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    Electronic component having a resonator and fabrication process
    2.
    发明授权
    Electronic component having a resonator and fabrication process 有权
    具有谐振器和制造工艺的电子部件

    公开(公告)号：US07180224B2

    公开(公告)日：2007-02-20

    申请号：US10815472

    申请日：2004-04-01

    申请人： Guillaume Bouche ,  Nick Smears ,  Pascal Ancey ,  Gregory Caruyer

    发明人： Guillaume Bouche ,  Nick Smears ,  Pascal Ancey ,  Gregory Caruyer

    IPC分类号： H01L41/08

    CPC分类号： H03H9/586 ,  H03H2003/0428 ,  H03H2003/0435 ,  H03H2003/0471

    摘要： An electronic component (1) includes a substrate (2) and at least two piezoelectric resonators (3, 4) each having an active element (6, 9), a lower electrode (5, 8) and an upper electrode (7, 10). The lower electrode (5) of the first resonator (3) is made of a material that is different from that of the lower electrode (8) of the second resonator (4) such that the resonators exhibit different resonance frequencies.

    摘要翻译： 电子部件（1）包括基板（2）和至少两个各自具有有源元件（6,9），下电极（5,8）和上电极（7,10）的压电谐振器（3,4） ）。 第一谐振器（3）的下电极（5）由不同于第二谐振器（4）的下电极（8）的材料制成，使得谐振器表现出不同的谐振频率。

    Support and decoupling structure for an acoustic resonator, acoustic resonator and corresponding integrated circuit
    3.
    发明授权
    Support and decoupling structure for an acoustic resonator, acoustic resonator and corresponding integrated circuit 有权
    声谐振器，声谐振器和相应的集成电路的支持和去耦结构

    公开(公告)号：US07391143B2

    公开(公告)日：2008-06-24

    申请号：US11731942

    申请日：2007-04-02

    申请人： Guillaume Bouche ,  Gregory Caruyer ,  Pascal Ancey

    发明人： Guillaume Bouche ,  Gregory Caruyer ,  Pascal Ancey

    IPC分类号： H01L41/083

    CPC分类号： H03H9/175

    摘要： An acoustic resonator assembly includes a layer of high-acoustic-impedance material and a layer of low-acoustic-impedance material made of a low-electrical-permittivity material. This assembly may support the resonator over an interconnect layer or act as a decoupling assembly between two active elements of the resonator. The assembly may alternatively include three low-acoustic impedance layers. Alternatively, the assembly may include three acoustic impedance layers wherein two of the layers are low acoustic impedance layers and the third layer has a higher acoustic impedance than the first two or alternatively is a high-acoustic impedance layer.

    摘要翻译： 声谐振器组件包括高声阻抗材料层和由低电容率材料制成的低声阻抗材料层。 该组件可以在互连层上支撑谐振器或者用作谐振器的两个有源元件之间的去耦组件。 组件可以替代地包括三个低声阻抗层。 或者，组件可以包括三个声阻抗层，其中两个层是低声阻抗层，并且第三层具有比前两个更高的声阻抗，或者备选地是高声阻抗层。

    Support and decoupling structure for an acoustic resonator, acoustic resonator and corresponding integrated circuit
    5.
    发明申请
    Support and decoupling structure for an acoustic resonator, acoustic resonator and corresponding integrated circuit 有权
    声谐振器，声谐振器和相应的集成电路的支持和去耦结构

    公开(公告)号：US20070182284A1

    公开(公告)日：2007-08-09

    申请号：US11731942

    申请日：2007-04-02

    申请人： Guillaume Bouche ,  Gregory Caruyer ,  Pascal Ancey

    发明人： Guillaume Bouche ,  Gregory Caruyer ,  Pascal Ancey

    IPC分类号： H01L41/04

    CPC分类号： H03H9/175

    摘要： An acoustic resonator assembly includes a layer of high-acoustic-impedance material and a layer of low-acoustic-impedance material made of a low-electrical-permittivity material. This assembly may support the resonator over an interconnect layer or act as a decoupling assembly between two active elements of the resonator. The assembly may alternatively include three low-acoustic impedance layers. Alternatively, the assembly may include three acoustic impedance layers wherein two of the layers are low acoustic impedance layers and the third layer has a higher acoustic impedance than the first two or alternatively is a high-acoustic impedance layer.

    摘要翻译： 声谐振器组件包括高声阻抗材料层和由低电容率材料制成的低声阻抗材料层。 该组件可以在互连层上支撑谐振器或者用作谐振器的两个有源元件之间的去耦组件。 组件可以替代地包括三个低声阻抗层。 或者，组件可以包括三个声阻抗层，其中两个层是低声阻抗层，并且第三层具有比前两个更高的声阻抗，或者备选地是高声阻抗层。

    Acoustic resonator device
    6.
    发明申请
    Acoustic resonator device 有权
    声谐振器装置

    公开(公告)号：US20050168104A1

    公开(公告)日：2005-08-04

    申请号：US11009688

    申请日：2004-12-10

    申请人： Guillaume Bouche ,  Gregory Caruyer ,  Pascal Ancey

    发明人： Guillaume Bouche ,  Gregory Caruyer ,  Pascal Ancey

    IPC分类号： H03H3/02 ,  H03H9/17 ,  H03H9/56 ,  H03H9/58 ,  H01L41/08

    CPC分类号： H03H9/587 ,  H03H9/564

    摘要： Acoustic resonator device (1) includes an active element (6) and a support provided with a membrane (5). The active element (6) is provided with at least one piezoelectric layer (10) and is surmounted by a multilayer stack (12). The multilayer stack (12) is provided with at least three layers, including at least one layer (15) of high acoustic impedance and at least one layer (13) of low acoustic impedance. An integrated circuit including at least one such acoustic resonator device is also disclosed.

    摘要翻译： 声谐振器装置（1）包括有源元件（6）和具有膜（5）的支撑件。 有源元件（6）设置有至少一个压电层（10），并被多层叠层（12）所覆盖。 多层堆叠（12）设置有至少三层，包括至少一层高声阻抗层（15）和至少一层低声阻抗层（13）。 还公开了包括至少一个这样的声谐振器装置的集成电路。

    Support and decoupling structure for an acoustic resonator, acoustic resonator and corresponding integrated circuit
    7.
    发明申请
    Support and decoupling structure for an acoustic resonator, acoustic resonator and corresponding integrated circuit 审中-公开
    声谐振器，声谐振器和相应的集成电路的支持和去耦结构

    公开(公告)号：US20050023931A1

    公开(公告)日：2005-02-03

    申请号：US10868383

    申请日：2004-06-15

    申请人： Guillaume Bouche ,  Gregory Caruyer ,  Pascal Ancey

    发明人： Guillaume Bouche ,  Gregory Caruyer ,  Pascal Ancey

    IPC分类号： H01L23/14 ,  H01L27/20 ,  H01L41/04 ,  H03H9/05 ,  H03H9/17 ,  H03H9/58

    CPC分类号： H03H9/175

    摘要： An acoustic resonator assembly includes a layer of high-acoustic-impedance material and a layer of low-acoustic-impedance material made of a low-electrical-permittivity material. This assembly may support the resonator over an interconnect layer or act as a decoupling assembly between two active elements of the resonator. The assembly may alternatively include three low-acoustic impedance layers. Alternatively, the assembly may include three acoustic impedance layers wherein two of the layers are low acoustic impedance layers and the third layer has a higher acoustic impedance than the first two or alternatively is a high-acoustic impedance layer.

    摘要翻译： 声谐振器组件包括高声阻抗材料层和由低电容率材料制成的低声阻抗材料层。 该组件可以在互连层上支撑谐振器或者用作谐振器的两个有源元件之间的去耦组件。 组件可以替代地包括三个低声阻抗层。 或者，组件可以包括三个声阻抗层，其中两个层是低声阻抗层，并且第三层具有比前两个更高的声阻抗，或者备选地是高声阻抗层。

    Acoustic resonator device
    8.
    发明授权
    Acoustic resonator device 有权
    声谐振器装置

    公开(公告)号：US07550900B2

    公开(公告)日：2009-06-23

    申请号：US11009688

    申请日：2004-12-10

    申请人： Guillaume Bouche ,  Gregory Caruyer ,  Pascal Ancey

    发明人： Guillaume Bouche ,  Gregory Caruyer ,  Pascal Ancey

    IPC分类号： H01L41/08

    CPC分类号： H03H9/587 ,  H03H9/564

    摘要： Acoustic resonator device (1) includes an active element (6) and a support provided with a membrane (5). The active element (6) is provided with at least one piezoelectric layer (10) and is surmounted by a multilayer stack (12). The multilayer stack (12) is provided with at least three layers, including at least one layer (15) of high acoustic impedance and at least one layer (13) of low acoustic impedance. An integrated circuit including at least one such acoustic resonator device is also disclosed.

    摘要翻译： 声谐振器装置（1）包括有源元件（6）和具有膜（5）的支撑件。 有源元件（6）设置有至少一个压电层（10），并被多层叠层（12）所覆盖。 多层堆叠（12）设置有至少三层，包括至少一层高声阻抗层（15）和至少一层低声阻抗层（13）。 还公开了包括至少一个这样的声谐振器装置的集成电路。

    Method for forming a variable capacitor
    10.
    发明授权
    Method for forming a variable capacitor 有权
    形成可变电容器的方法

    公开(公告)号：US07565725B2

    公开(公告)日：2009-07-28

    申请号：US11512731

    申请日：2006-08-30

    申请人： Guillaume Bouche ,  Fabrice Casset ,  Pascal Ancey

    发明人： Guillaume Bouche ,  Fabrice Casset ,  Pascal Ancey

    IPC分类号： H01G7/00

    CPC分类号： H01G5/16 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T83/0476 ,  Y10T83/0505 ,  Y10T83/051 ,  Y10T83/0577

    摘要： A method for forming a variable capacitor including a conductive strip covering the inside of a cavity, and a flexible conductive membrane placed above the cavity, the cavity being formed according to the steps of: forming a recess in the substrate; placing a malleable material in the recess; having a stamp bear against the substrate at the level of the recess to give the upper part of the malleable material a desired shape; hardening the malleable material; and removing the stamp.

    摘要翻译： 一种形成可变电容器的方法，所述可变电容器包括覆盖空腔内部的导电条和位于所述空腔上方的柔性导电膜，所述空腔根据以下步骤形成：在所述基板中形成凹部; 将可延展材料放置在凹槽中; 在凹部的水平处具有抵靠基板的印模，以使可延展材料的上部具有期望的形状; 硬化可延展材料; 并移除邮票。