公开(公告)号：US20060138304A1

公开(公告)日：2006-06-29

申请号：US11022116

申请日：2004-12-23

申请人： Guolin Ma ,  Bahram Afshari ,  Jason Hartlove

发明人： Guolin Ma ,  Bahram Afshari ,  Jason Hartlove

IPC分类号： H01L27/00

CPC分类号： H01L27/1462 ,  H01L27/14685

摘要： A wire-bondable image sensor having an integral contaminant shadowing reduction structure is described. In one aspect, an image sensor includes a substrate that has a side supporting at least one imaging area and at least one wirebonding area. Light detectors are constructed and arranged to receive light through the imaging area. Bond pads are exposed in the wirebonding area for connecting to respective bond wires. A contaminant shadowing reduction structure on the imaging area has an exposed contaminant displacement surface over the imaging area and separated from the imaging area by a distance of at least 300 μm. The contaminant shadowing reduction structure is substantially transparent to radiation within an operative wavelength range specified for the image sensor. Methods of making the above-mentioned image sensor also are described.

摘要翻译： 描述了具有整体污染物减影结构的可焊接图像传感器。 一方面，图像传感器包括具有支撑至少一个成像区域的侧面和至少一个引线键合区域的基板。 光检测器被构造和布置成通过成像区域接收光。 接合焊盘暴露在引线接合区域中，以连接到相应的接合线。 成像区域上的污染物减影结构在成像区域上具有暴露的污染物位移表面，并与成像区域分开至少300μm的距离。 污染物遮蔽减少结构对于为图像传感器指定的工作波长范围内的辐射基本上是透明的。 还描述了制造上述图像传感器的方法。

公开(公告)号：US07129459B2

公开(公告)日：2006-10-31

申请号：US11022116

申请日：2004-12-23

申请人： Guolin Ma ,  Bahram Afshari ,  Jason Hartlove

发明人： Guolin Ma ,  Bahram Afshari ,  Jason Hartlove

IPC分类号： H01L27/00 ,  H01L31/0232

CPC分类号： H01L27/1462 ,  H01L27/14685

摘要： A wire-bondable image sensor having an integral contaminant shadowing reduction structure is described. In one aspect, an image sensor includes a substrate that has a side supporting at least one imaging area and at least one wirebonding area. Light detectors are constructed and arranged to receive light through the imaging area. Bond pads are exposed in the wirebonding area for connecting to respective bond wires. A contaminant shadowing reduction structure on the imaging area has an exposed contaminant displacement surface over the imaging area and separated from the imaging area by a distance of at least 300 μm. The contaminant shadowing reduction structure is substantially transparent to radiation within an operative wavelength range specified for the image sensor. Methods of making the above-mentioned image sensor also are described.

公开(公告)号：US20050077458A1

公开(公告)日：2005-04-14

申请号：US10684619

申请日：2003-10-14

申请人： Guolin Ma ,  Bahram Afshari

发明人： Guolin Ma ,  Bahram Afshari

IPC分类号： H01L31/0232 ,  H04N5/225 ,  H01J40/14 ,  H01L27/00

CPC分类号： H04N5/2257 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/02325 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/13 ,  H01L2924/00014 ,  H04N5/2254 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An integrally packaged imaging module includes an integrated circuit (IC), including an image sensing device formed on a semiconductor substrate, and wafer level packaging enclosing the IC. The wafer level packaging includes a transparent enclosure portion adapted to permit image acquisition of an image by the image sensing device over a desired range of wavelengths, and a first spacing structure providing a cavity between an inner surface of the transparent enclosure portion and the image sensing device. A depth of the cavity is configurable along an axis perpendicular to the semiconductor substrate to control a distance between an outer surface of the transparent enclosure portion and the image sensing device.

摘要翻译： 整体封装的成像模块包括集成电路（IC），其包括形成在半导体衬底上的图像感测装置和封装IC的晶片级封装。 晶片级封装包括透明外壳部分，其适于允许图像检测装置在期望的波长范围内对图像进行图像采集;以及第一间隔结构，其在透明外壳部分的内表面和图像感测之间提供空腔 设备。 空腔的深度可以沿着垂直于半导体衬底的轴配置，以控制透明外壳部分的外表面与图像感测装置之间的距离。

公开(公告)号：US07329861B2

公开(公告)日：2008-02-12

申请号：US10684619

申请日：2003-10-14

申请人： Guolin Ma ,  Bahram Afshari

发明人： Guolin Ma ,  Bahram Afshari

IPC分类号： H04N5/225

CPC分类号： H04N5/2257 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/02325 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/13 ,  H01L2924/00014 ,  H04N5/2254 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An integrally packaged imaging module includes an integrated circuit (IC), including an image sensing device formed on a semiconductor substrate, and wafer level packaging enclosing the IC. The wafer level packaging includes a transparent enclosure portion adapted to permit image acquisition of an image by the image sensing device over a desired range of wavelengths, and a first spacing structure providing a cavity between an inner surface of the transparent enclosure portion and the image sensing device. A depth of the cavity is configurable along an axis perpendicular to the semiconductor substrate to control a distance between an outer surface of the transparent enclosure portion and the image sensing device.

摘要翻译： 整体封装的成像模块包括集成电路（IC），其包括形成在半导体衬底上的图像感测装置和封装IC的晶片级封装。 晶片级封装包括透明外壳部分，其适于允许图像检测装置在期望的波长范围内对图像进行图像采集;以及第一间隔结构，其在透明外壳部分的内表面和图像感测之间提供空腔 设备。 空腔的深度可以沿着垂直于半导体衬底的轴配置，以控制透明外壳部分的外表面与图像感测装置之间的距离。

公开(公告)号：US20060043260A1

公开(公告)日：2006-03-02

申请号：US10926152

申请日：2004-08-24

申请人： Guolin Ma ,  Jason Hartlove

发明人： Guolin Ma ,  Jason Hartlove

IPC分类号： H01L27/00 ,  H01L31/00

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14645 ,  H01L31/02162 ,  H01L2224/48091 ,  H04N5/2257 ,  H01L2924/00014

摘要： An image sensing device is disclosed having a die formed with an array of photosensing sites and a structure of optical material having infrared absorbing characteristics formed over the photosensing sites. An embodiment is disclosed in which the structure of optical material having infrared absorbing characteristics is formed as an array of microlenses for directing visible image light onto the photosensing sites and at the same time filtering out infrared wavelengths that interfere with image capture. Alternatively, the structure may be designed to filter out other ranges of wavelengths outside of the visible spectrum.

摘要翻译： 公开了一种图像感测装置，其具有形成有光敏位置阵列的模具和在光敏位置形成的具有红外吸收特性的光学材料的结构。 公开了一种实施例，其中具有红外线吸收特性的光学材料的结构形成为用于将可见光图像引导到光敏位置并同时滤出干扰图像捕获的红外波长的微透镜阵列。 或者，该结构可以被设计为滤除可见光谱外的其它波长范围。

公开(公告)号：US20060092311A1

公开(公告)日：2006-05-04

申请号：US10981272

申请日：2004-11-03

申请人： Jason Hartlove ,  Guolin Ma

发明人： Jason Hartlove ,  Guolin Ma

IPC分类号： H04N5/225 ,  H04N5/232 ,  G03B13/00 ,  G03B17/42

CPC分类号： G02B7/102 ,  G02B7/08 ,  H04N5/2253 ,  H04N5/23212

摘要： A system and method for auto-focusing light. The system includes at least one focusing lens operable to direct light toward a focal point. The system further includes a sensor array disposed adjacent to the lens assembly such that the light through the lens assembly is directed to the sensor array near the focal point and a bubble array having a plurality of bubble generators. The bubble array supports the sensor array and the bubble generators are operable to maneuver the supported sensor array with respect to the focal point. Such a light focusing system is able to provide an auto-focus capability to a camera system that does not have a large amount of space available for a motor-driven auto-focus system. Furthermore, the bubble array is power efficient and does not require the amount of energy to operate as is required for a motor-driven auto-focus system.

公开(公告)号：US20050156901A1

公开(公告)日：2005-07-21

申请号：US10760728

申请日：2004-01-20

申请人： Guolin Ma ,  Jason Hartlove

发明人： Guolin Ma ,  Jason Hartlove

IPC分类号： G09G5/00

CPC分类号： G06F3/0428

摘要： A touch screen display system includes a display screen positioned in a first plane. A touch surface is positioned in a second plane adjacent to the display screen. An illuminating source is configured to illuminate the display screen and the touch surface. A first imaging sensor is positioned in the second plane and configured to detect an object coming in contact with the touch surface. A second imaging sensor is positioned in the second plane and configured to detect an object coming in contact with the touch surface. An imaging system is electrically coupled to the first and second imaging sensors and configured to receive electrical signals from the first and second imaging sensors relating to the detection of the object coming in contact with the touch surface. The imaging system configured to determine an angular position on the touch surface of the object coming in contact with the touch surface based upon the received electrical signals.

摘要翻译： 触摸屏显示系统包括位于第一平面中的显示屏。 触摸表面位于与显示屏相邻的第二平面中。 照明源被配置为照亮显示屏和触摸表面。 第一成像传感器定位在第二平面中并且被配置为检测与触摸表面接触的物体。 第二成像传感器定位在第二平面中并且被配置为检测与触摸表面接触的物体。 成像系统电耦合到第一和第二成像传感器，并且被配置为从与第一和第二成像传感器接触的物体的检测中接收电信号。 该成像系统被配置为基于接收的电信号来确定与触摸表面接触的物体的触摸表面上的角位置。

公开(公告)号：US20050007346A1

公开(公告)日：2005-01-13

申请号：US10618317

申请日：2003-07-11

申请人： Guolin Ma ,  Jason Hartlove ,  Boon-Kheng Lee

发明人： Guolin Ma ,  Jason Hartlove ,  Boon-Kheng Lee

IPC分类号： G02B6/42 ,  F21V8/00 ,  G02B6/00 ,  G02B19/00 ,  G06F3/03 ,  G06F3/033 ,  G09G5/08

CPC分类号： G02B6/0006 ,  G06F3/0317

摘要： An optical conduit in an optical mouse is used to channel light from a light source onto a surface for illumination. Light from the light source is totally and internally reflected within the optical conduit towards the surface. To improve the efficiency of light transmission, the light source is glued to the exterior of the optical conduit, or embedded within the optical conduit itself. A reflector cup can be used to surround the light source so as to redirect light from the light source towards the output end of the optical conduit. The optical conduit can have curved surfaces that fit parabolic or hyperbolic equations, or other equations of second-order or higher.

摘要翻译： 光学鼠标中的光导管用于将来自光源的光引导到表面上用于照明。 来自光源的光在光导管内全部和内部反射到表面。 为了提高光传输的效率，将光源胶合到光导管的外部，或嵌入光导管本身内。 可以使用反射杯来围绕光源，以将来自光源的光重定向到光导管的输出端。 光导管可以具有适合抛物线或双曲线方程或二阶或更高等式的其他方程的曲面。

公开(公告)号：US07329856B2

公开(公告)日：2008-02-12

申请号：US10926152

申请日：2004-08-24

申请人： Guolin Ma ,  Jason Hartlove

发明人： Guolin Ma ,  Jason Hartlove

IPC分类号： G01J3/50 ,  H01J27/14 ,  H01J31/0232

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14645 ,  H01L31/02162 ,  H01L2224/48091 ,  H04N5/2257 ,  H01L2924/00014

摘要： An image sensing device is disclosed having a die formed with an array of photosensing sites and a structure of optical material having infrared absorbing characteristics formed over the photosensing sites. An embodiment is disclosed in which the structure of optical material having infrared absorbing characteristics is formed as an array of microlenses for directing visible image light onto the photosensing sites and at the same time filtering out infrared wavelengths that interfere with image capture. Alternatively, the structure may be designed to filter out other ranges of wavelengths outside of the visible spectrum.

摘要翻译： 公开了一种图像感测装置，其具有形成有光敏位置阵列的模具和在光敏位置形成的具有红外吸收特性的光学材料的结构。 公开了一种实施例，其中具有红外线吸收特性的光学材料的结构形成为用于将可见光图像引导到光敏位置并同时滤出干扰图像捕获的红外波长的微透镜阵列。 或者，该结构可以被设计为滤除可见光谱外的其它波长范围。

公开(公告)号：US20080131992A1

公开(公告)日：2008-06-05

申请号：US11969246

申请日：2008-01-04

申请人： Guolin Ma ,  Jason Hartlove

发明人： Guolin Ma ,  Jason Hartlove

IPC分类号： H01L31/0232

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14645 ,  H01L31/02162 ,  H01L2224/48091 ,  H04N5/2257 ,  H01L2924/00014

摘要： An image sensing device is disclosed having a die formed with an array of photosensing sites and a structure of optical material having infrared absorbing characteristics formed over the photosensing sites. An embodiment is disclosed in which the structure of optical material having infrared absorbing characteristics is formed as an array of microlenses for directing visible image light onto the photosensing sites and at the same time filtering out infrared wavelengths that interfere with image capture. Alternatively, the structure may be designed to filter out other ranges of wavelengths outside of the visible spectrum.

摘要翻译： 公开了一种图像感测装置，其具有形成有光敏位置阵列的模具和在光敏位置形成的具有红外吸收特性的光学材料的结构。 公开了一种实施例，其中具有红外线吸收特性的光学材料的结构形成为用于将可见光图像引导到光敏位置并同时滤出干扰图像捕获的红外波长的微透镜阵列。 或者，该结构可以被设计为滤除可见光谱外的其它波长范围。