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    LIGHT EMITTING DEVICE AND FABRICATION METHOD THEREOF AND LIGHT EMITTING SYSTEM USING THE SAME
    3.
    发明申请
    LIGHT EMITTING DEVICE AND FABRICATION METHOD THEREOF AND LIGHT EMITTING SYSTEM USING THE SAME 有权
    发光装置及其制造方法及使用该发光装置的发光系统

    公开(公告)号：US20080290820A1

    公开(公告)日：2008-11-27

    申请号：US12165282

    申请日：2008-06-30

    申请人： Geun-Ho Kim ,  Ki-Chang Song

    发明人： Geun-Ho Kim ,  Ki-Chang Song

    IPC分类号： G09G3/32 ,  H01L33/00

    CPC分类号： H01L33/62 ,  H01L25/167 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/4823 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/3011 ,  H01S5/02212 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/06825 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting device comprises a light emitting element having a first electrode and a second electrode, and a semiconductor member having a cavity in a principal surface thereof, inside which the light emitting element is mounted, and electrically connected to the light emitting element, wherein the semiconductor member is constructed as a voltage regulating diode for stabilizing a voltage supplied from the exterior. As a result, the light emitting element can be protected from a static electricity or a surge voltage flowed therein from the exterior, the entire size of the system can be remarkably reduced so as to simplify a structure thereof, and heat generated from the system can be effectively discharged to the exterior. In addition, by providing a reflection portion in the cavity, light emitted from the light emitting element can be efficiently condensed.

    摘要翻译： 发光装置包括具有第一电极和第二电极的发光元件，以及在其主表面上具有空腔的半导体部件，其内安装有发光元件，并且电连接到发光元件，其中 半导体部件被构造为用于稳定从外部供应的电压的电压调节二极管。 结果，可以防止发光元件免受静电或从外部流入的浪涌电压，可以显着降低系统的整体尺寸，从而简化其结构，并且从系统产生的热量可以 有效地排放到外部。 另外，通过在空腔内设置反射部，能够有效地冷凝从发光元件射出的光。

    High power LED package
    4.
    发明申请
    High power LED package 审中-公开
    大功率LED封装

    公开(公告)号：US20050274959A1

    公开(公告)日：2005-12-15

    申请号：US11147468

    申请日：2005-06-08

    申请人： Geun-Ho Kim ,  Chil-Keun Park ,  Ki-Chang Song

    发明人： Geun-Ho Kim ,  Chil-Keun Park ,  Ki-Chang Song

    IPC分类号： H01L33/46 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L27/15

    CPC分类号： H01L33/642 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Disclosed is a high power LED package, including an LED; a silicon submount to which the LED is flip chip bonded; a reflective film formed on the silicon submount and electrically connected to the LED to increase light emitting efficiency of the LED; electrical wires connected to the reflective film to connect the LED to an external circuit; an insulating body formed below the silicon submount; a heat sink formed below the insulating body; an insulating substrate formed on the heat sink; and metal lines formed on the insulating substrate and connected to the electrical wires. In the LED package, since the silicon submount having the LED flip chip bonded thereto is directly attached to the heat sink, heat generated upon operation of the LED can be effectively radiated. Also, the LED package has a simple structure, thus having drastically decreased manufacturing costs. The high power LED can be applied to backlight units of LCDs or general illumination fixtures, and as well, to backlight units of conventional PCS phones or LED packages for key pads, therefore increasing the light properties of the LED. In particular, the LED package has an array of two or more submounts each having an LED flip chip bonded thereto, and thus, it can be applied to a module of a backlight unit for LCDs, thus having remarkably reduced manufacturing costs.

    摘要翻译： 公开了一种大功率LED封装，包括LED; 一个硅衬底，LED被倒装在芯片上; 反射膜，形成在硅基座上并电连接到LED以提高LED的发光效率; 连接到反射膜的电线将LED连接到外部电路; 形成在硅基座下方的绝缘体; 在绝缘体下形成的散热器; 形成在散热器上的绝缘基板; 以及形成在绝缘基板上并连接到电线的金属线。 在LED封装中，由于具有与其结合的LED倒装芯片的硅基座直接连接到散热器，所以可以有效地辐射LED工作时产生的热量。 此外，LED封装具有简单的结构，从而大大降低了制造成本。 大功率LED可以应用于LCD或一般照明灯具的背光单元，以及用于键盘的常规PCS电话或LED封装的背光单元，因此增加了LED的光特性。 特别地，LED封装具有两个或更多个具有与其结合的LED倒装芯片的基座的阵列，因此可以应用于用于LCD的背光单元的模块，从而显着降低制造成本。

    Light emitting device and fabrication method thereof and light emitting system using the same
    5.
    发明申请
    Light emitting device and fabrication method thereof and light emitting system using the same 有权
    发光元件及其制造方法以及使用其的发光系统

    公开(公告)号：US20050230692A1

    公开(公告)日：2005-10-20

    申请号：US11106188

    申请日：2005-04-13

    申请人： Geun-Ho Kim ,  Ki-Chang Song

    发明人： Geun-Ho Kim ,  Ki-Chang Song

    IPC分类号： H01L25/16 ,  H01L33/62 ,  H01L33/64 ,  H01S5/02 ,  H01S5/022 ,  H01L27/15 ,  H01L21/00

    CPC分类号： H01L33/62 ,  H01L25/167 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/4823 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/3011 ,  H01S5/02212 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/06825 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting device comprises a light emitting element having a first electrode and a second electrode, and a semiconductor member having a cavity in a principal surface thereof, inside which the light emitting element is mounted, and electrically connected to the light emitting element, wherein the semiconductor member is constructed as a voltage regulating diode for stabilizing a voltage supplied from the exterior. As a result, the light emitting element can be protected from a static electricity or a surge voltage flowed therein from the exterior, the entire size of the system can be remarkably reduced so as to simplify a structure thereof, and heat generated from the system can be effectively discharged to the exterior. In addition, by providing a reflection portion in the cavity, light emitted from the light emitting element can be efficiently condensed.

    摘要翻译： 发光装置包括具有第一电极和第二电极的发光元件，以及在其主表面上具有空腔的半导体部件，其内安装有发光元件，并且电连接到发光元件，其中 半导体部件被构造为用于稳定从外部供应的电压的电压调节二极管。 结果，可以防止发光元件免受静电或从外部流入的浪涌电压，可以显着降低系统的整体尺寸，从而简化其结构，并且从系统产生的热量可以 有效地排放到外部。 另外，通过在空腔内设置反射部，能够有效地冷凝从发光元件射出的光。

    Light emitting device and manufacturing method thereof
    6.
    发明申请
    Light emitting device and manufacturing method thereof 审中-公开
    发光元件及其制造方法

    公开(公告)号：US20050145862A1

    公开(公告)日：2005-07-07

    申请号：US11023471

    申请日：2004-12-29

    申请人： Geun-Ho Kim ,  Ki-Chang Song

    发明人： Geun-Ho Kim ,  Ki-Chang Song

    IPC分类号： H01L33/12 ,  H01L33/14 ,  H01L33/42 ,  H01L33/00

    CPC分类号： H01L33/24

    摘要： Disclosed are a light emitting device and a manufacturing method thereof. A trench portion is formed on a substrate of a light emitting device, and a buffer layer, an n-contact layer, and an active layer are sequentially deposited on the trench portion thereby to increase a light emitting area of the active layer. According to this, a light emitting efficiency is increased, and light of a high brightness can be obtained with a substrate of the same size thereby to reduce a production cost.

    摘要翻译： 公开了一种发光器件及其制造方法。 沟槽部分形成在发光器件的衬底上，缓冲层，n接触层和有源层依次沉积在沟槽部分上，从而增加有源层的发光面积。 据此，发光效率提高，并且可以用相同尺寸的基板获得高亮度的光，从而降低制造成本。

    Light source apparatus
    7.
    发明授权
    Light source apparatus 有权
    光源装置

    公开(公告)号：US07411225B2

    公开(公告)日：2008-08-12

    申请号：US11086186

    申请日：2005-03-21

    申请人： Geun-Ho Kim ,  Ki-Chang Song ,  Sun-Ho Kim

    发明人： Geun-Ho Kim ,  Ki-Chang Song ,  Sun-Ho Kim

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/64 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12041 ,  H05K1/053 ,  H05K1/183 ,  H01L2224/0401

    摘要： A light source apparatus and a fabrication method thereof can prevent light interference between light emitting devices adjacent to each other by forming a groove in a sub-mount and bonding a light emitting device to the groove, enhance heat radiating effect as well as luminous efficiency by collecting light emitted from the side of the light emitting device toward the front of the light source apparatus, reduce the process time and costs and increase reliability by directly connecting the sub-mount to the stem by the first electrode and the second electrode which pass through holes of the sub-mount, and extend a life span of the light emitting device because of the enhanced heat radiating effect.

    摘要翻译： 光源装置及其制造方法可以通过在副安装座中形成凹槽并将发光器件接合到凹槽中来防止彼此相邻的发光器件之间的光干涉，通过以下方式提高散热效果以及发光效率 从发光装置侧发射的光朝向光源装置的前方收集，通过第一电极和第二电极直接连接到底座上，从而减少了处理时间和成本并提高了可靠性 并且由于散热效果的提高，延长了发光装置的使用寿命。

    Light source module with two wavelength
    8.
    发明授权
    Light source module with two wavelength 有权
    光源模块有两个波长

    公开(公告)号：US06347103B1

    公开(公告)日：2002-02-12

    申请号：US09400291

    申请日：1999-09-21

    申请人： Ki Chang Song ,  Young Joo Yee ,  Jong Uk Bu

    发明人： Ki Chang Song ,  Young Joo Yee ,  Jong Uk Bu

    IPC分类号： H01S204

    CPC分类号： H01S5/4087 ,  H01S5/02212 ,  H01S5/02252 ,  H01S5/02288 ,  H01S5/02292

    摘要： Light source module with two wavelengths including a first and a second laser diodes each for emitting a laser beam with a wavelength different from each other, and a submount formed between the first and second laser diodes having a vertical mirror surface vertical to bonding surfaces of the first and second laser diodes for reflecting laser beams from the first and second laser diodes in a same direction.

    摘要翻译： 具有两个波长的光源模块，包括用于发射彼此不同波长的激光束的第一和第二激光二极管，以及在第一和第二激光二极管之间形成的垂直于垂直于 第一和第二激光二极管，用于沿相同方向反射来自第一和第二激光二极管的激光束。