公开(公告)号：US09875956B1

公开(公告)日：2018-01-23

申请号：US15276182

申请日：2016-09-26

Applicant: GLOBALFOUNDRIES INC.

Inventor： Wolfgang Sauter ,  Mark W. Kuemerle ,  Daniel P. Greenberg ,  Eric W. Tremble

IPC: H01L23/52 ,  H01L23/498 ,  H01L23/66 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/04 ,  H01L24/14 ,  H01L25/0657 ,  H01L2223/6644 ,  H01L2223/6688 ,  H01L2224/0401 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14131 ,  H01L2224/14134 ,  H01L2224/14177 ,  H01L2225/06513 ,  H01L2225/06517

Abstract: The present disclosure relates to interface structures and, more particularly, to integrated interface structures with both parallel and serial interfaces and methods of manufacture. The integrated interface structure includes: a substrate; a plurality of serial interface connections integrated on the substrate; and a plurality of parallel interface connections on the integrated substrate and within spaces between sets of the plurality of serial interface connections.