公开(公告)号：US20160379900A1

公开(公告)日：2016-12-29

申请号：US14753198

申请日：2015-06-29

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Torsten Maehr ,  Martin Freitag ,  Arthur Hotzel

IPC: H01L21/66 ,  C23C16/04 ,  H01L21/67 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L22/26 ,  C23C16/042 ,  H01L21/02282 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67288 ,  H01L21/68714 ,  H01L22/12 ,  H01L22/20

Abstract: A method includes performing a spin coating process. In the spin coating process, a first fluid is dispensed to a surface of a wafer. The method further includes performing an inspection of an edge area of the wafer. On the basis of the inspection of the edge area of the wafer, a defect analysis is performed. In the defect analysis, it is determined if the edge area of the wafer has a defect that is indicative of an insufficient coating of the surface of the wafer by the first fluid.

Abstract translation: 一种方法包括进行旋涂工艺。 在旋涂工艺中，将第一流体分配到晶片的表面。 该方法还包括对晶片的边缘区域进行检查。 在对晶片的边缘区域进行检查的基础上，进行缺陷分析。 在缺陷分析中，确定晶片的边缘区域是否具有指示第一流体对晶片表面的不充分涂层的缺陷。

公开(公告)号：US09653367B2

公开(公告)日：2017-05-16

申请号：US14753198

申请日：2015-06-29

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Torsten Maehr ,  Martin Freitag ,  Arthur Hotzel

IPC: H01L21/02 ,  H01L21/67 ,  C23C16/04 ,  H01L21/66 ,  H01L21/687

CPC classification number: H01L22/26 ,  C23C16/042 ,  H01L21/02282 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/67288 ,  H01L21/68714 ,  H01L22/12 ,  H01L22/20

Abstract: A method includes performing a spin coating process. In the spin coating process, a first fluid is dispensed to a surface of a wafer. The method further includes performing an inspection of an edge area of the wafer. On the basis of the inspection of the edge area of the wafer, a defect analysis is performed. In the defect analysis, it is determined if the edge area of the wafer has a defect that is indicative of an insufficient coating of the surface of the wafer by the first fluid.