公开(公告)号：US20100295017A1

公开(公告)日：2010-11-25

申请号：US12851607

申请日：2010-08-06

Applicant: Hung-Cheng LIN ,  Chia-Ming Lee ,  Jen-Inn Chyi

Inventor： Hung-Cheng LIN ,  Chia-Ming Lee ,  Jen-Inn Chyi

IPC: H01L33/04 ,  H01L33/02 ,  H01L33/30

CPC classification number: H01L33/10 ,  H01L33/20

Abstract: The present invention discloses a light emitting diode (LED) element and a method for fabricating the same, which can promote light extraction efficiency of LED, wherein a substrate is etched to obtain basins with inclined natural crystal planes, and an LED epitaxial structure is selectively formed inside the basin. Thereby, an LED element having several inclines is obtained. Via the inclines, the probability of total internal reflection is reduced, and the light extraction efficiency of LED is promoted.

Abstract translation: 本发明公开了一种发光二极管（LED）元件及其制造方法，其可以提高LED的光提取效率，其中蚀刻基板以获得具有倾斜的自然晶体面的池，并且LED外延结构选择性地 形成在盆地内。 由此，得到具有多个倾斜的LED元件。 通过倾斜，全内反射的概率降低，LED的光提取效率得到提升。

公开(公告)号：US07679919B2

公开(公告)日：2010-03-16

申请号：US12216017

申请日：2008-06-27

Applicant: Chia-Ming Lee

Inventor： Chia-Ming Lee

IPC: H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC classification number: H01L23/467 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat sink and an electronic apparatus using the same are disclosed. The heat sink comprises a fin structure and a fastening assembly; the fastening assembly comprises an adjustable positioning member, an elastic member, and a hooking member, the elastic member being disposed between the hooking member and the fin structure such that the adjustable positioning member combines the hooking member, the elastic member, and the fin structure; wherein the hooking member may secure the heat sink onto an electronic component, and the adjustable positioning member may be used to adjust the tightness between the heat sink and the electronic component.

Abstract translation: 公开了一种散热器和使用其的电子设备。 散热器包括翅片结构和紧固组件; 所述紧固组件包括可调定位构件，弹性构件和钩构件，所述弹性构件设置在所述钩构件和所述翅片结构之间，使得所述可调定位构件组合所述钩构件，所述弹性构件和所述翅片结构 ; 其中所述钩挂构件可将所述散热器固定在电子部件上，并且所述可调定位构件可用于调节所述散热器和所述电子部件之间的紧密度。

公开(公告)号：US07580086B2

公开(公告)日：2009-08-25

申请号：US11160595

申请日：2005-06-30

Applicant: Chia-Ming Lee ,  Chun-Han Liu

Inventor： Chia-Ming Lee ,  Chun-Han Liu

IPC: G02F1/1333 ,  G02F1/1345

CPC classification number: H05K1/0259 ,  G02F1/13452 ,  G02F2202/22 ,  H05K1/0215 ,  H05K3/28 ,  H05K3/361 ,  H05K2201/09781 ,  H05K2201/0989

Abstract: A display module is provided. The display module comprises a display panel, a printed circuit board, and a flexible packaging unit. The display panel has a plurality of first signal pads and at least one first dummy pad. The printed circuit board has a plurality of second signal pads and at least one second dummy pad. In addition, the flexible packaging unit comprises a flexible carrier and a chip, wherein the flexible carrier has a plurality of signal lines and at least one electrostatic discharge protective line. The electrostatic discharge protective line is connected between the first dummy pad and the second dummy pad. Furthermore, the electrostatic discharge protective line has an electricity conducting pad, which is exposed on the surface of the flexible carrier. The chip is disposed on the flexible carrier and connected to the display panel and the printed circuit board through the signal lines.

Abstract translation: 提供了显示模块。 显示模块包括显示面板，印刷电路板和柔性包装单元。 显示面板具有多个第一信号焊盘和至少一个第一虚拟焊盘。 印刷电路板具有多个第二信号焊盘和至少一个第二虚拟焊盘。 此外，柔性包装单元包括柔性载体和芯片，其中柔性载体具有多个信号线和至少一个静电放电保护线。 静电放电保护线连接在第一虚拟焊盘和第二虚拟焊盘之间。 此外，静电放电保护线具有在柔性载体的表面上露出的导电焊盘。 芯片设置在柔性载体上，并通过信号线连接到显示面板和印刷电路板。

公开(公告)号：US20090159910A1

公开(公告)日：2009-06-25

申请号：US11963558

申请日：2007-12-21

Applicant: Hung-Cheng LIN ,  Chia-Ming Lee ,  Jen-Inn Chyi

Inventor： Hung-Cheng LIN ,  Chia-Ming Lee ,  Jen-Inn Chyi

IPC: H01L21/306 ,  H01L33/00

CPC classification number: H01L33/22

Abstract: The present invention discloses a light emitting diode structure and a method for fabricating the same. In the present invention, a substrate is placed in a solution to form a chemical reaction layer on carved regions; the carved region is selectively etched to form a plurality of concave zones and form a plurality of convex zones; a semiconductor layer structure is epitaxially grown on the element regions and carved regions of the substrate; the semiconductor layer structure on the element regions is fabricated into a LED element with a photolithographic process.

Abstract translation: 本发明公开了一种发光二极管结构及其制造方法。 在本发明中，将基板放置在溶液中以在雕刻区域上形成化学反应层; 选择性地蚀刻雕刻区域以形成多个凹陷区域并形成多个凸区域; 在衬底的元件区域和雕刻区域上外延生长半导体层结构; 通过光刻工艺将元件区域上的半导体层结构制成LED元件。

公开(公告)号：US07462505B2

公开(公告)日：2008-12-09

申请号：US11063479

申请日：2005-02-23

Applicant: Chia Ming Lee ,  Tsung Liang Cheng ,  I Ling Chen ,  Yu Chuan Liu ,  Jen Inn Chyi

Inventor： Chia Ming Lee ,  Tsung Liang Cheng ,  I Ling Chen ,  Yu Chuan Liu ,  Jen Inn Chyi

IPC: H01L21/00

CPC classification number: C30B29/406 ,  C30B25/02 ,  H01L21/0237 ,  H01L21/0242 ,  H01L21/02458 ,  H01L21/02502 ,  H01L21/0254 ,  H01L21/0262 ,  H01L21/02661

Abstract: In a method of forming a crystalline GaN-based material, a first nucleation layer is formed on a substrate at a first temperature, followed with forming a second nucleation layer at a second temperature different from the first temperature. The first and second nucleation layers are composed of AlxInyGa(1-x-y)N. Subsequently, a layer of a crystalline GaN-based compound is epitaxy grown on the second nucleation layer.

Abstract translation: 在形成结晶GaN基材料的方法中，在第一温度下在基板上形成第一成核层，随后在与第一温度不同的第二温度下形成第二成核层。 第一和第二成核层由Al x In y Ga（1-x-y）N组成。 随后，在第二成核层上生长一层结晶的GaN基化合物外延生长。

公开(公告)号：US07227192B2

公开(公告)日：2007-06-05

申请号：US10815091

申请日：2004-03-31

Applicant: Yu-Chuan Liu ,  Chia-Ming Lee ,  I-Ling Chen ,  Jen-Inn Chyi

Inventor： Yu-Chuan Liu ,  Chia-Ming Lee ,  I-Ling Chen ,  Jen-Inn Chyi

IPC: H01L29/22

CPC classification number: H01L33/507 ,  H01L25/0756 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device comprises a light-emitting unit including a plurality of first connecting pads, a base substrate including a plurality of second connecting pads, and a plurality of conductive bumps that connect the first connecting pads of the light-emitting unit to the second connecting pads of the base substrate. In the manufacturing process, a reflow process is performed to bond the conductive bumps to the first and second connecting pads. The light-emitting unit is configured to emit a first light radiation upon the application of an electric current flow, and the base substrate is configured to emit a second light radiation when stimulated by the first light radiation.

Abstract translation: 发光装置包括：发光单元，包括多个第一连接焊盘;基板，包括多个第二连接焊盘;以及多个导电凸块，其将所述发光单元的第一连接焊盘连接到 基底基板的第二连接焊盘。 在制造过程中，执行回流处理以将导电凸块接合到第一和第二连接焊盘。 发光单元被配置为在施加电流时发射第一光辐射，并且基底基板被配置为当被第一光辐射刺激时发射第二光辐射。

公开(公告)号：US07166483B2

公开(公告)日：2007-01-23

申请号：US10870347

申请日：2004-06-17

Applicant: Yu-Chuan Liu ,  Chia-Ming Lee ,  I-Ling Chen ,  Jen-Inn Chyi

Inventor： Yu-Chuan Liu ,  Chia-Ming Lee ,  I-Ling Chen ,  Jen-Inn Chyi

IPC: H01L21/00

CPC classification number: H01L33/38 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A light-emitting device comprises a multi-layer structure including one or more active layer configured to irradiate light in response to the application of an electric signal, a transparent passivation layer laid over an outmost surface of the multi-layer stack, a reflector layer laid over the passivation layer, and a plurality of electrode pads coupled with the multi-layer structure. In a manufacture process of the light-emitting device, the reflector layer and the passivation layer are patterned to form at least one opening exposing an area of the multi-layer structure. One electrode pad is formed through the opening of the reflector layer and the passivation layer to connect with the multi-layer structure.

Abstract translation: 发光装置包括多层结构，其包括响应于电信号的施加而被配置为照射光的一个或多个有源层，布置在多层堆叠的最外表面上的透明钝化层，反射层 铺设在钝化层上，以及与多层结构耦合的多个电极焊盘。 在发光器件的制造工艺中，对反射层和钝化层进行构图以形成暴露多层结构区域的至少一个开口。 一个电极焊盘通过反射层的开口和钝化层形成，以与多层结构连接。

公开(公告)号：US20060152299A1

公开(公告)日：2006-07-13

申请号：US11166098

申请日：2005-06-27

Applicant: Cheng-Tao Lee ,  Fu-Tsun Sun ,  Chia-Ming Lee ,  Yi-De Chen

Inventor： Cheng-Tao Lee ,  Fu-Tsun Sun ,  Chia-Ming Lee ,  Yi-De Chen

IPC: H01P5/02

CPC classification number: H05K1/0253 ,  H05K1/0237 ,  H05K1/117 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09481 ,  H05K2201/09627 ,  H05K2201/0969 ,  H05K2201/09845

Abstract: A multi-layered printed circuit board (PCB) for connection with an external connector. The external connector has a signal pin and an outer conductor. The printed circuit board includes a first conductive reference plane, a signal trace, a second conductive reference plane, a characteristic impedance member, and a third conductive reference plane. The characteristic impedance member is provided for connecting the signal trace and the signal pin. The third conductive reference plane is provided for electrical connection with the outer conductor. There are vertical separations inserted between the first conductive reference plane, the second conductive reference plane, and the third conductive reference plane within the printed circuit.

Abstract translation: 用于与外部连接器连接的多层印刷电路板（PCB）。 外部连接器具有信号引脚和外部导体。 印刷电路板包括第一导电参考平面，信号迹线，第二导电参考平面，特征阻抗构件和第三导电参考平面。 提供特征阻抗构件用于连接信号迹线和信号引脚。 第三导电参考平面被提供用于与外部导体电连接。 在印刷电路内的第一导电参考平面，第二导电参考平面和第三导电参考平面之间插入垂直分隔。

公开(公告)号：US06720570B2

公开(公告)日：2004-04-13

申请号：US10123287

申请日：2002-04-17

Applicant: Chia-Ming Lee ,  Jen-Inn Chyi

Inventor： Chia-Ming Lee ,  Jen-Inn Chyi

IPC: H01L2906

CPC classification number: H01L33/025 ,  H01L33/0016 ,  H01L33/02 ,  H01L33/14

Abstract: According to a preferred embodiment of the present invention, there is provided a novel and optimal semiconductor light emitting device comprising a substrate, an n layer disposed co-extensively on the substrate, an n++ layer disposed non-extensively and flush on one side of the n layer. Furthermore, a p+ layer is disposed co-extensively on the n++ layer of the LED according to the invention, with a p layer further disposed co-extensively on the p+ layer. A p cladding layer is disposed co-extensively on the p layer. A multiple quantum well (MQW) layer is disposed co-extensively on the p cladding layer, and an n cladding layer is further disposed co-extensively on the MQW layer. A second n layer is disposed co-extensively on the n cladding layer. An n+ layer is disposed co-extensively on the second n layer of the LED according to the invention. After partially etching the device, an n electrode is formed opposite n++ layer non-extensively on the surface of n layer, and a second n electrode is formed non-extensively (without etching) upon the n+ layer.

Abstract translation: 根据本发明的优选实施例，提供了一种新颖且最佳的半导体发光器件，其包括基底，共同设置在基底上的n层，n + +层，​​其非常广泛地并且在 n层。 此外，根据本发明，p +层共同设置在LED的n ++层上，其中p层进一步同时布置在p +层上。 p包层共同设置在p层上。 多量子阱（MQW）层共同设置在p包覆层上，并且n包覆层进一步同时布置在MQW层上。 第n层被共同设置在n包层上。 根据本发明，n + +层共同地布置在LED的第二n层上。 在部分蚀刻该器件之后，在n层的表面上非广泛地形成n电极，n +电极在n +层上非广泛地（无蚀刻）形成。

公开(公告)号：US08101447B2

公开(公告)日：2012-01-24

申请号：US11961478

申请日：2007-12-20

Applicant: Hung-Cheng Lin ,  Chia-Ming Lee ,  Jen-Inn Chyi

Inventor： Hung-Cheng Lin ,  Chia-Ming Lee ,  Jen-Inn Chyi

IPC: H01L33/20

CPC classification number: H01L33/10 ,  H01L33/20

Abstract: The present invention discloses a light emitting diode (LED) element and a method for fabricating the same, which can promote light extraction efficiency of LED, wherein a substrate is etched to obtain basins with inclined natural crystal planes, and an LED epitaxial structure is selectively formed inside the basin. Thereby, an LED element having several inclines is obtained. Via the inclines, the probability of total internal reflection is reduced, and the light extraction efficiency of LED is promoted.

Abstract translation: 本发明公开了一种发光二极管（LED）元件及其制造方法，其可以提高LED的光提取效率，其中蚀刻基板以获得具有倾斜的自然晶体面的池，并且LED外延结构选择性地 形成在盆地内。 由此，得到具有多个倾斜的LED元件。 通过倾斜，全内反射的概率降低，LED的光提取效率得到提升。