公开(公告)号：US09543253B2

公开(公告)日：2017-01-10

申请号：US14598258

申请日：2015-01-16

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Edmund Blackshear ,  Thomas E. Lombardi ,  Donald A. Merte ,  Steven P. Ostrander ,  Thomas Weiss ,  Jiantao Zheng

IPC: B23K1/00 ,  B23K1/20 ,  B23K31/00 ,  B23K31/02 ,  B23K37/04 ,  H01L21/00 ,  H01L23/00 ,  H01L21/66 ,  H01L21/673

CPC classification number: H01L23/562 ,  H01L21/67333 ,  H01L22/12 ,  H01L22/20 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/81024 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2924/3511 ,  Y02P80/30

Abstract: A method including providing a laminate substrate, characterizing the laminate substrate for warpage characteristics, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into a fixture with an adjustment to correct the horizontal plane distortion, the adjustment being located in a center of the laminate substrate, wherein the adjustment contacts the laminate substrate. The method may further include fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate.

Abstract translation: 一种方法，包括提供层压基板，表征层压基板的翘曲特性，基于翘曲特性确定水平面变形，并将层压基板放置在具有调整的固定装置中，以校正水平面失真，调节位于 所述层叠基板的中心，其中所述调节接触所述层叠基板。 该方法可以进一步包括助熔层压基板，将芯片放置在层压基板上，以及将固定装置放置在回流炉中以连接芯片和层叠基板。