公开(公告)号：US20230276596A1

公开(公告)日：2023-08-31

申请号：US18164922

申请日：2023-02-06

Applicant: Getac Technology Corporation

Inventor： Jui-Lin YANG ,  Wan-Lin HSU ,  Hsin-Chih CHOU ,  Kun-Cheng LEE ,  Juei-Chi CHANG

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/16

CPC classification number: H05K7/20154 ,  G06F1/203 ,  G06F1/1632

Abstract: A heat dissipation module includes a diversion case and a fan. The diversion case includes an input section, an output section, and a connecting section that connects the input section and the output section, where an angle is defined between an extending direction of the input section and an extending direction of the output section, and an end of the input section away from the connecting section and an end of the output section away from the connecting section are respectively inclined relative to the connecting section. The fan is accommodated in the connecting section. An electronic device assembly includes an expansion component and the heat dissipation module.

公开(公告)号：US20230262896A1

公开(公告)日：2023-08-17

申请号：US18164901

申请日：2023-02-06

Applicant: Getac Technology Corporation

Inventor： Jui-Lin YANG ,  Wan-Lin HSU ,  Hsin-Chih CHOU ,  Kun-Cheng LEE ,  Juei-Chi CHANG

IPC: H05K1/14 ,  H05K5/06 ,  H05K3/36

CPC classification number: H05K1/141 ,  H05K1/144 ,  H05K5/065 ,  H05K3/368

Abstract: An electronic device assembly includes an expansion component and a host. The expansion component includes a first case, a first circuit board, and a first connector. The host includes a second case, a main circuit board, and a main connector. The first circuit board is arranged in the first case. The first connector is electrically connected to the first circuit board and is exposed from a top plate of the first case. The main circuit board is arranged in the second case. The main connector is electrically connected to the main circuit board and exposed from a second surface of the second case. When the host is assembled to the expansion component, the second surface of the second case covers the top plate of the first case, and the first connector is electrically connected to the main connector.

公开(公告)号：US20230259183A1

公开(公告)日：2023-08-17

申请号：US18150958

申请日：2023-01-06

Applicant: Getac Technology Corporation

Inventor： Wan-Lin HSU ,  Juei-Chi CHANG ,  Hung-Chan CHENG

IPC: G06F1/20 ,  H05K7/20 ,  H05K7/14

CPC classification number: G06F1/203 ,  H05K7/20172 ,  H05K7/20154 ,  H05K7/20436 ,  H05K7/205 ,  H05K7/1407

Abstract: An electronic device includes a housing and a first heat source, a second heat source, and a heat dissipation module that are disposed in the housing. The heat dissipation module includes a first fan, a second fan, a first heat conduction member, and a second heat conduction member. The first fan and the second fan are disposed on two opposite sides of the housing. One end of the first heat conduction member is disposed at the first fan, and the other end is located at a position on a side of an upper surface of the housing corresponding to the first heat source. One end of the second heat conduction member is disposed at the second fan, and the other end is located on a side of a lower surface of the housing and abuts against the second heat source.