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公开(公告)号：US20050124092A1
公开(公告)日：2005-06-09
申请号：US10485419
申请日：2003-05-28
申请人： Gian-Luca Bona , Bruno Michel , Hugo Rothuizen , Peter Vettiger , Han Biebuyck
发明人： Gian-Luca Bona , Bruno Michel , Hugo Rothuizen , Peter Vettiger , Han Biebuyck
CPC分类号： B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F9/00 , Y10S438/975
摘要： The invention relates to a method for creating a pattern on a substrate comprising a first alignment structure, using an elastomeric stamp comprising a patterning structure and a second alignment structure. The method comprises a moving step for moving the elastomeric stamp towards the substrate, and a deformation step for deforming the patterning structure with a tensile or compressive force generated by cooperation of the first alignment structure and the second alignment structure.
摘要翻译： 本发明涉及一种用于在包括第一对准结构的基板上形成图案的方法，该方法使用包括图案化结构和第二对准结构的弹性印模。 该方法包括用于将弹性体印模移动到基板的移动步骤，以及用于通过第一对准结构和第二对准结构的协作产生的拉伸或压缩力使图案化结构变形的变形步骤。
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公开(公告)号：US07235464B2
公开(公告)日：2007-06-26
申请号：US10485419
申请日：2003-05-28
CPC分类号： B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F9/00 , Y10S438/975
摘要： The invention relates to a method for creating a pattern on a substrate comprising a first alignment structure, using an elastomeric stamp comprising a patterning structure and a second alignment structure. The method comprises a moving step for moving the elastomeric stamp towards the substrate, and a deformation step for deforming the patterning structure with a tensile or compressive force generated by cooperation of the first alignment structure and the second alignment structure.
摘要翻译： 本发明涉及一种用于在包括第一对准结构的基板上形成图案的方法，该方法使用包括图案化结构和第二对准结构的弹性印模。 该方法包括用于将弹性体印模移动到基板的移动步骤，以及用于通过第一对准结构和第二对准结构的协作产生的拉伸或压缩力使图案化结构变形的变形步骤。
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公开(公告)号：US06628452B2
公开(公告)日：2003-09-30
申请号：US09946992
申请日：2001-09-05
IPC分类号： G02F129
CPC分类号： G02B6/3514 , G02B6/352 , G02B6/3528 , G02B6/3538 , G02B6/3546 , G02B6/357 , G02B6/358 , G02B6/3596
摘要： An optical device comprises a substrate having a plane surface. An optical path is disposed on the substrate and extends in a plane parallel to the surface of the substrate. A recess intercepts the optical path. An optical element is provided for modifying light incident thereon. The optical element is moveable within the recess between a first position in which the optical element is located in the path and a second position in which optical element is remote from the path. A cantilever suspends the optical element for movement within the recess between the second and first positions in a direction normal to the surface of the substrate.
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公开(公告)号：US07713789B2
公开(公告)日：2010-05-11
申请号：US11852317
申请日：2007-09-09
IPC分类号： H01L21/00
CPC分类号： H01L21/4882 , H01L21/4871 , H01L21/4875 , H01L23/3677 , H01L2224/16 , H01L2224/73253 , H01L2924/09701 , H01L2924/1461 , H01L2924/00
摘要： Provides semiconductor devices and method for fabricating devices having a high thermal dissipation efficiency. An example device comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.
摘要翻译： 提供用于制造具有高散热效率的器件的半导体器件和方法。 示例性装置包括通过焊接附接到半导体器件的表面的导热结构。 导热结构基本上由导热材料形成，并且包括独立的翅片，螺柱或框架的阵列或连接的翅片的格栅。 制造这种半导体器件的方法包括在载体上形成导热结构，并通过焊接将形成在载体上的导热结构附着在半导体器件的表面上。
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公开(公告)号：US20100148358A1
公开(公告)日：2010-06-17
申请号：US12709674
申请日：2010-02-22
IPC分类号： H01L23/473 , H01L23/36
CPC分类号： H01L21/4882 , H01L21/4871 , H01L21/4875 , H01L23/3677 , H01L2224/16 , H01L2224/73253 , H01L2924/09701 , H01L2924/1461 , H01L2924/00
摘要： A semiconductor device having a higher thermal dissipation efficiency includes a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.
摘要翻译： 具有较高散热效率的半导体器件包括通过焊接附接到半导体器件的表面的导热结构。 导热结构基本上由导热材料形成，并且包括独立的翅片，螺柱或框架的阵列或连接的翅片的格栅。 制造这种半导体器件的方法包括在载体上形成导热结构，并通过焊接将形成在载体上的导热结构附着在半导体器件的表面上。
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公开(公告)号：US07928565B2
公开(公告)日：2011-04-19
申请号：US12709674
申请日：2010-02-22
IPC分类号： H01L23/34
CPC分类号： H01L21/4882 , H01L21/4871 , H01L21/4875 , H01L23/3677 , H01L2224/16 , H01L2224/73253 , H01L2924/09701 , H01L2924/1461 , H01L2924/00
摘要： A semiconductor device having a higher thermal dissipation efficiency includes a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.
摘要翻译： 具有较高散热效率的半导体器件包括通过焊接附接到半导体器件的表面的导热结构。 导热结构基本上由导热材料形成，并且包括独立的翅片，螺柱或框架的阵列或连接的翅片的格栅。 制造这种半导体器件的方法包括在载体上形成导热结构，并通过焊接将形成在载体上的导热结构附着在半导体器件的表面上。
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公开(公告)号：US07271034B2
公开(公告)日：2007-09-18
申请号：US11148737
申请日：2005-06-09
IPC分类号： H01L21/00
CPC分类号： H01L21/4882 , H01L21/4871 , H01L21/4875 , H01L23/3677 , H01L2224/16 , H01L2224/73253 , H01L2924/09701 , H01L2924/1461 , H01L2924/00
摘要： Provides semiconductor devices and method for fabricating devices having a high thermal dissipation efficiency. An example device comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.
摘要翻译： 提供用于制造具有高散热效率的器件的半导体器件和方法。 示例性装置包括通过焊接附接到半导体器件的表面的导热结构。 导热结构基本上由导热材料形成，并且包括独立的翅片，螺柱或框架的阵列或连接的翅片的格栅。 制造这种半导体器件的方法包括在载体上形成导热结构，并通过焊接将形成在载体上的导热结构附着在半导体器件的表面上。
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公开(公告)号：US20080017978A1
公开(公告)日：2008-01-24
申请号：US11852317
申请日：2007-09-09
IPC分类号： H01L23/34
CPC分类号： H01L21/4882 , H01L21/4871 , H01L21/4875 , H01L23/3677 , H01L2224/16 , H01L2224/73253 , H01L2924/09701 , H01L2924/1461 , H01L2924/00
摘要： A semiconductor device having a higher thermal dissipation efficiency comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.
摘要翻译： 具有更高散热效率的半导体器件包括通过焊接附接到半导体器件的表面的导热结构。 导热结构基本上由导热材料形成，并且包括独立的翅片，螺柱或框架的阵列或连接的翅片的格栅。 制造这种半导体器件的方法包括在载体上形成导热结构，并通过焊接将形成在载体上的导热结构附着在半导体器件的表面上。
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公开(公告)号：US20050277280A1
公开(公告)日：2005-12-15
申请号：US11148737
申请日：2005-06-09
IPC分类号： H01L21/44 , H01L21/48 , H01L23/367
CPC分类号： H01L21/4882 , H01L21/4871 , H01L21/4875 , H01L23/3677 , H01L2224/16 , H01L2224/73253 , H01L2924/09701 , H01L2924/1461 , H01L2924/00
摘要： Provides semiconductor devices and method for fabricating devices having a high thermal dissipation efficiency. An example device comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.
摘要翻译： 提供用于制造具有高散热效率的器件的半导体器件和方法。 示例性装置包括通过焊接附接到半导体器件的表面的导热结构。 导热结构基本上由导热材料形成，并且包括独立的翅片，螺柱或框架的阵列或连接的翅片的格栅。 制造这种半导体器件的方法包括在载体上形成导热结构，并通过焊接将形成在载体上的导热结构附着在半导体器件的表面上。
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公开(公告)号：US20130133433A1
公开(公告)日：2013-05-30
申请号：US13699667
申请日：2011-05-09
IPC分类号： G01L1/18
CPC分类号： G01L1/18 , G01N29/022 , G01N2291/02466
摘要： Deflection of a free end of one plate-like member, that is caused by uniform stress, is transmitted to the other plate-like member by moving a free end of the other plate-like member. According to this configuration, the uniform stress applied to the one plate-like member is converted into stress induced by a point force in the other plate-like member, and then, the induced stress is concentrated on a fixed end side narrow portion in which a piezoresistor is provided. Thus, a novel structure for a piezoresistive surface stress sensor having high sensitivity to uniform stress applied to the surface of the sensor is provided.
摘要翻译： 由均匀的应力引起的一个板状构件的自由端的偏移通过移动另一个板状构件的自由端而被传递到另一个板状构件。 根据该结构，施加到一个板状构件的均匀的应力被转换为由另一个板状构件中的点力引起的应力，然后，感应应力集中在固定端侧窄部， 提供一个压敏电阻。 因此，提供了对施加到传感器的表面的均匀应力具有高灵敏度的压阻表面应力传感器的新型结构。
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