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公开(公告)号：US20050277280A1
公开(公告)日：2005-12-15
申请号：US11148737
申请日：2005-06-09
IPC分类号： H01L21/44 , H01L21/48 , H01L23/367
CPC分类号： H01L21/4882 , H01L21/4871 , H01L21/4875 , H01L23/3677 , H01L2224/16 , H01L2224/73253 , H01L2924/09701 , H01L2924/1461 , H01L2924/00
摘要： Provides semiconductor devices and method for fabricating devices having a high thermal dissipation efficiency. An example device comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.
摘要翻译： 提供用于制造具有高散热效率的器件的半导体器件和方法。 示例性装置包括通过焊接附接到半导体器件的表面的导热结构。 导热结构基本上由导热材料形成，并且包括独立的翅片，螺柱或框架的阵列或连接的翅片的格栅。 制造这种半导体器件的方法包括在载体上形成导热结构，并通过焊接将形成在载体上的导热结构附着在半导体器件的表面上。
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公开(公告)号：US20080017978A1
公开(公告)日：2008-01-24
申请号：US11852317
申请日：2007-09-09
IPC分类号： H01L23/34
CPC分类号： H01L21/4882 , H01L21/4871 , H01L21/4875 , H01L23/3677 , H01L2224/16 , H01L2224/73253 , H01L2924/09701 , H01L2924/1461 , H01L2924/00
摘要： A semiconductor device having a higher thermal dissipation efficiency comprises a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.
摘要翻译： 具有更高散热效率的半导体器件包括通过焊接附接到半导体器件的表面的导热结构。 导热结构基本上由导热材料形成，并且包括独立的翅片，螺柱或框架的阵列或连接的翅片的格栅。 制造这种半导体器件的方法包括在载体上形成导热结构，并通过焊接将形成在载体上的导热结构附着在半导体器件的表面上。
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公开(公告)号：US09064080B2
公开(公告)日：2015-06-23
申请号：US13010184
申请日：2011-01-20
申请人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
发明人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
CPC分类号： H01L23/367 , G02B6/12 , G02B6/122 , G02B6/4269 , G02B6/4272 , G02B6/43 , G02B2006/12147 , G06F17/5022 , G06F17/5068 , G06F17/5077 , H01L2224/16225 , H01L2924/15311
摘要： An integrated circuitry structure includes at least first and second regions. An optical layer includes optical waveguides. A heat-conductive material transfers heat from at least the second region through the optical layer to a heat sink.
摘要翻译： 集成电路结构至少包括第一和第二区域。 光学层包括光波导。 导热材料将热量从至少第二区域传递通过光学层到散热器。
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公开(公告)号：US20060286712A1
公开(公告)日：2006-12-21
申请号：US11437084
申请日：2006-05-19
CPC分类号： H01L23/3733 , H01L23/3737 , H01L23/42 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2224/73253 , H01L2224/83365 , H01L2224/83385 , H01L2224/8385 , H01L2924/01057
摘要： An interface is formed by pressing a patterned first surface and a second surface together, with a particle-loaded interface material in between. The first surface is fabricated with a pattern of channels designed to redistribute the velocity gradients that occur in the interface material during interface formation in order to control the arrangement, orientation and concentration of particles at the end of the interface formation. The concept finds application in thermal interfaces and controlled placement of nano and micro particles and biological molecules.
摘要翻译： 通过将图案化的第一表面和第二表面压在一起形成界面，其中颗粒加载的界面材料在其间。 第一表面被制造成具有通道图案，其设计用于在界面形成期间重新分布出现在界面材料中的速度梯度，以便控制在界面形成结束时颗粒的排列，取向和浓度。 该概念适用于热界面和受控放置的纳米微粒和生物分子。
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5.发明授权Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly 有权组装包括通过晶片通孔的多个通孔，冷却组件的方法和制造组件的方法公开(公告)号：US08487427B2
公开(公告)日：2013-07-16
申请号：US12544344
申请日：2009-08-20
IPC分类号： H01L23/24
CPC分类号： H01L23/49827 , H01L23/46 , H01L23/473 , H01L25/0657 , H01L2224/16 , H01L2225/06541 , H01L2225/06589 , H01L2924/15159 , H01L2924/3011
摘要： An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board.
摘要翻译： 一种组件，包括集成电路的芯片，包括集成电路的壳体，并且具有形成在芯片的一侧的上部和形成在芯片的另一侧的下部，用于电连接的多个贯通晶片通孔（TWV） 芯片的集成电路和壳体的集成电路，以及连接到壳体的卡，用于将壳体电连接到系统板。
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公开(公告)号：US20120148187A1
公开(公告)日：2012-06-14
申请号：US13312327
申请日：2011-12-06
申请人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
发明人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
IPC分类号： H01L23/538 , H01L21/50 , G02B6/12
CPC分类号： G02B6/43 , H01L23/3128 , H01L23/481 , H01L23/5226 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/14 , H01L24/16 , H01L25/0657 , H01L2224/03464 , H01L2224/0401 , H01L2224/05009 , H01L2224/051 , H01L2224/05147 , H01L2224/05184 , H01L2224/05655 , H01L2224/131 , H01L2224/14183 , H01L2224/16145 , H01L2224/16195 , H01L2224/16225 , H01L2225/06513 , H01L2225/06517 , H01L2225/06534 , H01L2225/06551 , H01L2225/06565 , H01L2924/14 , H01L2924/1533 , H01L2924/014
摘要： An integrated circuit coupling device includes an integrated circuit package with N integrated circuit layers (L1-LN) arranged as a 3D stack; and a data transmission medium with n data transmission layers (l1-ln), wherein n≧1 and N≧2, and wherein the N integrated circuit layers are electrically connectable to the n data transmission layers.
摘要翻译： 集成电路耦合装置包括具有以3D叠层排列的N个集成电路层（L1-LN）的集成电路封装; 以及具有n个数据传输层（111-1）的数据传输介质，其中n≥1且N≥2，并且其中所述N个集成电路层可电连接到所述n个数据传输层。
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公开(公告)号：US20090308578A1
公开(公告)日：2009-12-17
申请号：US12544344
申请日：2009-08-20
IPC分类号： F28D15/00
CPC分类号： H01L23/49827 , H01L23/46 , H01L23/473 , H01L25/0657 , H01L2224/16 , H01L2225/06541 , H01L2225/06589 , H01L2924/15159 , H01L2924/3011
摘要： An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board.
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公开(公告)号：US20050263879A1
公开(公告)日：2005-12-01
申请号：US11141932
申请日：2005-06-01
申请人： Bruno Michel , Thomas Brunschwiler , Hugo Rothuizen , Urs Kloter
发明人： Bruno Michel , Thomas Brunschwiler , Hugo Rothuizen , Urs Kloter
CPC分类号： H01L23/42 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： The present invention provides a thermal interface with a first and a second face that are in contact to each other by a thermal conducting material. A first face includes grooves that are at least partly filled with the thermal conducting material, wherein at least two types of grooves are arranged, namely first grooves having a larger width than second grooves. The first face comprises an array with protrusions that are confined by the second grooves, the array being divided by the first grooves into sub-arrays.
摘要翻译： 本发明提供一种通过导热材料彼此接触的第一和第二面的热界面。 第一面包括至少部分地填充有导热材料的凹槽，其中布置至少两种类型的凹槽，即具有比第二凹槽宽的宽度的第一凹槽。 第一面包括具有被第二凹槽限制的突起的阵列，该阵列被第一凹槽划分为子阵列。
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9.发明授权Integrated circuit package connected to an optical data transmission medium using a coolant 有权使用冷却剂连接到光学数据传输介质的集成电路封装公开(公告)号：US08989532B2
公开(公告)日：2015-03-24
申请号：US13312583
申请日：2011-12-06
申请人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
发明人： Harry Barowski , Thomas Brunschwiler , Roger F. Dangel , Hubert Harrer , Andreas Huber , Norbert M. Meier , Bruno Michel , Tim Niggemeier , Stephan Paredes , Jochen Supper , Jonas R. Weiss
CPC分类号： G02B6/43 , G02B6/12002 , G02B6/122
摘要： An integrated circuit coupling device includes an integrated circuit package; and an optical data transmission medium connected to the integrated circuit package, and comprising a movable coolant, adapted to remove heat from the integrated circuit package, in operation.
摘要翻译： 集成电路耦合器件包括集成电路封装; 以及连接到集成电路封装的光学数据传输介质，并且包括适于在操作中从集成电路封装件移除热量的可移动冷却剂。
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10.发明授权Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly 有权组装包括通过晶片通孔的多个通孔，冷却组件的方法和制造组件的方法公开(公告)号：US08629554B2
公开(公告)日：2014-01-14
申请号：US12544365
申请日：2009-08-20
IPC分类号： H01L23/34
CPC分类号： H01L23/49827 , H01L23/46 , H01L23/473 , H01L25/0657 , H01L2224/16 , H01L2225/06541 , H01L2225/06589 , H01L2924/15159 , H01L2924/3011
摘要： An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board.
摘要翻译： 一种组件，包括集成电路的芯片，包括集成电路的壳体，并且具有形成在芯片的一侧的上部和形成在芯片的另一侧的下部，用于电连接的多个贯通晶片通孔（TWV） 芯片的集成电路和壳体的集成电路，以及连接到壳体的卡，用于将壳体电连接到系统板。
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