公开(公告)号：US20220037201A1

公开(公告)日：2022-02-03

申请号：US16983380

申请日：2020-08-03

Applicant: General Electric Company

Inventor： Cheng-Po Chen ,  Reza Ghandi ,  David Richard Esler ,  David Mulford Shaddock ,  Emad Andarawis Andarawis ,  Liang Yin

IPC: H01L21/768 ,  H01L21/02 ,  H01L23/31 ,  H01L23/532 ,  H01L23/00

Abstract: An electrical component and method for manufacturing the electrical component with a substrate a conductor stack having multiple layers and including at least one electrically conductive path. The conductor stack mounted to the substrate with a dielectric passivation stack encasing at least a portion of the conductor stack.

公开(公告)号：US11482449B2

公开(公告)日：2022-10-25

申请号：US16983380

申请日：2020-08-03

Applicant: General Electric Company

Inventor： Cheng-Po Chen ,  Reza Ghandi ,  David Richard Esler ,  David Mulford Shaddock ,  Emad Andarawis Andarawis ,  Liang Yin

IPC: H01L23/48 ,  H01L21/768 ,  H01L21/02 ,  H01L23/31 ,  H01L23/00 ,  H01L23/532

Abstract: An electrical component and method for manufacturing the electrical component with a substrate a conductor stack having multiple layers and including at least one electrically conductive path. The conductor stack mounted to the substrate with a dielectric passivation stack encasing at least a portion of the conductor stack.

公开(公告)号：US12125745B2

公开(公告)日：2024-10-22

申请号：US17949325

申请日：2022-09-21

Applicant: General Electric Company

Inventor： Cheng-Po Chen ,  Reza Ghandi ,  David Richard Esler ,  David Mulford Shaddock ,  Emad Andarawis Andarawis ,  Liang Yin

IPC: H01L21/768 ,  H01L21/02 ,  H01L23/00 ,  H01L23/31 ,  H01L23/532

CPC classification number: H01L21/76832 ,  H01L21/02172 ,  H01L23/3192 ,  H01L23/53252 ,  H01L24/05 ,  H01L2224/05599 ,  H01L2924/1904

Abstract: An electrical component and method for manufacturing the electrical component with a substrate a conductor stack having multiple layers and including at least one electrically conductive path. The conductor stack mounted to the substrate with a dielectric passivation stack encasing at least a portion of the conductor stack.

公开(公告)号：US20230020337A1

公开(公告)日：2023-01-19

申请号：US17949325

申请日：2022-09-21

Applicant: General Electric Company

Inventor： Cheng-Po Chen ,  Reza Ghandi ,  David Richard Esler ,  David Mulford Shaddock ,  Emad Andarawis Andarawis ,  Liang Yin

IPC: H01L21/768 ,  H01L23/31 ,  H01L23/00 ,  H01L23/532 ,  H01L21/02

Abstract: An electrical component and method for manufacturing the electrical component with a substrate a conductor stack having multiple layers and including at least one electrically conductive path. The conductor stack mounted to the substrate with a dielectric passivation stack encasing at least a portion of the conductor stack.