公开(公告)号：US20070052094A1

公开(公告)日：2007-03-08

申请号：US11431084

申请日：2006-05-10

申请人： Goon-Woo Kim ,  Man-Hee Han ,  Jae-Hong Kim ,  Heui-Seog Kim ,  Sang-Jun Kim ,  Wha-Su Sin

发明人： Goon-Woo Kim ,  Man-Hee Han ,  Jae-Hong Kim ,  Heui-Seog Kim ,  Sang-Jun Kim ,  Wha-Su Sin

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/0508 ,  H01L2224/051 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/13024 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/3011 ,  H01L2924/00014

摘要： A semiconductor chip package may include one or more conductive patterns provided on a front surface of a wafer. An encapsulation layer may cover at least the front surface of the wafer. Chip plugs may be electrically connected to the conductive patterns, and may be embedded in a rear surface of the wafer. External connection terminals may be electrically connected to the chip plugs, and may be provided on the rear surface of the wafer.

摘要翻译： 半导体芯片封装可以包括设置在晶片的前表面上的一个或多个导电图案。 封装层可以至少覆盖晶片的前表面。 芯片插头可以电连接到导电图案，并且可以嵌入在晶片的后表面中。 外部连接端子可以电连接到芯片插头，并且可以设置在晶片的后表面上。

公开(公告)号：US08193619B2

公开(公告)日：2012-06-05

申请号：US12659472

申请日：2010-03-10

申请人： Geun-Woo Kim ,  Ho-Geon Song ,  Man-Hee Han

发明人： Geun-Woo Kim ,  Ho-Geon Song ,  Man-Hee Han

IPC分类号： H01L23/495

CPC分类号： H01L23/49548 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provided is a lead frame that may include a frame, a lead structure, and a dam bar. The frame may include a plurality of openings configured to receive semiconductor chips. The lead structure may be in the openings. The lead structure may also include inner leads and outer leads. The inner leads may be configured to electrically connect to the semiconductor chips and the outer leads may extend from the inner leads. In example embodiments, the lead structure may extend in a first direction. The dam bar may be arranged between the inner leads and the outer leads. In accordance with example embodiments, the dam bar may extend along a second direction which is substantially perpendicular to the first direction. In example embodiments, the dam bar may have a first strength-reinforcing portion extending along the second direction. Also provided is a semiconductor package having the lead frame.

摘要翻译： 提供了一种引线框架，其可以包括框架，引线结构和坝条。 框架可以包括被配置为接收半导体芯片的多个开口。 引线结构可以在开口中。 引线结构还可以包括内引线和外引线。 内引线可以被配置为电连接到半导体芯片，并且外引线可以从内引线延伸。 在示例性实施例中，引线结构可沿第一方向延伸。 阻挡杆可以布置在内引线和外引线之间。 根据示例性实施例，阻挡杆可以沿着基本上垂直于第一方向的第二方向延伸。 在示例性实施例中，阻挡杆可以具有沿第二方向延伸的第一强度增强部分。 还提供了具有引线框架的半导体封装。

公开(公告)号：US20100237478A1

公开(公告)日：2010-09-23

申请号：US12659472

申请日：2010-03-10

申请人： Geun-Woo Kim ,  Ho-Geon Song ,  Man-Hee Han

发明人： Geun-Woo Kim ,  Ho-Geon Song ,  Man-Hee Han

IPC分类号： H01L23/52 ,  H01L23/495

CPC分类号： H01L23/49548 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provided is a lead frame that may include a frame, a lead structure, and a dam bar. The frame may include a plurality of openings configured to receive semiconductor chips. The lead structure may be in the openings. The lead structure may also include inner leads and outer leads. The inner leads may be configured to electrically connect to the semiconductor chips and the outer leads may extend from the inner leads. In example embodiments, the lead structure may extend in a first direction. The dam bar may be arranged between the inner leads and the outer leads. In accordance with example embodiments, the dam bar may extend along a second direction which is substantially perpendicular to the first direction. In example embodiments, the dam bar may have a first strength-reinforcing portion extending along the second direction. Also provided is a semiconductor package having the lead frame.

摘要翻译： 提供了一种引线框架，其可以包括框架，引线结构和坝条。 框架可以包括被配置为接收半导体芯片的多个开口。 引线结构可以在开口中。 引线结构还可以包括内引线和外引线。 内引线可以被配置为电连接到半导体芯片，并且外引线可以从内引线延伸。 在示例性实施例中，引线结构可沿第一方向延伸。 阻挡杆可以布置在内引线和外引线之间。 根据示例性实施例，阻挡杆可以沿着基本上垂直于第一方向的第二方向延伸。 在示例性实施例中，阻挡杆可以具有沿第二方向延伸的第一强度增强部分。 还提供了具有引线框架的半导体封装。