric Company
Inventor： James Liu , Nicholas Konkle , Biju Jacob , Douglas Albagli , William Hennessy , Habib Vafi
Abstract: An imager panel for an x-ray detector for obtaining x-ray images of an object is provided that includes a first portion disposed at the center of the hybrid imager panel that can produce images of a first resolution and a second portion disposed at least partially around the first portion that is capable of producing images of a second resolution. The hybrid imager panel provides a hybrid detector that can be selectively operated to obtain images of varying resolutions corresponding to the first resolution from the first portion, the second resolution from the second portion or a combination thereof.
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公开(公告)号：US10779791B2
公开(公告)日：2020-09-22
申请号：US15923497
申请日：2018-03-16
Applicant: GENERAL ELECTRIC COMPANY
Inventor： John Eric Tkaczyk , David Allen Langan , Peter William Lorraine , Biju Jacob , Feng Pan , Hao Lai
IPC: A61B6/00
Abstract: A method for X-ray imaging includes determining one or more pre-shot parameters corresponding to a region of interest in a subject based on an optical image of the region of interest obtained from an optical sensor. The method further includes controlling an X-ray device to generate a pre-shot X-ray image using a first X-ray dosage, based on the one or more-pre-shot parameters. The method also includes determining at least one main-shot parameter based on the pre-shot X-ray image. The method includes controlling the X-ray device to generate a main-shot X-ray image using a second X-ray dosage greater than the first X-ray dosage, based on the at least one main-shot parameter.
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公开(公告)号：US20170194375A1
公开(公告)日：2017-07-06
申请号：US14985785
申请日：2015-12-31
Applicant: General Electric Company
Inventor： Biju Jacob , Habib Vafi , Brian David Yanoff , Jeffery Jon Shaw , Jianjun Guo
IPC: H01L27/146 , G01T1/24 , G01T1/20
CPC classification number: H01L27/14689 , G01T1/2018 , G01T1/247 , H01L27/14625 , H01L27/14636 , H01L27/14658 , H01L27/14661 , H01L27/14663 , H01L27/1469
Abstract: Various approaches are discussed for using four-side buttable CMOS tiles to fabricate detector panels, including large-area detector panels. Fabrication may utilize pads and interconnect structures formed on the top or bottom of the CMOS tiles. Electrical connection and readout may utilize readout and digitization circuitry provided on the CMOS tiles themselves such that readout of groups or sub-arrays of pixels occurs at the tile level, while tiles are then readout at the detector level such that readout operations are tiered or multi-level.
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公开(公告)号：US20170194374A1
公开(公告)日：2017-07-06
申请号：US14985739
申请日：2015-12-31
Applicant: General Electric Company
Inventor： Biju Jacob , Habib Vafi , Brian David Yanoff , Jeffery Jon Shaw , Jianjun Guo
IPC: H01L27/146 , G01T1/24 , H04N5/378
Abstract: Various approaches are discussed for using four-side buttable CMOS tiles to fabricate detector panels, including large-area detector panels. Fabrication may utilize pads and interconnect structures formed on the top or bottom of the CMOS tiles. Electrical connection and readout may utilize readout and digitization circuitry provided on the CMOS tiles themselves such that readout of groups or sub-arrays of pixels occurs at the tile level, while tiles are then readout at the detector level such that readout operations are tiered or multi-level.
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5.发明授权公开(公告)号：US09526468B2
公开(公告)日：2016-12-27
申请号：US14481494
申请日：2014-09-09
Applicant: General Electric Company
Inventor： Biju Jacob , Remy Andre Klausz , John Eric Tkaczyk , Emad Abutabanjeh
CPC classification number: A61B6/5264 , A61B6/4208 , A61B6/4233 , A61B6/4405 , A61B6/467 , A61B6/486 , A61B6/487 , A61B6/502 , A61B6/5229 , A61B6/542 , G06T7/254 , G06T2207/10116 , G06T2207/30024
Abstract: According to some embodiments, a method and a system to create a medical image are disclosed. The method comprises receiving a plurality of patient tissue images during an x-ray dose. Furthermore, during the x-ray dose, a determination is made if motion occurred in the plurality of patient tissue images. In a case that no motion is determined, a diagnostic image of the patient tissue comprising the plurality of patient tissue images is created.
Abstract translation: 根据一些实施例，公开了一种用于创建医学图像的方法和系统。 该方法包括在x射线剂量期间接收多个患者组织图像。 此外，在x射线剂量期间，确定在多个患者组织图像中是否发生运动。 在不确定运动的情况下，创建包括多个患者组织图像的患者组织的诊断图像。
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Patent Agency Ranking
公开(公告)号：US20210244373A1
公开(公告)日：2021-08-12
申请号：US16789100
申请日：2020-02-12
Applicant: General Electric Company
Inventor： Uwe Wiedmann , Biju Jacob , Peter Michael Edic , Brian David Yanoff
IPC: A61B6/00 , G01N23/041
Abstract: The present disclosure relates to fabrication and use of a phase-contrast imaging detector that includes sub-pixel resolution electrodes or photodiodes spaced to correspond to a phase-contrast interference pattern. A system using such a detector may employ fewer gratings than are typically used in a phase-contrast imaging system, with certain functionality typically provided by a detector-side analyzer grating being performed by sub-pixel resolution structures (e.g., electrodes or photodiodes) of the detector. Measurements acquired using the detector may be used to determine offset, amplitude, and phase of a phase-contrast interference pattern without multiple acquisitions at different phase steps.
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公开(公告)号：US20210204889A1
公开(公告)日：2021-07-08
申请号：US16736607
申请日：2020-01-07
Applicant: General Electric Company
Inventor： Biju Jacob , Douglas Albagli , William Robert Ross , William Andrew Hennessy , Eric Patrick Davis , Bruno Kristiaan Bernard De Man , Nicholas Ryan Konkle
Abstract: The present disclosure relates to the use of X-ray detector cassettes that may be abutted or overlapped to form a detector assembly suitable for imaging objects that are too large to image using a single X-ray detector cassette. Such a detector assembly may be customized in terms of the size and/or shape of the field-of-view (FOV). In certain embodiments the radiation-sensitive electronics (e.g., readout electronics) are positioned to the side of the X-ray detecting components (e.g., scintillator, TFT array, and so forth), allowing the cassette to be thin relative to other detector devices and allowing the electronics to remain outside the X-ray beam path.
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公开(公告)号：US20200222024A1
公开(公告)日：2020-07-16
申请号：US16245938
申请日：2019-01-11
Applicant: General Electric Company
Inventor： Peter Michael Edic , Biju Jacob
IPC: A61B6/00 , G01N23/046 , A61B6/03
Abstract: The present disclosure relates to determining the position of an X-ray focal spot in real time during an imaging process and using the focal spot position to ensure alignment of the focal spot and high-aspect detector elements or to correct for focal spot misalignment, thereby mitigating image artifacts. For example, the focal spot position may be monitored and may be adjusted in real-time using electromagnetic electron beam steering during a scan. Alternatively, previously determined functional relationships between focal spot position and measured data may be applied to address or correct for focal spot misalignment in the acquired data.
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公开(公告)号：US10568602B2
公开(公告)日：2020-02-25
申请号：US15697269
申请日：2017-09-06
Applicant: General Electric Company
Inventor： John Eric Tkaczyk , Biju Jacob , Feng Pan
Abstract: The present approach relates to the use of augmented or enhanced reality to facilitate positioning of one or more of a patient, X-ray source, or detector during an image acquisition. In certain implementations, sensors and/or cameras provide quantitative information about the position of system components and the patient, which may be used to generate a positioning image based upon reference to an anatomic atlas.
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公开(公告)号：US20180331137A1
公开(公告)日：2018-11-15
申请号：US15593963
申请日：2017-05-12
Applicant: General Electric Company
Inventor： Biju Jacob
Abstract: The present approach relates to implementations of a CT detector integrating CT scintillator packs on a fast, low electronic noise and scalable CMOS active pixel sensor substrate. In one embodiment, a large 3-side buttable CMOS active pixel array with built-in column analog-to-digital conversion (ADC) circuitry (e.g., ASICs) integrated onto the same wafer is used.
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