CURE ACCELERATION OF THERMAL INTERFACE ADHESIVES VIA ADJACENT COMPONENT HEATING

    公开(公告)号:US20250135730A1

    公开(公告)日:2025-05-01

    申请号:US18494856

    申请日:2023-10-26

    Abstract: Aspects of the disclosure include systems and methods that leverage adjacent component heating to accelerate the cure time of thermal interface adhesives. An exemplary method can include receiving a battery pack and a thermal management system including a cooling plate, an upper tray, and a lower tray joined to opposite surfaces of the cooling plate to define an enclosed volume therebetween. The method includes wetting an interface between the battery pack and the thermal management system with an adhesive and joining the battery pack to the thermal management system at the interface. The method includes directing a heating fluid through the enclosed volume, thereby heating the adhesive. The method includes, responsive to determining that a temperature of the adhesive has reached a target temperature, maintaining the temperature for a soak time according to a cure curve of the adhesive to achieve a target bond strength.

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