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公开(公告)号：US09822551B2
公开(公告)日：2017-11-21
申请号：US14812666
申请日：2015-07-29
Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Inventor： Shivaram Ac , Vidyashankar R. Buravalla , Paul W. Alexander
CPC classification number: E05B47/0009 , E05B83/30 , F03G7/065
Abstract: A device for cycling a component between a first condition and a second condition includes an element and a reset apparatus connected to and driven by the element. The element is formed from a shape memory alloy, wherein the alloy is transitionable between a martensite crystallographic phase and an austenite crystallographic phase in response to a thermal energy source. The apparatus is actuatable by the element from an initial state in which the alloy has the martensite phase and the component is in the first condition, to an actuated state in which the alloy has the austenite phase and the component is in the second condition. The apparatus is resettable from the actuated state to a reset state in which the alloy transitions from the austenite to the martensite phase while the component is in the first condition, and further resettable from the reset state to the initial state.
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2.发明授权Method for mitigating cure shrinkage in high temperature-processed thermosetting adhesives and SMC 有权降低高温热固性粘合剂和SMC固化收缩率的方法公开(公告)号：US09328266B2
公开(公告)日：2016-05-03
申请号：US13657245
申请日：2012-10-22
Applicant: GM Global Technology Operations LLC
Inventor： Sampath K. Vanimisetti , Chen-Shih Wang , Vidyashankar R. Buravalla
CPC classification number: C09J11/04 , B29C61/00 , B29C65/4835 , B29C65/4855 , B29C65/487 , B29C65/489 , B29C66/006 , B29C66/721 , B29C66/7311 , B29C66/7315 , B29C66/73941 , B29K2105/165 , B29K2995/0096 , C08K7/24 , Y10T428/249984
Abstract: A thermosetting polymer composite composition (such as thermosetting SMC composition) or a thermosetting adhesive composition containing reduced-volume hollow shape-memory alloy particles in the thermosetting polymer composite composition or adhesive composition experiences little or no volume loss during a curing at a temperature above the transformation temperature for the particles.
Abstract translation: 热固性聚合物复合组合物（例如热固性SMC组合物）或在热固性聚合物复合组合物或粘合剂组合物中含有体积小的中空形状记忆合金颗粒的热固性粘合剂组合物在固化过程中在高于 颗粒的转变温度。
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公开(公告)号：US20150330371A1
公开(公告)日：2015-11-19
申请号：US14812666
申请日：2015-07-29
Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Inventor： Shivaram AC , Vidyashankar R. Buravalla , Paul W. Alexander
IPC: F03G7/06
CPC classification number: E05B47/0009 , E05B83/30 , F03G7/065
Abstract: A device for cycling a component between a first condition and a second condition includes an element and a reset apparatus connected to and driven by the element. The element is formed from a shape memory alloy, wherein the alloy is transitionable between a martensite crystallographic phase and an austenite crystallographic phase in response to a thermal energy source. The apparatus is actuatable by the element from an initial state in which the alloy has the martensite phase and the component is in the first condition, to an actuated state in which the alloy has the austenite phase and the component is in the second condition. The apparatus is resettable from the actuated state to a reset state in which the alloy transitions from the austenite to the martensite phase while the component is in the first condition, and further resettable from the reset state to the initial state.
Abstract translation: 用于在第一状态和第二状态之间循环部件的装置包括连接到元件并由该元件驱动的元件和复位装置。 该元件由形状记忆合金形成，其中该合金可响应于热能源而在马氏体晶相和奥氏体晶相之间是可转变的。 该装置可以通过元件从其中合金具有马氏体相并且部件处于第一状态的初始状态致动到合金具有奥氏体相并且部件处于第二状态的致动状态。 该装置可以从致动状态复位到复合状态，其中合金从奥氏体转变为马氏体相，同时部件处于第一状态，并且还可以从复位状态复位到初始状态。
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4.发明授权Methodology and mechanisms for enhancing high ambient temperature performance in shape memory alloy applications 有权在形状记忆合金应用中提高环境温度性能的方法和机制公开(公告)号：US09091252B2
公开(公告)日：2015-07-28
申请号：US13688863
申请日：2012-11-29
Applicant: GM Global Technology Operations LLC
IPC: F03G7/06
CPC classification number: F03G7/065
Abstract: An actuator comprising an SMA element and a thermally responsive element that adjusts bias stress improves high ambient temperature operation.
Abstract translation: 包括SMA元件和调节偏压应力的热响应元件的致动器改善了高环境温度操作。
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