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公开(公告)号：US20180192539A1
公开(公告)日：2018-07-05
申请号：US15395756
申请日：2016-12-30
Applicant: Google Inc.
Inventor： Varun Sakalkar , Jyoti Sastry , James Kennedy , Eduardo Lao , Christopher Gregory Malone , Pascal Kam
CPC classification number: H05K7/1492 , G06F1/26 , H05K7/1498 , H05K7/20745
Abstract: A data center power system includes an enclosure that defines an inner volume; a first direct current (DC) power bus mounted in the inner volume and extending externally to electrically couple to a source of main power; a second DC power bus mounted in the inner volume and extending externally to electrically couple to the source of main power; a plurality of transfer switches mounted in the inner volume, each transfer switch electrically coupled to one of the first DC power bus or the second DC power bus; and a plurality of DC power conductors that are electrically coupled to a pair of transfer switches that includes one transfer switch electrically coupled to the first DC power bus and one transfer switch electrically coupled to the second DC power bus; each DC power conductor configured to electrically couple to a data center rack that supports a plurality of electronic devices.
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公开(公告)号：US20170071077A1
公开(公告)日：2017-03-09
申请号：US15357948
申请日：2016-11-21
Applicant: Google Inc.
Inventor： Andrew B. Carlson , Christopher Gregory Malone , Jimmy Clidaras
CPC classification number: H05K7/20827 , F24F1/0007 , F24F5/0035 , F24F2203/104 , F28D5/00 , H05K7/20136 , H05K7/20345 , H05K7/20836
Abstract: A data center cooling system includes an evaporative cooling system. The evaporative cooling system includes fans configured to circulate outside air at ambient conditions through an entry zone of a data center, and atomizers positioned upstream of the entry zone configured to spray atomized water into the circulating outside air. The atomized water evaporates in an evaporation zone and cools the outside air to produce cooled air, which is directed through racks of computers positioned downstream of the evaporation zone.
Abstract translation: 数据中心冷却系统包括蒸发冷却系统。 蒸发冷却系统包括被配置为在环境条件下通过数据中心的进入区循环外部空气的风扇，以及位于进入区域上游的雾化器，其配置成将雾化水喷射到循环的外部空气中。 雾化水在蒸发区中蒸发并冷却外部空气以产生冷却的空气，冷却的空气被引导通过定位在蒸发区下游的计算机的机架。
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公开(公告)号：US20180191401A1
公开(公告)日：2018-07-05
申请号：US15395361
申请日：2016-12-30
Applicant: Google Inc.
Inventor： Varun Sakalkar , Jyoti Sastry , James Kennedy , Eduardo Lao , Christopher Gregory Malone , Pascal Kam
IPC: H04B3/54
Abstract: A data center power connector includes a conduit that defines an inner volume; and at least one conductor that extends through the inner volume of the conduit and is configured to carry electrical power from a source of main power of a data center to at least one electronic device mounted in a rack deployed in a human-occupiable workspace of the data center and data between the at least one electronic device and a data center control system.
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Patent Agency Ranking
公开(公告)号：US20170243806A1
公开(公告)日：2017-08-24
申请号：US15048140
申请日：2016-02-19
Applicant: Google Inc.
IPC: H01L23/473 , H01L25/18 , H01L23/373 , H01L23/498 , H01L23/04 , H01L23/367
CPC classification number: H01L23/473 , H01L23/04 , H01L23/3675 , H01L23/3732 , H01L23/3736 , H01L23/3737 , H01L23/44 , H01L23/498 , H01L25/0652 , H01L25/18
Abstract: A semiconductor package includes a substrate, an integrated circuit disposed on the substrate, a memory support disposed on the integrated circuit, stacked memory disposed on the memory support and in communication with the integrated circuit, and a lid connected to the substrate. The integrated circuit has a low power region and a high power region. The memory support is disposed on the low power region of the integrated circuit and is configured to allow a flow of fluid therethrough to conduct heat away from the low power region of the integrated circuit. The lid defines a first port, a second port, and a lid volume fluidly connecting the first port and the second port. The lid volume is configured to house the integrated circuit, the memory support, and the stacked memory, while directing the flow of fluid to flow over the integrated circuit, the memory support, and the stacked memory.
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公开(公告)号：US09167724B1
公开(公告)日：2015-10-20
申请号：US14595050
申请日：2015-01-12
Applicant: Google Inc.
Inventor： Ankit Somani , Christopher Gregory Malone
CPC classification number: H05K7/20709 , E04B5/48 , E04B9/02 , E04D13/17 , E04H14/00 , F24F7/00 , F24F7/02 , F24F2007/003 , H05K7/1497
Abstract: A multi-floor data center, comprising in one implementation, a plurality of floors; a first set of server racks disposed about a first vertical center axis on each floor, the first set of server racks formed in a substantially closed shape, with a substantially vertical open center comprising a first airflow plenum at least for air flow; a first opening in each of the floors, with the first opening aligned with the substantially vertical first airflow plenum on it respective floor, wherein the substantially vertical first airflow plenums on the floors are aligned for communication through the first openings in the floors; outer wall; a roof with a roof opening therein.
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公开(公告)号：US10032695B2
公开(公告)日：2018-07-24
申请号：US15048140
申请日：2016-02-19
Applicant: Google Inc.
IPC: H01L23/473 , H01L23/04 , H01L23/367 , H01L23/373 , H01L23/498 , H01L25/18 , H01L23/44 , H01L25/065
Abstract: A semiconductor package includes a substrate, an integrated circuit disposed on the substrate, a memory support disposed on the integrated circuit, stacked memory disposed on the memory support and in communication with the integrated circuit, and a lid connected to the substrate. The integrated circuit has a low power region and a high power region. The memory support is disposed on the low power region of the integrated circuit and is configured to allow a flow of fluid therethrough to conduct heat away from the low power region of the integrated circuit. The lid defines a first port, a second port, and a lid volume fluidly connecting the first port and the second port. The lid volume is configured to house the integrated circuit, the memory support, and the stacked memory, while directing the flow of fluid to flow over the integrated circuit, the memory support, and the stacked memory.
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公开(公告)号：US20180192538A1
公开(公告)日：2018-07-05
申请号：US15395323
申请日：2016-12-30
Applicant: Google Inc.
Inventor： Varun Sakalkar , Jyoti Sastry , James Kennedy , Eduardo Lao , Christopher Gregory Malone , Pascal Kam
CPC classification number: H05K7/1492 , G06F1/26 , H05K7/1497
Abstract: A data center power system includes an electrical power conductor that includes a live conductor surface and is configured to carry direct current (DC) power from a power source through a human-occupiable workspace of a data center; a grounded conductor positioned in the human-occupiable workspace apart from the electrical power conductor; a first electrical connector configured to mount to a data center rack that supports a plurality of electronic devices, the first electrical connector moveable to electrically contact the live conductor surface of the electrical power conductor; and a second electrical conductor positioned on the rack and configured to electrically contact the grounded conductor.
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公开(公告)号：US20180175618A1
公开(公告)日：2018-06-21
申请号：US15385365
申请日：2016-12-20
Applicant: Google Inc.
Inventor： Eduardo Lao , Jyoti Sastry , James Kennedy , Christopher Gregory Malone , Varun Sakalkar
Abstract: This specification describes a power distribution system comprising a first section that receives power from a first source. The power received from the first source is adjusted by a first rectifier unit coupled to a first power bus of the first section. The system also comprises a second section that is separate from the first section and that receives power from a second source. The power received from the second source is adjusted by a second rectifier unit coupled to a second power bus of the second distribution section. The system includes a swing rectifier connected to the first section and connected to the second section. The swing rectifier is configured to provide power to the first power bus and to the second power bus and to dynamically adjust the power capacity of the first section that is available to computing loads, and to dynamically adjust the power capacity of the second section that is available to computing loads.
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