公开(公告)号：US09548275B2

公开(公告)日：2017-01-17

申请号：US13901108

申请日：2013-05-23

Applicant: GLOBALFOUNDRIES INC.

Inventor： Stephen P. Ayotte ,  Benjamin J. Pierce ,  Timothy M. Sullivan ,  Heather M. Truax

IPC: H01L23/00 ,  H01L27/20 ,  G01P15/08 ,  G01P15/09

CPC classification number: H01L23/562 ,  G01P15/0891 ,  G01P15/09 ,  H01L27/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An approach for detecting sudden changes in acceleration in a semiconductor device or semiconductor package containing the semiconductor device is disclosed. In one embodiment, a piezoelectric sensor is embedded in a semiconductor die. The piezoelectric sensor is configured to sense a mechanical force applied to the semiconductor die. An excessive force indicator is coupled to the piezoelectric sensor. The excessive force indicator is configured to generate an excessive force indication in response to the piezoelectric sensor sensing that the mechanical force applied to the semiconductor die has exceeded a predetermined threshold indicative of an excessive mechanical force.

Abstract translation: 公开了一种用于检测包含半导体器件的半导体器件或半导体封装中的加速度突然变化的方法。 在一个实施例中，将压电传感器嵌入到半导体管芯中。 压电传感器被配置为感测施加到半导体管芯的机械力。 过大的力指示器耦合到压电传感器。 过度的力指示器构造成响应于压电传感器产生过大的力指示，感测到施加到半导体管芯的机械力超过了表示过大机械力的预定阈值。

公开(公告)号：US09412691B2

公开(公告)日：2016-08-09

申请号：US14558782

申请日：2014-12-03

Applicant: GLOBALFOUNDRIES INC.

Inventor： Heather M. Truax ,  Jared P. Yanofsky

IPC: G01R31/02 ,  H01L23/498 ,  H01L23/00 ,  H01L23/48 ,  G01R31/28

CPC classification number: H01L23/49838 ,  G01R31/2863 ,  G01R31/2884 ,  G01R31/2886 ,  H01L23/481 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/1511 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed are chip carriers and methods of using them. The chip carriers each comprise a base with a first surface, a second surface opposite the first surface, and wire bond pads on the first and second surfaces. The first surface also has a chip attach area with opening(s) that extends from the first surface to the second surface. A chip can be attached to the chip attach area and, because of the opening(s), wire bond pads on opposite sides (e.g., on the top and bottom) of the chip are accessible for testing. That is, wire bond pads on the first surface can be electrically connected to one side of the chip (e.g., to the top of the chip) and/or wire bond pads on the second surface can be electrically connected through the opening(s) to the opposite side of the chip (e.g., to the bottom of the chip).

Abstract translation: 披露的是芯片载体和使用它们的方法。 芯片载体各自包括具有第一表面的基部，与第一表面相对的第二表面，以及在第一和第二表面上的引线接合焊盘。 第一表面还具有带有从第一表面延伸到第二表面的开口的芯片附着区域。 芯片可以附接到芯片连接区域，并且由于开口，芯片的相对侧（例如，在顶部和底部）上的引线接合焊盘可访问以进行测试。 也就是说，第一表面上的引线接合焊盘可以电连接到芯片的一侧（例如，到芯片的顶部），和/或第二表面上的引线接合焊盘可以通过开口电连接， 到芯片的相对侧（例如，到芯片的底部）。

公开(公告)号：US09711422B2

公开(公告)日：2017-07-18

申请号：US14821201

申请日：2015-08-07

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Stephen P. Ayotte ,  David J. Hill ,  John T. Kinnear, Jr. ,  Glen E. Richard ,  Timothy M. Sullivan ,  Heather M. Truax

IPC: G08B21/00 ,  H01L21/66 ,  G01R31/00

CPC classification number: H01L22/24 ,  G01R31/002 ,  H01L2924/0002 ,  Y10T29/49124 ,  H01L2924/00

Abstract: Methods and structures provide an electrostatic discharge (ESD) indicator including an electric field sensitive material configured to undergo a specific color change in response to an electric field. An exposure of the structure to an ESD can be visually determined via the specific color change of the ESD indicator.

公开(公告)号：US20150355253A1

公开(公告)日：2015-12-10

申请号：US14821201

申请日：2015-08-07

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Stephen P. Ayotte ,  David J. Hill ,  John T. Kinnear, JR. ,  Glen E. Richard ,  Timothy M. Sullivan ,  Heather M. Truax

IPC: G01R31/00

CPC classification number: H01L22/24 ,  G01R31/002 ,  H01L2924/0002 ,  Y10T29/49124 ,  H01L2924/00

Abstract: Methods and structures provide an electrostatic discharge (ESD) indicator including an electric field sensitive material configured to undergo a specific color change in response to an electric field. An exposure of the structure to an ESD can be visually determined via the specific color change of the ESD indicator.

Abstract translation: 方法和结构提供了静电放电（ESD）指示器，其包括响应于电场而经受特定颜色变化的电场敏感材料。 可以通过ESD指示器的特定颜色变化来可视地确定结构对ESD的曝光。