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    High power LED package
    1.
    发明申请
    High power LED package 审中-公开
    大功率LED封装

    公开(公告)号：US20050274959A1

    公开(公告)日：2005-12-15

    申请号：US11147468

    申请日：2005-06-08

    申请人： Geun-Ho Kim ,  Chil-Keun Park ,  Ki-Chang Song

    发明人： Geun-Ho Kim ,  Chil-Keun Park ,  Ki-Chang Song

    IPC分类号： H01L33/46 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L27/15

    CPC分类号： H01L33/642 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed is a high power LED package, including an LED; a silicon submount to which the LED is flip chip bonded; a reflective film formed on the silicon submount and electrically connected to the LED to increase light emitting efficiency of the LED; electrical wires connected to the reflective film to connect the LED to an external circuit; an insulating body formed below the silicon submount; a heat sink formed below the insulating body; an insulating substrate formed on the heat sink; and metal lines formed on the insulating substrate and connected to the electrical wires. In the LED package, since the silicon submount having the LED flip chip bonded thereto is directly attached to the heat sink, heat generated upon operation of the LED can be effectively radiated. Also, the LED package has a simple structure, thus having drastically decreased manufacturing costs. The high power LED can be applied to backlight units of LCDs or general illumination fixtures, and as well, to backlight units of conventional PCS phones or LED packages for key pads, therefore increasing the light properties of the LED. In particular, the LED package has an array of two or more submounts each having an LED flip chip bonded thereto, and thus, it can be applied to a module of a backlight unit for LCDs, thus having remarkably reduced manufacturing costs.

    摘要翻译： 公开了一种大功率LED封装，包括LED; 一个硅衬底，LED被倒装在芯片上; 反射膜，形成在硅基座上并电连接到LED以提高LED的发光效率; 连接到反射膜的电线将LED连接到外部电路; 形成在硅基座下方的绝缘体; 在绝缘体下形成的散热器; 形成在散热器上的绝缘基板; 以及形成在绝缘基板上并连接到电线的金属线。 在LED封装中，由于具有与其结合的LED倒装芯片的硅基座直接连接到散热器，所以可以有效地辐射LED工作时产生的热量。 此外，LED封装具有简单的结构，从而大大降低了制造成本。 大功率LED可以应用于LCD或一般照明灯具的背光单元，以及用于键盘的常规PCS电话或LED封装的背光单元，因此增加了LED的光特性。 特别地，LED封装具有两个或更多个具有与其结合的LED倒装芯片的基座的阵列，因此可以应用于用于LCD的背光单元的模块，从而显着降低制造成本。

    Method of fabricating X-ray mask
    2.
    发明授权
    Method of fabricating X-ray mask 失效
    制作X光掩模的方法

    公开(公告)号：US5824440A

    公开(公告)日：1998-10-20

    申请号：US877657

    申请日：1997-06-17

    申请人： Ki-Chang Song ,  Don-Hee Lee ,  Young-Sam Jeon ,  Chil-Keun Park

    发明人： Ki-Chang Song ,  Don-Hee Lee ,  Young-Sam Jeon ,  Chil-Keun Park

    IPC分类号： G03F1/22 ,  H01L21/027 ,  G03F9/00

    CPC分类号： G03F1/22

    摘要： A method of fabricating an X-ray mask includes the steps of forming a membrane on a substrate, forming a first material on the membrane, implanting predetermined ions into the first material, planarizing the membrane by removing a part of the first material and membrane, forming an absorber on the membrane planarized and depositing a second material on the absorber, implanting predetermined ions into the second material, planarizing the absorber by removing a part of the second material and membrane, and patterning the absorber planarized to have a predetermined shape.

    摘要翻译： 制造X射线掩模的方法包括以下步骤：在衬底上形成膜，在膜上形成第一材料，将预定离子注入第一材料中，通过去除第一材料和膜的一部分来平坦化膜， 在所述膜上形成平坦化的吸收体并在所述吸收体上沉积第二材料，将预定离子注入到所述第二材料中，通过去除所述第二材料和膜的一部分来平坦化所述吸收体，以及使所述吸收体图形化以具有预定形状。

    X-ray mask and its fabrication method
    3.
    发明授权
    X-ray mask and its fabrication method 失效
    X射线掩模及其制造方法

    公开(公告)号：US5970114A

    公开(公告)日：1999-10-19

    申请号：US919812

    申请日：1997-08-29

    申请人： Don-Hee Lee ,  Ki-Chang Song ,  Young-Sam Jeon ,  Chil-Keun Park

    发明人： Don-Hee Lee ,  Ki-Chang Song ,  Young-Sam Jeon ,  Chil-Keun Park

    IPC分类号： G03F1/22 ,  H01L21/027 ,  G21K5/00

    CPC分类号： G03F1/22

    摘要： Disclosed are X-ray masks exhibiting improved stability and reliability of the X-ray masks, and methods of making these masks. The X-ray masks include a membrane, an X-ray absorber pattern on the membrane, which is formed on a top side of a substrate, or an oxide layer between the membrane and the X-ray absorber pattern.

    摘要翻译： 公开了显示出提高X射线掩模的稳定性和可靠性的X射线掩模以及制造这些掩模的方法。 X射线掩模包括膜，膜上的X射线吸收体图案，其形成在衬底的顶侧，或膜与X射线吸收体图案之间的氧化物层。