Group III-Nitride Semiconductor Schottky Diode and Its Fabrication Method
    1.
    发明申请
    Group III-Nitride Semiconductor Schottky Diode and Its Fabrication Method 审中-公开
    第III族 - 氮化物半导体肖特基二极管及其制备方法

    公开(公告)号:US20110006307A1

    公开(公告)日:2011-01-13

    申请号:US12828447

    申请日:2010-07-01

    摘要: A group III-nitride semiconductor Schottky diode comprises a conducting substrate having a first surface, a stack of multiple layers including a buffer layer and a semiconductor layer sequentially formed on the first surface, wherein the semiconductor layer comprises a group III nitride compound, a first electrode on the semiconductor layer, and a second electrode formed in contact with the first surface at a position adjacent to the stack of multiple layers. In other embodiments, the application also describes a method of fabricating the group III-nitride semiconductor Schottky diode.

    摘要翻译: III族氮化物半导体肖特基二极管包括具有第一表面的导电衬底,包括缓冲层的多层叠层和顺序地形成在第一表面上的半导体层,其中半导体层包括III族氮化物化合物,第一 电极,以及在与多层叠层相邻的位置形成为与第一表面接触的第二电极。 在其它实施例中,本申请还描述了制造III族氮化物半导体肖特基二极管的方法。

    LIGHT EMITTING DIODE STRUCTURE AND METHOD FOR FABRICATING THE SAME
    2.
    发明申请
    LIGHT EMITTING DIODE STRUCTURE AND METHOD FOR FABRICATING THE SAME 审中-公开
    发光二极管结构及其制造方法

    公开(公告)号:US20100140653A1

    公开(公告)日:2010-06-10

    申请号:US12709105

    申请日:2010-02-19

    IPC分类号: H01L33/00

    CPC分类号: H01L33/22

    摘要: The present invention discloses a light emitting diode structure and a method for fabricating the same. In the present invention, a substrate is placed in a solution to form a chemical reaction layer on carved regions; the carved region is selectively etched to form a plurality of concave zones and form a plurality of convex zones; a semiconductor layer structure is epitaxially grown on the element regions and carved regions of the substrate; the semiconductor layer structure on the element regions is fabricated into a LED element with a photolithographic process.

    摘要翻译: 本发明公开了一种发光二极管结构及其制造方法。 在本发明中,将基板放置在溶液中以在雕刻区域上形成化学反应层; 选择性地蚀刻雕刻区域以形成多个凹陷区域并形成多个凸区域; 在衬底的元件区域和雕刻区域上外延生长半导体层结构; 通过光刻工艺将元件区域上的半导体层结构制成LED元件。