FLUID INJECTION APPARATUS AND FABRICATION METHOD THEREOF
    1.
    发明申请
    FLUID INJECTION APPARATUS AND FABRICATION METHOD THEREOF 审中-公开
    流体注射装置及其制造方法

    公开(公告)号:US20070227892A1

    公开(公告)日:2007-10-04

    申请号:US11696094

    申请日:2007-04-03

    IPC分类号: C25D5/02

    摘要: A method for forming a fluid injection apparatus is disclosed. A patterned sacrificial layer is formed overlying a substrate. A electroplate seed layer is formed on the patterned sacrificial layer. A structural layer is formed overlying the electroplate seed layer and the substrate. The structural layer is patterned to form a nozzle. The electroplate seed layer in the nozzle is removed. The sacrificial layer is removed to form a fluid chamber. A protective layer is formed to selectively cover the structural layer and the electroplate seed layer.

    摘要翻译: 公开了一种用于形成流体注射装置的方法。 在衬底上形成图案化的牺牲层。 在图案化的牺牲层上形成电镀种子层。 在电镀种子层和基底上形成结构层。 图案化结构层以形成喷嘴。 去除喷嘴中的电镀种子层。 去除牺牲层以形成流体室。 形成保护层以选择性地覆盖结构层和电镀种子层。

    THIN FILM TRANSISTOR AND FABRICATING METHOD THEREOF
    5.
    发明申请
    THIN FILM TRANSISTOR AND FABRICATING METHOD THEREOF 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US20110215324A1

    公开(公告)日:2011-09-08

    申请号:US12779955

    申请日:2010-05-14

    IPC分类号: H01L29/786 H01L21/336

    CPC分类号: H01L29/786

    摘要: A thin film transistor (TFT) and a fabricating method thereof are provided. The TFT includes a channel layer, an ohmic contact layer, a dielectric layer, a source, a drain, a gate, and a gate insulating layer. The channel layer has an upper surface and a sidewall. The ohmic contact layer is disposed on a portion of the upper surface of the channel layer. The dielectric layer is disposed on the sidewall of the channel layer, and does not overlap with the ohmic contact layer. The source and the drain are disposed on portions of the ohmic contact layer and the dielectric layer. A portion of dielectric layer is not covered by the source or the drain. The gate is above or below the channel layer. The gate insulating layer is disposed between the gate and the channel layer.

    摘要翻译: 提供薄膜晶体管(TFT)及其制造方法。 TFT包括沟道层,欧姆接触层,电介质层,源极,漏极,栅极和栅极绝缘层。 沟道层具有上表面和侧壁。 欧姆接触层设置在沟道层的上表面的一部分上。 电介质层设置在沟道层的侧壁上,并且不与欧姆接触层重叠。 源极和漏极设置在欧姆接触层和电介质层的部分上。 电介质层的一部分不被源极或漏极覆盖。 门在通道层的上方或下方。 栅极绝缘层设置在栅极和沟道层之间。

    THIN FILM TRANSISTOR
    6.
    发明申请
    THIN FILM TRANSISTOR 审中-公开
    薄膜晶体管

    公开(公告)号:US20120241743A1

    公开(公告)日:2012-09-27

    申请号:US13489458

    申请日:2012-06-06

    IPC分类号: H01L29/786

    CPC分类号: H01L29/786

    摘要: A thin film transistor (TFT) and a fabricating method thereof are provided. The TFT includes a channel layer, an ohmic contact layer, a dielectric layer, a source, a drain, a gate, and a gate insulating layer. The channel layer has an upper surface and a sidewall. The ohmic contact layer is disposed on a portion of the upper surface of the channel layer. The dielectric layer is disposed on the sidewall of the channel layer, and does not overlap with the ohmic contact layer. The source and the drain are disposed on portions of the ohmic contact layer and the dielectric layer. A portion of dielectric layer is not covered by the source or the drain. The gate is above or below the channel layer. The gate insulating layer is disposed between the gate and the channel layer.

    摘要翻译: 提供薄膜晶体管(TFT)及其制造方法。 TFT包括沟道层,欧姆接触层,电介质层,源极,漏极,栅极和栅极绝缘层。 沟道层具有上表面和侧壁。 欧姆接触层设置在沟道层的上表面的一部分上。 电介质层设置在沟道层的侧壁上,并且不与欧姆接触层重叠。 源极和漏极设置在欧姆接触层和电介质层的部分上。 电介质层的一部分不被源极或漏极覆盖。 门在通道层的上方或下方。 栅极绝缘层设置在栅极和沟道层之间。

    Fabricating method of a thin film transistor having a dielectric layer for inhibiting leakage current
    7.
    发明授权
    Fabricating method of a thin film transistor having a dielectric layer for inhibiting leakage current 有权
    具有用于抑制漏电流的电介质层的薄膜晶体管的制造方法

    公开(公告)号:US08232147B2

    公开(公告)日:2012-07-31

    申请号:US12779955

    申请日:2010-05-14

    IPC分类号: H01L29/786

    CPC分类号: H01L29/786

    摘要: A thin film transistor (TFT) and a fabricating method thereof are provided. The TFT includes a channel layer, an ohmic contact layer, a dielectric layer, a source, a drain, a gate, and a gate insulating layer. The channel layer has an upper surface and a sidewall. The ohmic contact layer is disposed on a portion of the upper surface of the channel layer. The dielectric layer is disposed on the sidewall of the channel layer, and does not overlap with the ohmic contact layer. The source and the drain are disposed on portions of the ohmic contact layer and the dielectric layer. A portion of dielectric layer is not covered by the source or the drain. The gate is above or below the channel layer. The gate insulating layer is disposed between the gate and the channel layer.

    摘要翻译: 提供薄膜晶体管(TFT)及其制造方法。 TFT包括沟道层,欧姆接触层,电介质层,源极,漏极,栅极和栅极绝缘层。 沟道层具有上表面和侧壁。 欧姆接触层设置在沟道层的上表面的一部分上。 电介质层设置在沟道层的侧壁上,并且不与欧姆接触层重叠。 源极和漏极设置在欧姆接触层和电介质层的部分上。 电介质层的一部分不被源极或漏极覆盖。 门在通道层的上方或下方。 栅极绝缘层设置在栅极和沟道层之间。