公开(公告)号：US20140160677A1

公开(公告)日：2014-06-12

申请号：US13709469

申请日：2012-12-10

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Hendrik Pieter Jacobus de Bock ,  Stanton Earl Weaver, Jr. ,  Raj Bahadur ,  Eric Ayres Browne ,  Gary Dwayne Mandrusiak

IPC: F28F13/18 ,  H01L23/46 ,  H05K7/20 ,  H01L21/50

CPC classification number: H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and/or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet.

Abstract translation: 提供了一种集成电路装置，其包括具有第一表面的基板的模具和与第一表面相对的第二表面。 模具包括位于第一表面上的至少一个电路元件。 形成在第二表面上，是一种润湿特征，其包括间隔开的纳米尺度结构的阵列和/或间隔开的微结构的阵列。 润湿特征还包括施加到第二表面的至少一部分的润湿性涂层。 集成电路器件包括耦合到与第二表面相邻的管芯的间隔件。 此外，喷射器板联接到间隔件。 喷射器板包括至少一个微喷射器和至少一个通过喷射器板限定的出射孔。 所述至少一个出口孔邻近所述至少一个微型喷射器定位。

公开(公告)号：US09777966B2

公开(公告)日：2017-10-03

申请号：US14168206

申请日：2014-01-30

Applicant: General Electric Company

Inventor： Mark Aaron Chan Chan ,  Stefan Schroeder ,  Piniwan Thiwanka Bandara Wijekoon ,  Eric Ayres Browne

IPC: H05K7/20 ,  F28D15/02

CPC classification number: F28D15/02 ,  H05K7/20236 ,  H05K7/20927

Abstract: A subsea power module includes an outer pressure compensated vessel defining an interior chamber and one or more heat generating electrical components disposed within the interior chamber. The outer pressure compensated vessel is configured to maintain a pressure within the interior chamber substantially the same as an ambient pressure outside the outer pressure compensated vessel. Each of the electrical components may be disposed within an inner chamber of a pressure vessel disposed within the interior chamber of the outer pressure compensated vessel. Each of the one or more heat generating electrical components is configured to transfer heat generated within the interior chamber of the outer pressure compensated vessel through the wall defining the interior chamber to a fluid, such as seawater, surrounding the outer pressure compensated vessel.

公开(公告)号：US20150022975A1

公开(公告)日：2015-01-22

申请号：US13946408

申请日：2013-07-19

Applicant: General Electric Company

Inventor： Eric Ayres Browne ,  Satish Sivarama Gunturi ,  Brian Magann Rush ,  Rixin Lai ,  Anurag Kasyap Vejjupalle Subramanyam

IPC: H05K7/20

CPC classification number: H05K7/20309 ,  H01L23/4012 ,  H01L25/117 ,  H01L2924/0002 ,  H05K7/20936 ,  H01L2924/00

Abstract: A method and system for cooling a heat-generating component are provided. The system includes a heat generating electronic component including a heat conductive face, a heat sink device including at least one open face pin fin array surface directly coupled to the conductive face, each fin including a distal end including an outwardly facing contact area, the contact areas covering only a portion of the conductive face, the contact areas configured to carry electrical current therethrough, and an immersion of dielectric fluid contained in a vessel, the vessel including a heat-conductive hull at least partially submerged in a heat sink fluid.

Abstract translation: 提供了用于冷却发热部件的方法和系统。 该系统包括包括导热面的发热电子部件，散热装置，其包括直接联接到导电面的至少一个开放面销翅片阵列表面，每个散热片包括包括面向外的接触区域的远端， 仅覆盖导电面的一部分的区域，被配置为承载电流通过的接触区域以及容纳在容器中的介电流体的浸没，所述容器包括至少部分地浸没在散热器流体中的导热壳体。

公开(公告)号：US20150216080A1

公开(公告)日：2015-07-30

申请号：US14168206

申请日：2014-01-30

Applicant: General Electric Company

Inventor： Mark Aaron Chan Chan ,  Stefan Schroeder ,  Piniwan Thiwanka Bandara Wijekoon ,  Eric Ayres Browne

IPC: H05K7/20 ,  F28D15/02

CPC classification number: F28D15/02 ,  H05K7/20236 ,  H05K7/20927

Abstract: A subsea power module includes an outer pressure compensated vessel defining an interior chamber and one or more heat generating electrical components disposed within the interior chamber. The outer pressure compensated vessel is configured to maintain a pressure within the interior chamber substantially the same as an ambient pressure outside the outer pressure compensated vessel. Each of the electrical components may be disposed within an inner chamber of a pressure vessel disposed within the interior chamber of the outer pressure compensated vessel. Each of the one or more heat generating electrical components is configured to transfer heat generated within the interior chamber of the outer pressure compensated vessel through the wall defining the interior chamber to a fluid, such as seawater, surrounding the outer pressure compensated vessel.

Abstract translation: 海底功率模块包括限定内部室的外部压力补偿容器和设置在内部室内的一个或多个发热电气部件。 外部压力补偿容器被配置为保持内部腔室内的压力与外部压力补偿容器外部的环境压力基本相同。 每个电气部件可以设置在设置在外部压力补偿容器的内部室内的压力容器的内部室中。 一个或多个发热电气部件中的每一个被构造成将外部压力补偿容器的内部室内产生的热量通过限定内部室的壁传递到围绕外部压力补偿容器的流体（例如海水）。

公开(公告)号：US08912643B2

公开(公告)日：2014-12-16

申请号：US13709469

申请日：2012-12-10

Applicant: General Electric Company

Inventor： Hendrik Pieter Jacobus de Bock ,  Stanton Earl Weaver, Jr. ,  Raj Bahadur ,  Eric Ayres Browne ,  Gary Dwayne Mandrusiak

IPC: H01L23/34 ,  F28F13/18 ,  H01L23/473

CPC classification number: H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and/or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet.

Abstract translation: 提供了一种集成电路装置，其包括具有第一表面的基板的模具和与第一表面相对的第二表面。 模具包括位于第一表面上的至少一个电路元件。 形成在第二表面上，是一种润湿特征，其包括间隔开的纳米尺度结构的阵列和/或间隔开的微结构的阵列。 润湿特征还包括施加到第二表面的至少一部分的润湿性涂层。 集成电路器件包括耦合到与第二表面相邻的管芯的间隔件。 此外，喷射器板联接到间隔件。 喷射器板包括至少一个微喷射器和至少一个通过喷射器板限定的出射孔。 所述至少一个出口孔邻近所述至少一个微型喷射器定位。