公开(公告)号：US20160141257A1

公开(公告)日：2016-05-19

申请号：US15005275

申请日：2016-01-25

Applicant: GEORGIA TECH RESEARCH CORPORATION

Inventor： Venkatesh Sundaram ,  Fuhan Liu ,  Rao R. Tummala ,  Vijay Sukumaran ,  Vivek Sridharan ,  Qiao Chen

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L23/562 ,  H01L21/486 ,  H01L21/76843 ,  H01L23/15 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/15311

Abstract: Disclosed herein are, for instance, methods for producing through package vias in a glass interposer. For instance, disclosed herein is a method for producing through package vias in a glass interposer comprising laminating a polymer on at least a portion of a top surface of a glass interposer, removing at least a portion of the polymer and the glass interposer to form a through via, filling at least a portion of the through via with a metal conductor to form a metallization layer, and selectively removing a portion of the metallization layer to form a metalized through package via. Other methods are also disclosed, along with through-package-via structures in glass interposers produced therefrom.

Abstract translation: 这里公开的是例如在玻璃插入件中通过封装通孔生产的方法。 例如，本文公开了一种用于在玻璃插入件中通过封装通孔生产的方法，包括在玻璃插入件的顶表面的至少一部分上层压聚合物，去除至少一部分聚合物和玻璃插入物以形成 通孔，用金属导体填充通孔的至少一部分以形成金属化层，并且选择性地去除金属化层的一部分以形成金属化的封装通孔。 还公开了其它方法，以及由其制造的玻璃中间体中的贯穿封装通孔结构。

公开(公告)号：US10672718B2

公开(公告)日：2020-06-02

申请号：US15005275

申请日：2016-01-25

Applicant: GEORGIA TECH RESEARCH CORPORATION

Inventor： Venkatesh Sundaram ,  Fuhan Liu ,  Rao R. Tummala ,  Vijay Sukumaran ,  Vivek Sridharan ,  Qiao Chen

IPC: H01L21/48 ,  H01L23/00 ,  H01L23/15 ,  H01L23/498 ,  H01L21/768 ,  H01L23/48 ,  H01L23/31

Abstract: Disclosed herein are, for instance, methods for producing through package vias in a glass interposer. For instance, disclosed herein is a method for producing through package vias in a glass interposer comprising laminating a polymer on at least a portion of a top surface of a glass interposer, removing at least a portion of the polymer and the glass interposer to form a through via, filling at least a portion of the through via with a metal conductor to form a metallization layer, and selectively removing a portion of the metallization layer to form a metalized through package via. Other methods are also disclosed, along with through-package-via structures in glass interposers produced therefrom.