公开(公告)号：US09564350B1

公开(公告)日：2017-02-07

申请号：US14858475

申请日：2015-09-18

Applicant: GLOBALFOUNDRIES Inc.

Inventor： William Fosnight ,  Stephanie Waite

IPC: H01L21/67 ,  H01L21/677 ,  B25J11/00

CPC classification number: H01L21/67766 ,  H01L21/67389 ,  H01L21/67775 ,  H01L21/67778

Abstract: Methodology and system for using vacuum pods to store/transport semiconductor wafers to efficiently reduce contamination of the wafers while reducing cost, cycle time, and process steps and tools without the need for a complete reconfiguration of processes/tools in the fabrication facility are disclosed. Embodiments include configuring a wafer pod with an isolated vacuum environment for storing and transporting semiconductor wafers; configuring a load port module with an isolated vacuum environment to interface with the wafer pod; transporting the wafer pod, including semiconductor wafers, to interlock with the load port module; creating a merged vacuum environment including the isolated vacuum environments of the wafer pod and the load port module; increasing a pressure level in the merged vacuum environment for creating a merged ambient atmospheric environment; and transferring the semiconductor wafers through a transfer chamber, with an isolated environment, from the load port module to a semiconductor wafer processing device.

Abstract translation: 公开了使用真空荚储存/输送半导体晶片以有效减少晶片污染的方法和系统，同时降低成本，循环时间和工艺步骤和工具，而无需对制造设备中的工艺/工具进行完全重新配置。 实施例包括配置具有用于存储和传送半导体晶片的隔离真空环境的晶片盒; 配置具有隔离真空环境的负载端口模块以与晶片盒接口; 运送包括半导体晶片的晶片盒与负载端口模块互锁; 形成合并的真空环境，包括晶片盒和负载端口模块的隔离真空环境; 在合并的真空环境中增加压力水平，以创造合并的环境大气环境; 以及将隔离环境的半导体晶片从负载端口模块传送到半导体晶片处理装置。

公开(公告)号：US09632499B2

公开(公告)日：2017-04-25

申请号：US14530947

申请日：2014-11-03

Applicant: GLOBALFOUNDRIES, Inc.

Inventor： Chinmay Oza ,  Gero Grau ,  William Fosnight ,  Detlef Pabst

IPC: H01L21/31 ,  G05B19/418 ,  H01L21/67 ,  H01L21/677

CPC classification number: G05B19/4189 ,  G05B2219/31002 ,  G05B2219/31013 ,  G05B2219/45031 ,  H01L21/67276 ,  H01L21/67727 ,  H01L21/67733 ,  Y02P80/40 ,  Y02P90/20 ,  Y02P90/28 ,  Y02P90/285

Abstract: Disclosed herein are methods and systems for semiconductor fabrication. In one embodiment, a method for fabricating semiconductors utilizing a semiconductor fabrication system includes performing a semiconductor fabrication process on a first lot of unprocessed semiconductor substrates with a semiconductor fabrication equipment unit to form a first lot of processed substrates and communicating processing data regarding the first lot of processed substrates from the semiconductor fabrication equipment unit to a just-in-time (JIT) module of the semiconductor fabrication system. The method further includes determining a processing priority of the first lot of processed substrates and a processing priority of a second lot of unprocessed substrates at the JIT module and scheduling removal of the first lot of processed substrates from the semiconductor fabrication equipment unit and delivery of the second lot of unprocessed substrates to the semiconductor fabrication equipment unit by the JIT module based on the processing data and the priority of one or both of the first lot of processed substrates and the second lot of unprocessed substrates.

公开(公告)号：US20160126120A1

公开(公告)日：2016-05-05

申请号：US14530947

申请日：2014-11-03

Applicant: GLOBALFOUNDRIES, Inc.

Inventor： Chinmay Oza ,  Gero Grau ,  William Fosnight ,  Detlef Pabst

IPC: H01L21/67 ,  G05B19/418 ,  H01L21/677

CPC classification number: G05B19/4189 ,  G05B2219/31002 ,  G05B2219/31013 ,  G05B2219/45031 ,  H01L21/67276 ,  H01L21/67727 ,  H01L21/67733 ,  Y02P80/40 ,  Y02P90/20 ,  Y02P90/28 ,  Y02P90/285

Abstract: Disclosed herein are methods and systems for semiconductor fabrication. In one embodiment, a method for fabricating semiconductors utilizing a semiconductor fabrication system includes performing a semiconductor fabrication process on a first lot of unprocessed semiconductor substrates with a semiconductor fabrication equipment unit to form a first lot of processed substrates and communicating processing data regarding the first lot of processed substrates from the semiconductor fabrication equipment unit to a just-in-time (JIT) module of the semiconductor fabrication system. The method further includes determining a processing priority of the first lot of processed substrates and a processing priority of a second lot of unprocessed substrates at the JIT module and scheduling removal of the first lot of processed substrates from the semiconductor fabrication equipment unit and delivery of the second lot of unprocessed substrates to the semiconductor fabrication equipment unit by the JIT module based on the processing data and the priority of one or both of the first lot of processed substrates and the second lot of unprocessed substrates.

Abstract translation: 这里公开了用于半导体制造的方法和系统。 在一个实施例中，利用半导体制造系统制造半导体的方法包括：利用半导体制造设备单元在第一批未加工的半导体衬底上执行半导体制造工艺，以形成第一批经处理的衬底并与第一批沟通处理数据 从半导体制造设备单元到半导体制造系统的即时（JIT）模块的处理衬底。 该方法还包括确定第一批处理的基板的处理优先级和在JIT模块处的第二批未处理的基板的处理优先级，并且调度从半导体制造设备单元移除第一批经处理的基板，并递送 基于处理数据和第一批处理的基板和第二批未处理的基板中的一个或两个的优先级，由JIT模块将第二批未加工的基板加工到半导体制造设备单元。

公开(公告)号：US09411332B2

公开(公告)日：2016-08-09

申请号：US14180560

申请日：2014-02-14

Applicant: GLOBALFOUNDRIES, Inc.

Inventor： William Fosnight ,  Isaac Sarek Banner ,  Stephen Bradley Miner

IPC: H01L21/677 ,  G05B19/418

CPC classification number: G05B19/4184 ,  G05B2219/45031 ,  H01L21/67775

Abstract: Automated mechanical handling systems (AMHS) for integrated circuit fabrication, system computers programmed for use in the AMHSs, and methods of handling a wafer carrier having an inlet port and an outlet port are provided. An exemplary method of handling the wafer carrier includes providing a plurality of carrier storage positions that are adapted to receive the wafer carrier. The carrier storage positions include a presence sensor and a gas nozzle. The wafer carrier is loaded into one of the carrier storage positions. The presence of the wafer carrier in the carrier storage position is sensed with the presence sensor. A malfunction in gas flow through the inlet port is identified in the carrier storage position that contains the wafer carrier. The wafer carrier is relocated to another carrier storage position in response to identifying the malfunction.

Abstract translation: 提供了用于集成电路制造的自动机械处理系统（AMHS），被编程用于AMHS的系统计算机以及处理具有入口端口和出口的晶片载体的方法。 处理晶片载体的示例性方法包括提供适于接收晶片载体的多个载体存储位置。 载体存储位置包括存在传感器和气体喷嘴。 晶片载体被加载到载体存储位置之一中。 利用存在传感器感测载体存储位置中的晶片载体的存在。 在包含晶片载体的载体存储位置中识别通过入口的气流的故障。 响应于识别故障，晶片载体被重新定位到另一个载体存储位置。

公开(公告)号：US20150234378A1

公开(公告)日：2015-08-20

申请号：US14180560

申请日：2014-02-14

Applicant: GLOBALFOUNDRIES, Inc.

Inventor： William Fosnight ,  Isaac Sarek Banner ,  Stephen Bradley Miner

IPC: G05B19/418

CPC classification number: G05B19/4184 ,  G05B2219/45031 ,  H01L21/67775

Abstract: Automated mechanical handling systems (AMHS) for integrated circuit fabrication, system computers programmed for use in the AMHSs, and methods of handling a wafer carrier having an inlet port and an outlet port are provided. An exemplary method of handling the wafer carrier includes providing a plurality of carrier storage positions that are adapted to receive the wafer carrier. The carrier storage positions include a presence sensor and a gas nozzle. The wafer carrier is loaded into one of the carrier storage positions. The presence of the wafer carrier in the carrier storage position is sensed with the presence sensor. A malfunction in gas flow through the inlet port is identified in the carrier storage position that contains the wafer carrier. The wafer carrier is relocated to another carrier storage position in response to identifying the malfunction.

Abstract translation: 提供了用于集成电路制造的自动机械处理系统（AMHS），被编程用于AMHS的系统计算机以及处理具有入口端口和出口的晶片载体的方法。 处理晶片载体的示例性方法包括提供适于接收晶片载体的多个载体存储位置。 载体存储位置包括存在传感器和气体喷嘴。 晶片载体被加载到载体存储位置之一中。 利用存在传感器感测载体存储位置中的晶片载体的存在。 在包含晶片载体的载体存储位置中识别通过入口的气流的故障。 响应于识别故障，晶片载体被重新定位到另一个载体存储位置。