公开(公告)号：US08089145B1

公开(公告)日：2012-01-03

申请号：US12272606

申请日：2008-11-17

申请人： Gwang Ho Kim ,  Jin Seong Kim ,  Dong Joo Park ,  Dae Byoung Kang

发明人： Gwang Ho Kim ,  Jin Seong Kim ,  Dong Joo Park ,  Dae Byoung Kang

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/495 ,  H01L23/02 ,  H01L29/40 ,  H01L23/28

CPC分类号： H01L23/49541 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49517 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/00

摘要： In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package of the present invention includes a generally planar die pad or die paddle defining multiple peripheral edge segments. In addition, the semiconductor package includes a plurality of leads. Some of these leads are provided in two concentric rows or rings which at least partially circumvent the die pad, with other leads including portions which protrude from respective side surfaces of a package body of the semiconductor package. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads. At least portions of the die pad, the leads, and the semiconductor die are encapsulated by the package body.

摘要翻译： 根据本发明，提供了包括唯一配置的引线框的半导体封装（例如，QFP封装），其尺寸和配置为使半导体封装中的暴露引线的可用数量最大化。 更具体地，本发明的半导体封装包括限定多个周边边缘段的大致平面的管芯焊盘或管芯焊盘。 此外，半导体封装包括多个引线。 这些引线中的一些以两个同心的行或环提供，其至少部分地绕过管芯焊盘，其他引线包括从半导体封装的封装主体的相应侧表面突出的部分。 连接到管芯焊盘的顶表面的是至少一个半导体管芯，其电连接到至少一些引线。 芯片焊盘，引线和半导体管芯的至少一部分被封装体封装。

公开(公告)号：US06512826B1

公开(公告)日：2003-01-28

申请号：US09226187

申请日：1999-01-07

申请人： Gwang Ho Kim

发明人： Gwang Ho Kim

IPC分类号： H04M100

CPC分类号： H04M1/6075

摘要： A multi-directional hand-free kit. The kit has a main body receiving a printed circuit board therein for controlling audio signal sending and receiving incorporated with a mobile communication device and formed with a first oblique portion, a connector member connected to an external power source and formed at a portion thereof facing the first oblique portion with a second oblique portion which frictionally makes contact with the first oblique portion, and a shaft member for connecting the main body and the connector member in such a manner that the main body and the connector member are obliquely rotatable to each other.

摘要翻译： 多方位免提套件。 该套件具有主体，其中接收印刷电路板，用于控制与移动通信装置结合的音频信号发送和接收，并形成有第一倾斜部分，连接到外部电源的连接器部件，并形成在其面向 第一倾斜部分，其具有与第一倾斜部分摩擦接触的第二倾斜部分;以及轴构件，其以主体和连接器构件彼此倾斜地旋转的方式连接主体和连接器构件。