Abstract:
The present disclosure generally relates to semiconductor structures and, more particularly, to back gate tuning circuits and methods of manufacture. The method includes applying a voltage to a back gate of a device; and selectively controlling the applied voltage to deactivate at least one trap within an insulating layer of the device to reduce noise contribution from the at least one trap.
Abstract:
The present disclosure relates to semiconductor structures and, more particularly, to circuits with logical back-gate switching and methods of operation. The circuit includes at least one front-gate contact and digital back-gate potentials for logical function implementation on a back side of at least one device. The digital back-gate potentials are switchable between two logic levels.
Abstract:
A device including a plurality of static random-access memory (SRAM) bitcells arranged in rows and columns, wherein the SRAM bitcells comprise fully depleted silicon-on-insulator field effect transistors (FDSOI-FETs). The FDSOI-FETs comprise P-channel-pull-up-transistors, wherein each P-channel-pull-up-transistor comprises a back gate. The device further includes a plurality of bitlines, wherein each bitline is electrically connected to the SRAM bitcells of one of the columns and a plurality of wordlines, wherein each wordline is electrically connected to the SRAM bitcells of one of the rows. The device further includes a bitline control circuit configured to select at least one column for writing, wherein during a write operation a first control signal is applied to the back gates of the P-channel-pull-up-transistors of the at least one column selected for writing and a second control signal to the back gates of the P-channel-pull-up-transistors of the columns not selected for writing.
Abstract:
A device includes an array of a plurality of memory cells, at least one N-well contact area and at least one P-well contact area. The memory cells are arranged in a plurality of rows and a plurality of columns. Each column includes an N-well region and at least one P-well region. The N-well and P-well regions extend between a first end of the column and a second end of the column. Each N-well contact area electrically contacts at least one of the N-well regions, wherein the N-well region of at least one of the columns is electrically contacted at only one of the first and second ends of the column. Each P-well contact area electrically contacts at least one of the P-well regions, wherein the P-well region of at least one of the columns is electrically contacted at only one of the first and second ends of the column.
Abstract:
A device including a plurality of static random-access memory (SRAM) bitcells arranged in rows and columns, wherein the SRAM bitcells comprise fully depleted silicon-on-insulator field effect transistors (FDSOI-FETs). The FDSOI-FETs comprise P-channel-pull-up-transistors, wherein each P-channel-pull-up-transistor comprises a back gate. The device further includes a plurality of bitlines, wherein each bitline is electrically connected to the SRAM bitcells of one of the columns and a plurality of wordlines, wherein each wordline is electrically connected to the SRAM bitcells of one of the rows. The device further includes a bitline control circuit configured to select at least one column for writing, wherein during a write operation a first control signal is applied to the back gates of the P-channel-pull-up-transistors of the at least one column selected for writing and a second control signal to the back gates of the P-channel-pull-up-transistors of the columns not selected for writing.
Abstract:
The present disclosure relates to semiconductor structures and, more particularly, to circuits with logical back-gate switching and methods of operation. The circuit includes at least one front-gate contact and digital back-gate potentials for logical function implementation on a back side of at least one device. The digital back-gate potentials are switchable between two logic levels.
Abstract:
A device includes an array of a plurality of memory cells, at least one N-well contact area and at least one P-well contact area. The memory cells are arranged in a plurality of rows and a plurality of columns. Each column includes an N-well region and at least one P-well region. The N-well and P-well regions extend between a first end of the column and a second end of the column. Each N-well contact area electrically contacts at least one of the N-well regions, wherein the N-well region of at least one of the columns is electrically contacted at only one of the first and second ends of the column. Each P-well contact area electrically contacts at least one of the P-well regions, wherein the P-well region of at least one of the columns is electrically contacted at only one of the first and second ends of the column.