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公开(公告)号：US4094640A
公开(公告)日：1978-06-13
申请号：US764541
申请日：1977-01-31
CPC分类号： G01N1/40 , G01N31/12 , G01N33/02 , G01N1/4044 , G01N33/12
摘要： A method for processing biomaterial, particularly meat, in which coarsely comminuted biomaterial with a moisture of up to 80% is dried in a processing vessel down to a residual moisture of about 5-10% and subsequently burned at a pressure of 20 to 40 bar in pure oxygen permitting metal traces, particularly mercury, cadmium, lead and arsenic, to be readily determined analytically in the process solution.
摘要翻译： 一种用于处理生物材料，特别是肉的方法，其中具有高达80％的水分的粗粉碎的生物材料在处理容器中干燥至约5-10％的残余水分，随后在20至40巴的压力下燃烧 在允许金属痕迹，特别是汞，镉，铅和砷的纯氧中，可以在工艺溶液中分析地容易地确定。
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公开(公告)号：US4948475A
公开(公告)日：1990-08-14
申请号：US250947
申请日：1988-09-29
申请人： Richard Doetzer , Georg Iwantscheff
发明人： Richard Doetzer , Georg Iwantscheff
摘要： The invention provides an ion barrier formed of a high-purity electroplated aluminum layer (purity >99.99%) which preferably has a thickness of 10 to 20 .mu.m for use on structural parts and shapes of metals and nonmetals, in particular on polyolefins. If desired, the electroplated aluminum layer can be compacted and/or anodically oxidized by post-treatment. The electroplated aluminum layer prevents the intrusion of metal and nonmetal ions into nonmetals, particularly plastic (for example polyolefins), and their penetration to metal surfaces. The deposition of the electroplated aluminum layer occurs from aprotic, oxygen-free and anhydrous electrolyte media of the general formula M.sup.I X.2AlR.sub.3.nLsm, wherein M.sup.I is an alkali metal ion or a quaternary onium ion, X is a halogen ion, preferably F.sup.- or Cl.sup.-, R is an alkyl radical, preferably CH.sub.3, C.sub.2 H.sub.5, C.sub.3 H.sub.7 or C.sub.4 H.sub.9, Lsm is an aromatic solvent molecule, preferably toluene, ethyl benzene, xylene or a mixture thereof, and n=0 to 12, at a bath temperature of 50.degree. to 110.degree. C. and a current density of 0.5 to 10 A/dm.sup. 2 under intensive bath movement. The media may possibly be in the presence of an aromatic solvent.
摘要翻译： 本发明提供了一种由高纯度电镀铝层（纯度> 99.99％）形成的离子屏障，优选厚度为10至20μm，用于金属和非金属，特别是聚烯烃的结构部件和形状。 如果需要，电镀铝层可以通过后处理压实和/或阳极氧化。 电镀铝层防止金属和非金属离子侵入非金属，特别是塑料（例如聚烯烃）中，并渗入金属表面。 电镀铝层的沉积是由通式MIX.2AlR3.nLsm的非质子，无氧和无水电解质介质发生的，其中MI是碱金属离子或季鎓离子，X是卤素离子，优选F- 或Cl-，R是烷基，优选CH 3，C 2 H 5，C 3 H 7或C 4 H 9，Lsm是芳族溶剂分子，优选甲苯，乙苯，二甲苯或其混合物，n = 0至12，浴浴温度 50℃至110℃，电流密度为0.5-10A / dm 2。 介质可能存在芳族溶剂。
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公开(公告)号：US4950551A
公开(公告)日：1990-08-21
申请号：US250946
申请日：1988-09-29
申请人： Richard Doetzer , Georg Iwantscheff
发明人： Richard Doetzer , Georg Iwantscheff
CPC分类号： C25D5/56 , C25D3/44 , F16L58/08 , G21C3/07 , G21Y2002/10 , G21Y2002/201 , G21Y2002/206 , G21Y2004/10 , G21Y2004/40 , Y02E30/40 , Y10T428/12556 , Y10T428/12597 , Y10T428/12736
摘要： The invention provides a high-purity electroaluminum layer having a purity of greater than 99.99% and, preferably, a thickness of 10 to 20 .mu.m which serves as a gas barrier layer, particularly for hydrogen, oxygen, tritium and water vapor, for metallic materials and nonmetallic materials such as glass, quartz, ceramic and cermets with an electroconductive surface as well as for conductive plastics. By post-treatment, the electroaluminum layer can be compacted. The electroaluminum layer is precipitated by electroplating from aprotic oxygen-free and anhydrous electrolyte media of the general formula M.sup.I X.2AlR.sub.3.nLsm, wherein M.sup.I is an alkali metal ion or a quaternary onium ion, X is a halogen ion, preferably F.sup.- or Cl.sup.-, R is an alkyl radical, preferably CH.sub.3, C.sub.2 H.sub.5, C.sub.3 H.sub.7 or C.sub.4 H.sub.9, Lsm is an aromatic solvent molecule, preferably toluene, ethyl benzene, xylene or a mixture thereof, and n=0 to 12, at a bath temperature of 50.degree. to 110.degree. C. and a current density of 0.5 to 10 A/dm.sup.2 under intensive bath agitation. Electroplating may be conducted in the presence of an aromatic solvent.
摘要翻译： 本发明提供纯度大于99.99％，优选厚度为10至20μm的高纯度电致铝层，其用作气体阻隔层，特别是用于氢，氧，氚和水蒸气的金属 材料和非金属材料如玻璃，石英，陶瓷和具有导电表面的金属陶瓷以及导电塑料。 通过后处理，电铝层可以被压实。 通过电解从非质子无氧和无水的通式MIX.2AlR3.nLsm的电解质介质沉淀电解铝层，其中MI是碱金属离子或季鎓离子，X是卤素离子，优选F-或Cl - ，R为烷基，优选为CH3，C2H5，C3H7或C4H9，Lsm为芳族溶剂分子，优选甲苯，乙苯，二甲苯或其混合物，n = 0至12，浴温为50℃ 至110℃，电流密度为0.5-10A / dm 2。 电镀可以在芳族溶剂的存在下进行。
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4.发明授权
公开(公告)号：US3972784A
公开(公告)日：1976-08-03
申请号：US419233
申请日：1973-11-27
申请人： Richard Dotzer , Georg Iwantscheff
发明人： Richard Dotzer , Georg Iwantscheff
摘要： A method for pretreating the surfaces of electroconductive materials such as metals which are to be electroplated in an aprotic oxygen- and water-free organoaluminum electrolytic media in which the last mechanical operation generating fresh and bright surfaces is performed under the exclusion of air, oxygen, and moisture using a protective gas or protective liquid and the part being treated maintained in such an environment until electroplated.
摘要翻译： 一种用于在非质子性无氧和无水的有机铝电解介质中预处理要被电镀的金属的导电材料的表面的方法，其中产生新鲜和明亮表面的最后机械操作是在排除空气，氧气， 和使用保护气体或保护液体的水分，并将被处理的部分保持在这样的环境中，直到电镀。
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