公开(公告)号：US09468986B2

公开(公告)日：2016-10-18

申请号：US13954444

申请日：2013-07-30

Applicant: GLOBALFOUNDRIES, Inc.

Inventor： Ernesto Gene de la Garza ,  Martin O'Toole

IPC: B23K1/20 ,  H05K3/34 ,  H05K13/04 ,  H01L23/00 ,  C23C28/00 ,  C23C28/02 ,  H05K3/38 ,  B32B15/04 ,  B32B3/10

CPC classification number: B23K1/20 ,  C23C28/00 ,  C23C28/02 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/43 ,  H01L2224/451 ,  H01L2224/85365 ,  H01L2224/85385 ,  H01L2224/85423 ,  H05K3/385 ,  H05K2203/0307 ,  H05K2203/0392 ,  H05K2203/1105 ,  Y10T428/12396 ,  H01L2924/00015

Abstract: Methods of effecting bond adhesion between metal structures, methods of preparing articles including bonded metal structures, and articles including bonded metal structures are provided herein. In an embodiment, a method of effecting bond adhesion between metal structures includes forming a first metal structure on a substrate. The first metal structure includes grains that have a {111} crystallographic orientation, and the first metal structure has an exposed contact surface. Formation of an uneven surface topology is induced in the exposed contact surface of the first metal structure after forming the first metal structure. A second metal structure is bonded to the exposed contact surface of the first metal structure after inducing formation of the uneven surface topology in the exposed contact surface.

Abstract translation: 本文提供了实现金属结构之间的粘合粘合的方法，包括粘结的金属结构的制品的制备方法和包括结合的金属结构的制品。 在一个实施例中，实现金属结构之间的粘合粘合的方法包括在基底上形成第一金属结构。 第一金属结构包括具有{111}晶体取向的晶粒，并且第一金属结构具有暴露的接触表面。 在形成第一金属结构之后，在第一金属结构的暴露的接触表面中引起不平坦的表面拓扑的形成。 在暴露的接触表面中引起不平坦表面拓扑的形成之后，第二金属结构被结合到第一金属结构的暴露的接触表面。

公开(公告)号：US20150037603A1

公开(公告)日：2015-02-05

申请号：US13954444

申请日：2013-07-30

Applicant: GLOBALFOUNDRIES, Inc.

Inventor： Ernesto Gene de la Garza ,  Martin O'Toole

IPC: B23K1/20 ,  H05K3/34 ,  H01L23/00 ,  H05K13/04 ,  B32B15/04 ,  B32B3/10

CPC classification number: B23K1/20 ,  C23C28/00 ,  C23C28/02 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/43 ,  H01L2224/451 ,  H01L2224/85365 ,  H01L2224/85385 ,  H01L2224/85423 ,  H05K3/385 ,  H05K2203/0307 ,  H05K2203/0392 ,  H05K2203/1105 ,  Y10T428/12396 ,  H01L2924/00015

Abstract: Methods of effecting bond adhesion between metal structures, methods of preparing articles including bonded metal structures, and articles including bonded metal structures are provided herein. In an embodiment, a method of effecting bond adhesion between metal structures includes forming a first metal structure on a substrate. The first metal structure includes grains that have a {111} crystallographic orientation, and the first metal structure has an exposed contact surface. Formation of an uneven surface topology is induced in the exposed contact surface of the first metal structure after forming the first metal structure. A second metal structure is bonded to the exposed contact surface of the first metal structure after inducing formation of the uneven surface topology in the exposed contact surface.

Abstract translation: 本文提供了实现金属结构之间的粘合粘合的方法，包括粘结的金属结构的制品的制备方法和包括结合的金属结构的制品。 在一个实施例中，实现金属结构之间的粘合粘合的方法包括在基底上形成第一金属结构。 第一金属结构包括具有{111}晶体取向的晶粒，并且第一金属结构具有暴露的接触表面。 在形成第一金属结构之后，在第一金属结构的暴露的接触表面中引起不平坦的表面拓扑的形成。 在暴露的接触表面中引起不平坦表面拓扑的形成之后，第二金属结构被结合到第一金属结构的暴露的接触表面。