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公开(公告)号：US11908926B2
公开(公告)日：2024-02-20
申请号：US18105497
申请日：2023-02-03
Applicant: GRAPHENSIC AB
Inventor： Samuel Lara-Avila , Hans He , Sergey Kubatkin
IPC: H01L29/76 , H01L29/66 , H01L21/225
CPC classification number: H01L29/7606 , H01L21/2254 , H01L29/66439
Abstract: The present invention relates to a method for assembling molecules on the surface of a two-dimensional material formed on a substrate, the method comprises: forming a spacer layer comprising at least one of an electrically insulating compound or a semiconductor compound on the surface of the two-dimensional material, depositing molecules on the spacer layer, annealing the substrate with spacer layer and the molecules at an elevated temperature for an annealing time duration, wherein the temperature and annealing time are such that at least a portion of the molecules are allowed to diffuse through the spacer layer towards the surface of the two-dimensional material to assemble on the surface of the two-dimensional material. The invention also relates to an electronic device.
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公开(公告)号：US11950515B2
公开(公告)日：2024-04-02
申请号：US17044504
申请日：2018-12-06
Applicant: GRAPHENSIC AB
Inventor： Samuel Lara-Avila , Sergey Kubatkin , Hans He
CPC classification number: H10N52/80 , C01B32/194 , G01R33/07 , H10N52/01 , B82Y15/00 , B82Y40/00 , C01B2204/22 , H10N52/101
Abstract: The present invention relates to a method for connecting an electrical contact to a nanomaterial carried by a substrate. At least one layer of soluble lithography resist is provided on the nanomaterial. An opening in the at least one layer of resist exposes a surface portion of the nanomaterial. At least a portion of the exposed surface portion of the nanomaterial is removed to thereby expose the underlying substrate and an edge of the nanomaterial. A metal is deposited on at least the edge of the nanomaterial and the exposed substrate such that the metal forms an electrical contact with the nanomaterial. Removing at least a portion of the soluble lithography resist from the nanomaterial such that at least a portion of the two-dimensional material is exposed.
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公开(公告)号：US11575033B2
公开(公告)日：2023-02-07
申请号：US16955188
申请日：2018-12-06
Applicant: GRAPHENSIC AB
Inventor： Samuel Lara-Avila , Hans He , Sergey Kubatkin
IPC: H01L21/225 , H01L29/76 , H01L29/66
Abstract: The present invention relates to a method for assembling molecules on the surface of a two-dimensional material formed on a substrate, the method comprises: forming a spacer layer comprising at least one of an electrically insulating compound or a semiconductor compound on the surface of the two-dimensional material, depositing molecules on the spacer layer, annealing the substrate with spacer layer and the molecules at an elevated temperature for an annealing time duration, wherein the temperature and annealing time are such that at least a portion of the molecules are allowed to diffuse through the spacer layer towards the surface of the two-dimensional material to assemble on the surface of the two-dimensional material. The invention also relates to an electronic device.
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