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    CIRCUIT CARD ASSEMBLY AND METHOD OF MANUFACTURING THEREOF
    2.
    发明申请
    CIRCUIT CARD ASSEMBLY AND METHOD OF MANUFACTURING THEREOF 有权
    电路卡组件及其制造方法

    公开(公告)号：US20160095199A1

    公开(公告)日：2016-03-31

    申请号：US14500530

    申请日：2014-09-29

    Applicant: General Electric Company

    Inventor： Shakti Singh Chauhan ,  Stuart Connolly ,  Binoy Milan Shah ,  Brian Hoden ,  Joo Han Kim

    IPC: H05K1/02 ,  H05K3/36 ,  H05K3/30 ,  H05K7/20 ,  H05K1/18

    CPC classification number: H05K1/0204 ,  H05K1/181 ,  H05K3/30 ,  H05K3/368 ,  H05K7/1461 ,  H05K7/20672

    Abstract: A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component.

    Abstract translation: 提供电路卡组件。 组件包括第一印刷电路板，在预定位置安装在第一印刷电路板上的至少一个电子元件，耦合到第一印刷电路板的框架和耦合到框架的传热组件。 传热组件包括在第一印刷电路板的至少一部分上延伸的第一板，耦合到第一板的热管和位于至少一个电子部件和热管之间的导热部件。 导热构件基于所述至少一个电子部件的预定位置被选择性地安装在沿着第一板的预定位置处。

    Dielectric fluids for linear switched capacitive devices
    3.
    发明授权
    Dielectric fluids for linear switched capacitive devices 有权

    公开(公告)号：US09806639B2

    公开(公告)日：2017-10-31

    申请号：US14699775

    申请日：2015-04-29

    Applicant: General Electric Company

    Inventor： Qin Chen ,  Manoj Ramprasad Shah ,  Joo Han Kim ,  Stefan Grubic ,  Nathaniel Benedict Hawes

    IPC: H02N1/00 ,  H01B3/24

    CPC classification number: H02N1/002 ,  H01B3/24

    Abstract: A dielectric fluid includes a first liquid having first dielectric constant and conductivity values. The dielectric fluid also includes a second liquid having second dielectric constant and conductivity values. The first dielectric constant value is greater than the second dielectric constant value and the second electrical conductivity value is less than the first electrical conductivity value. The first and second liquids form an immiscible mixture that has third dielectric constant and conductivity values between the first and second dielectric constant values and the first and second electrical conductivity values, respectively. The first liquid forms a high conductivity phase representative of the first conductivity value, and the second liquid forms a low conductivity phase representative of the second conductivity value. The low conductivity phase is continuous the high conductivity phase is a plurality of droplets non-homogeneously dispersed within, and separated by, the continuous low conductivity phase.

    CIRCUIT CARD ASSEMBLY AND METHOD OF FABRICATING THE SAME
    5.
    发明申请
    CIRCUIT CARD ASSEMBLY AND METHOD OF FABRICATING THE SAME 有权
    电路卡组件及其制造方法

    公开(公告)号：US20150116940A1

    公开(公告)日：2015-04-30

    申请号：US14068697

    申请日：2013-10-31

    Applicant: General Electric Company

    Inventor： Joo Han Kim ,  Hendrik Pieter Jacobus de Bock ,  Jay Todd Labhart ,  Shakti Singh Chauhan ,  Graham Charles Kirk ,  Stuart Connolly

    IPC: H05K1/02

    CPC classification number: H05K1/0203 ,  H05K7/1461 ,  H05K7/20672 ,  Y10T29/49002

    Abstract: A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component.

    Abstract translation: 提供电路卡组件。 电路卡组件包括印刷电路板，安装在印刷电路板上的至少一个电子部件和耦合到印刷电路板的框架，使得电子部件设置在印刷电路板和框架之间。 电路卡组件还包括耦合到框架的传热装置。 传热装置具有至少部分地设置在框架和印刷电路板之间的热管。 电路卡组件还包括将热管朝向电子部件偏置的可枢转支架，以便于冷却电子部件。

    SYSTEM FOR THERMAL MANAGEMENT IN ELECTRICAL MACHINES
    7.
    发明申请
    SYSTEM FOR THERMAL MANAGEMENT IN ELECTRICAL MACHINES 审中-公开

    公开(公告)号：US20170141654A1

    公开(公告)日：2017-05-18

    申请号：US15070333

    申请日：2016-03-15

    Applicant: General Electric Company

    Inventor： Karthik Kumar Bodla ,  Joo Han Kim ,  Yogen Vishwas Utturkar

    IPC: H02K9/20

    CPC classification number: H02K9/20

    Abstract: A component for an electrical machine is disclosed. The component is a stator and/or a rotor. The component includes a core, a magnetic field-generating component, and an oscillating heat pipe assembly. The core includes a plurality of slots and the magnetic field-generating component is disposed in at least one slot of the plurality of slots. The oscillating heat pipe assembly is disposed in the core and the at least one slot of the plurality of slots. The oscillating heat pipe assembly is in contact with the core and the magnetic field-generating component. The oscillating heat pipe assembly includes a dielectric material, and where the oscillating heat pipe assembly has an in-plane thermal conductivity higher than a through-plane thermal conductivity.

    HEAT TRANSFER DEVICE HAVING 3-DIMENSIONAL PROJECTIONS AND AN ASSOCIATED METHOD OF FABRICATION
    9.
    发明申请
    HEAT TRANSFER DEVICE HAVING 3-DIMENSIONAL PROJECTIONS AND AN ASSOCIATED METHOD OF FABRICATION 审中-公开
    具有三维投影的热传递装置和相关的制造方法

    公开(公告)号：US20150090428A1

    公开(公告)日：2015-04-02

    申请号：US14041276

    申请日：2013-09-30

    Applicant: General Electric Company

    Inventor： Shakti Singh Chauhan ,  Joo Han Kim ,  William Harold King ,  Pramod Chamarthy ,  Tao Deng

    IPC: F28D15/04 ,  B21D53/02

    CPC classification number: F28D15/046 ,  Y10T29/49353

    Abstract: A heat transfer device filled with a working fluid, includes a casing and a wick disposed within the casing. The wick includes a first sintered layer, a second sintered layer, and a third sintered layer. The first sintered layer is disposed proximate to an inner surface of the casing and the second sintered layer is disposed on the first sintered layer. The second sintered layer includes a first set of 3-dimensional sintered projections and a second set of 3-dimensional sintered projections disposed along a portion of the wick. Further, the third sintered layer is disposed on at least a portion of the second sintered layer. The heat transfer device includes at least one first sintered particle of the first sintered layer, which is smaller in size than at least one second pore of the second sintered layer.

    Abstract translation: 填充有工作流体的传热装置包括壳体和设置在壳体内的芯。 芯包括第一烧结层，第二烧结层和第三烧结层。 第一烧结层设置在壳体的内表面附近，第二烧结层设置在第一烧结层上。 第二烧结层包括第一组三维烧结突起和沿着芯的一部分设置的第二组三维烧结突起。 此外，第三烧结层设置在第二烧结层的至少一部分上。 传热装置包括至少一个第一烧结层的第一烧结颗粒，其尺寸小于第二烧结层的至少一个第二孔。

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