公开(公告)号：US20080013283A1

公开(公告)日：2008-01-17

申请号：US11488281

申请日：2006-07-17

申请人： Gary L. Gilbert ,  Guoping Xu ,  Nicholas E. Aneshansley ,  Edward Lee Follmer

发明人： Gary L. Gilbert ,  Guoping Xu ,  Nicholas E. Aneshansley ,  Edward Lee Follmer

IPC分类号： H05K7/20

CPC分类号： H05K7/20772

摘要： A mechanism is disclosed for cooling electronic components of a module housed in a chassis. The chassis may be, for example, a rack or other housing, which may contain many such modules. The system comprises an external cooling system, and an internal cooling system for cooling electronic components on the module. The internal cooling system may reside on the module. The internal cooling system can be removed from the chassis to enable servicing components on the module without disconnecting any lines carrying cooling fluid in either fluid cooling system.

摘要翻译： 公开了用于冷却容纳在底盘中的模块的电子部件的机构。 底盘可以是例如可以包含许多这样的模块的机架或其他壳体。 该系统包括外部冷却系统和用于冷却模块上的电子部件的内部冷却系统。 内部冷却系统可能位于模块上。 内部冷却系统可以从机箱中取出，以便维护模块上的组件，而无需断开任何流体冷却系统中承载冷却液体的管路。

公开(公告)号：US07619312B2

公开(公告)日：2009-11-17

申请号：US11243300

申请日：2005-10-03

申请人： Ashok V. Krishnamoorthy ,  John E. Cunningham ,  Edward Lee Follmer

发明人： Ashok V. Krishnamoorthy ,  John E. Cunningham ,  Edward Lee Follmer

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/544 ,  H01L23/02 ,  H01L31/00 ,  H01L21/00 ,  H01L21/66

CPC分类号： H01L25/0657 ,  H01L23/48 ,  H01L24/72 ,  H01L24/90 ,  H01L2224/13 ,  H01L2224/2919 ,  H01L2224/81136 ,  H01L2224/81138 ,  H01L2224/81141 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2225/06527 ,  H01L2225/06531 ,  H01L2225/06593 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

摘要： A system that facilitates precise inter-chip alignment. The system includes a first integrated circuit chip, whose surface has etch pit wells. The system also includes a second integrated circuit chip, whose surface has corresponding etch pit wells that mate with the etch pit wells of the first integrated circuit chip. Spherical balls are placed in the etch pit wells of the first integrated circuit chip such that when the corresponding etch pit wells of the second integrated circuit chip are substantially aligned with the spherical balls, the spherical balls mate with the etch well pits of the second integrated circuit chip, thereby precisely aligning the first integrated circuit chip with the second integrated circuit chip.

摘要翻译： 一种便于精确的芯片间对准的系统。 该系统包括第一集成电路芯片，其表面具有蚀刻凹坑。 该系统还包括第二集成电路芯片，其表面具有与第一集成电路芯片的蚀刻凹坑相配合的相应蚀刻凹坑。 球形球被放置在第一集成电路芯片的蚀刻凹坑中，使得当第二集成电路芯片的相应蚀刻凹坑基本上与球形球对准时，球形球与第二集成电路芯片的蚀刻井凹坑配合 从而将第一集成电路芯片与第二集成电路芯片精确对准。