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    OVERHEAD SUBSTRATE HANDLING AND STORAGE SYSTEM
    2.
    发明申请
    OVERHEAD SUBSTRATE HANDLING AND STORAGE SYSTEM 审中-公开
    OVERHEAD基板处理和存储系统

    公开(公告)号：US20160268152A1

    公开(公告)日：2016-09-15

    申请号：US15164204

    申请日：2016-05-25

    Applicant: GLOBALFOUNDRIES Inc.

    Inventor： William J. Fosnight ,  Eric Christensen ,  Leslie Marshall ,  Ryan John Gallagher ,  Stephanie Waite ,  Gabriel Gaxiola

    IPC: H01L21/677 ,  B65G1/04

    CPC classification number: H01L21/67733 ,  B65G1/0464 ,  B65G2201/0297 ,  H01L21/677

    Abstract: A method for operating a material handling system including an overhead rack defining a plurality of storage positions, first and second side rails disposed above the overhead rack, a first cross rail movably coupled to the first and second side rails, and a first transport vehicle movably coupled to the first cross rail includes positioning the first transport vehicle above at least one interior window defined in the overhead rack. At least a portion of the first transport vehicle is descended through the interior window to interface with a first load port of a first tool disposed below the overhead rack. The first transport vehicle is positioned above at least one periphery window defined in the overhead rack. At least a portion of the first transport vehicle is descended through the periphery window to interface with a second load port of a second tool disposed below the overhead rack.

    Abstract translation: 一种用于操作材料处理系统的方法，所述材料处理系统包括限定多个存储位置的顶架，布置在所述架空架上方的第一和第二侧轨，可移动地联接到所述第一和第二侧轨的第一横梁，以及可移动地 耦合到所述第一交叉导轨包括将所述第一运输车辆定位在限定在所述架空架中的至少一个内部窗口之上。 第一运输车辆的至少一部分通过内部窗口下降，以与设置在架空架下方的第一工具的第一负载端口相接。 第一运输车辆位于架空架上限定的至少一个外围窗口的上方。 第一运输车辆的至少一部分通过周边窗口下降，以与布置在架空架下方的第二工具的第二负载端口相接。

    WAFER CARRIER PURGE APPARATUSES, AUTOMATED MECHANICAL HANDLING SYSTEMS INCLUDING THE SAME, AND METHODS OF HANDLING A WAFER CARRIER DURING INTEGRATED CIRCUIT FABRICATION
    4.
    发明申请
    WAFER CARRIER PURGE APPARATUSES, AUTOMATED MECHANICAL HANDLING SYSTEMS INCLUDING THE SAME, AND METHODS OF HANDLING A WAFER CARRIER DURING INTEGRATED CIRCUIT FABRICATION 有权
    WAFER CARRIER PURGE装置，包括其中的自动机械处理系统以及在集成电路制造过程中处理波浪载体的方法

    公开(公告)号：US20160155654A1

    公开(公告)日：2016-06-02

    申请号：US15015578

    申请日：2016-02-04

    Applicant: GLOBALFOUNDRIES, Inc.

    Inventor： William J. Fosnight ,  Stephanie Waite ,  Stephen B. Miner ,  John Robinson

    IPC: H01L21/673 ,  B08B5/02 ,  B08B9/00 ,  H01L21/677

    CPC classification number: H01L21/67389 ,  B08B5/00 ,  B08B5/02 ,  B08B9/00 ,  H01L21/67769 ,  H01L21/67775

    Abstract: A wafer carrier purge apparatus, an automated mechanical handling system, and a method of handling a wafer carrier during integrated circuit fabrication are provided. The wafer carrier purge apparatus includes a purge plate adapted for insertion into a carrier storage position. The purge plate includes a gas port and a gas nozzle in fluid communication with the gas port. The gas port receives a gas flow. The gas nozzle is adapted to contact an inlet port of a wafer carrier. The purge plate further includes a vacuum port and a vacuum nozzle in fluid communication with the vacuum port, spaced from the gas nozzle. The vacuum nozzle is adapted to capture gas that escapes from the wafer carrier through an outlet port of the wafer carrier. The purge plate is separate and removable from the carrier storage position.

    Abstract translation: 提供了晶片载体清除装置，自动机械处理系统以及在集成电路制造期间处理晶片载体的方法。 晶片载体清洗装置包括适于插入载体存放位置的清洗板。 净化板包括气体端口和与气体端口流体连通的气体喷嘴。 气体端口接收气流。 气体喷嘴适于接触晶片载体的入口。 吹扫板还包括与气体喷嘴间隔开的与真空口流体连通的真空口和真空喷嘴。 真空喷嘴适于捕获通过晶片载体的出口从晶片载体逸出的气体。 净化板是分离的，可从载体存放位置移除。

    Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication
    5.
    发明授权
    Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication 有权
    晶片载体清洗装置，包括其的自动机械处理系统以及在集成电路制造期间处理晶片载体的方法

    公开(公告)号：US09257320B2

    公开(公告)日：2016-02-09

    申请号：US13910683

    申请日：2013-06-05

    Applicant: GLOBALFOUNDRIES, Inc.

    Inventor： William J. Fosnight ,  Stephanie Waite ,  Stephen B. Miner ,  John Robinson

    IPC: H01L21/673 ,  H01L21/677 ,  B08B5/02 ,  B08B5/00 ,  B08B9/00

    CPC classification number: H01L21/67389 ,  B08B5/00 ,  B08B5/02 ,  B08B9/00 ,  H01L21/67769 ,  H01L21/67775

    Abstract: A wafer carrier purge apparatus, an automated mechanical handling system, and a method of handling a wafer carrier during integrated circuit fabrication are provided. The wafer carrier purge apparatus includes a purge plate adapted for insertion into a carrier storage position. The purge plate includes a gas port and a gas nozzle in fluid communication with the gas port. The gas port receives a gas flow. The gas nozzle is adapted to contact an inlet port of a wafer carrier. The purge plate further includes a vacuum port and a vacuum nozzle in fluid communication with the vacuum port, spaced from the gas nozzle. The vacuum nozzle is adapted to capture gas that escapes from the wafer carrier through an outlet port of the wafer carrier. The purge plate is separate and removable from the carrier storage position.

    Abstract translation: 提供了晶片载体清洗装置，自动机械处理系统以及在集成电路制造期间处理晶片载体的方法。 晶片载体清洗装置包括适于插入载体存放位置的清洗板。 净化板包括气体端口和与气体端口流体连通的气体喷嘴。 气体端口接收气流。 气体喷嘴适于接触晶片载体的入口。 吹扫板还包括与气体喷嘴间隔开的与真空口流体连通的真空口和真空喷嘴。 真空喷嘴适于捕获通过晶片载体的出口从晶片载体逸出的气体。 净化板是分离的，可从载体存放位置移除。

    Method and apparatus for storing and transporting semiconductor wafers in a vacuum pod
    6.
    发明授权
    Method and apparatus for storing and transporting semiconductor wafers in a vacuum pod 有权
    用于将半导体晶片储存和输送到真空容器中的方法和装置

    公开(公告)号：US09564350B1

    公开(公告)日：2017-02-07

    申请号：US14858475

    申请日：2015-09-18

    Applicant: GLOBALFOUNDRIES Inc.

    Inventor： William Fosnight ,  Stephanie Waite

    IPC: H01L21/67 ,  H01L21/677 ,  B25J11/00

    CPC classification number: H01L21/67766 ,  H01L21/67389 ,  H01L21/67775 ,  H01L21/67778

    Abstract: Methodology and system for using vacuum pods to store/transport semiconductor wafers to efficiently reduce contamination of the wafers while reducing cost, cycle time, and process steps and tools without the need for a complete reconfiguration of processes/tools in the fabrication facility are disclosed. Embodiments include configuring a wafer pod with an isolated vacuum environment for storing and transporting semiconductor wafers; configuring a load port module with an isolated vacuum environment to interface with the wafer pod; transporting the wafer pod, including semiconductor wafers, to interlock with the load port module; creating a merged vacuum environment including the isolated vacuum environments of the wafer pod and the load port module; increasing a pressure level in the merged vacuum environment for creating a merged ambient atmospheric environment; and transferring the semiconductor wafers through a transfer chamber, with an isolated environment, from the load port module to a semiconductor wafer processing device.

    Abstract translation: 公开了使用真空荚储存/输送半导体晶片以有效减少晶片污染的方法和系统，同时降低成本，循环时间和工艺步骤和工具，而无需对制造设备中的工艺/工具进行完全重新配置。 实施例包括配置具有用于存储和传送半导体晶片的隔离真空环境的晶片盒; 配置具有隔离真空环境的负载端口模块以与晶片盒接口; 运送包括半导体晶片的晶片盒与负载端口模块互锁; 形成合并的真空环境，包括晶片盒和负载端口模块的隔离真空环境; 在合并的真空环境中增加压力水平，以创造合并的环境大气环境; 以及将隔离环境的半导体晶片从负载端口模块传送到半导体晶片处理装置。

    Rechargeable wafer carrier systems
    9.
    发明授权
    Rechargeable wafer carrier systems 有权

    公开(公告)号：US10931143B2

    公开(公告)日：2021-02-23

    申请号：US15233454

    申请日：2016-08-10

    Applicant: GLOBALFOUNDRIES Inc.

    Inventor： Abner Bello ,  Stephanie Waite ,  William J. Fosnight

    IPC: H02J50/10 ,  H02J7/00 ,  H02J7/02 ,  H01L21/677 ,  H01L21/673

    Abstract: Rechargeable wafer carrier systems and methods are provided. A rechargeable wafer carrier system includes, for instance, a housing for holding at least one wafer and at least one electronics system therein, a rechargeable power source operably connected to the housing for powering the at least one electronics system, and a charging interface for receiving a supply of power for charging the rechargeable power source. The housing may be configured for transport within an automated material handling system. Also provided are methods of charging a rechargeable wafer carrier system, which includes, for instance, providing a rechargeable wafer carrier system having at least one electronics system and a rechargeable power source, operably connecting the rechargeable wafer carrier system to a charging base, and supplying power from the charging base to the rechargeable power source.

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