公开(公告)号：US20230058064A1

公开(公告)日：2023-02-23

申请号：US17797193

申请日：2021-02-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Tomonori NAKAMURA ,  Kenichi OHTSUKA ,  Satoshi ARANO ,  Kunihiko TSUCHIYA

IPC: G01B11/06 ,  G01B15/02

Abstract: A film thickness measuring apparatus includes a light irradiation unit configured to irradiate an object with light in a planar shape, an optical element having a transmittance and a reflectance changing according to wavelengths in a predetermined wavelength range, the optical element being configured to separate light from the object by transmitting and reflecting the light, an imaging unit configured to photograph light separated by the optical element, and an analysis unit configured to estimate a film thickness of the object based on a signal from the imaging unit photographing light, in which the light irradiation unit emits light having a wavelength included in the predetermined wavelength range of the optical element.

公开(公告)号：US20240240933A1

公开(公告)日：2024-07-18

申请号：US18561390

申请日：2022-01-25

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Kunihiko TSUCHIYA ,  Satoshi ARANO ,  Kenichi OHTSUKA

IPC: G01B11/06

CPC classification number: G01B11/0625

Abstract: A film thickness measurement apparatus includes a light source that irradiates a sample with light, an area sensor that detects light from the sample and outputs a signal according to luminance information of the detected light, a spectrometer that spectrally detects light from the sample and outputs a signal according to wavelength information including a spectrum of the light, and a control apparatus that estimates a film thickness of the sample on the basis of the luminance information specified from the signal output from the area sensor and the wavelength information specified from the signal output from the spectrometer.