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公开(公告)号:US20240240933A1
公开(公告)日:2024-07-18
申请号:US18561390
申请日:2022-01-25
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Kunihiko TSUCHIYA , Satoshi ARANO , Kenichi OHTSUKA
IPC: G01B11/06
CPC classification number: G01B11/0625
Abstract: A film thickness measurement apparatus includes a light source that irradiates a sample with light, an area sensor that detects light from the sample and outputs a signal according to luminance information of the detected light, a spectrometer that spectrally detects light from the sample and outputs a signal according to wavelength information including a spectrum of the light, and a control apparatus that estimates a film thickness of the sample on the basis of the luminance information specified from the signal output from the area sensor and the wavelength information specified from the signal output from the spectrometer.
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公开(公告)号:US20230066638A1
公开(公告)日:2023-03-02
申请号:US17797179
申请日:2021-02-02
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Tomonori NAKAMURA , Kunihiko TSUCHIYA
Abstract: A height measurement apparatus includes: a light irradiation unit that irradiates a sample with irradiation light; a camera system that detects light from the sample irradiated with the irradiation light; and a control apparatus that calculates a height of the sample based on the wavelength information. The camera system includes an inclined dichroic mirror of which a transmittance and a reflectance change according to a wavelength in a predetermined wavelength range and which separates the light from the sample by transmitting and reflecting the light, a light detector that detects a reflected light quantity from light reflected by the inclined dichroic mirror, a light detector that detects a transmitted light quantity from light transmitted through the inclined dichroic mirror, and a processing unit that calculates the wavelength information based on a ratio between the reflected light quantity and the transmitted light quantity, to output the wavelength information.
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公开(公告)号:US20230288349A1
公开(公告)日:2023-09-14
申请号:US18016699
申请日:2021-04-30
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Kunihiko TSUCHIYA , Toshiyasu SUYAMA
IPC: G01N23/18 , G01N21/90 , G01N23/04 , G01N21/33 , G01N21/3563 , G01N23/083
CPC classification number: G01N23/18 , G01N21/90 , G01N23/04 , G01N21/33 , G01N21/3563 , G01N23/083 , G01N2223/643
Abstract: A foreign matter inspection device includes: an X-ray application unit configured to apply an X-ray to an inspection object carried by a carriage unit; an X-ray detection unit configured to detect an X-ray transmitted by the inspection object and to output X-ray image data based on the detection result; an infrared ray application unit configured to apply an infrared ray to the inspection object carried by the carriage unit; and an infrared ray detection unit configured to detect the infrared ray from the inspection object and to output infrared image data based on the detection result. The infrared ray application unit and the infrared ray detection unit are covered by a protection unit formed of a member blocking the X-ray and transmitting the infrared ray.
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公开(公告)号:US20230058064A1
公开(公告)日:2023-02-23
申请号:US17797193
申请日:2021-02-09
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Tomonori NAKAMURA , Kenichi OHTSUKA , Satoshi ARANO , Kunihiko TSUCHIYA
Abstract: A film thickness measuring apparatus includes a light irradiation unit configured to irradiate an object with light in a planar shape, an optical element having a transmittance and a reflectance changing according to wavelengths in a predetermined wavelength range, the optical element being configured to separate light from the object by transmitting and reflecting the light, an imaging unit configured to photograph light separated by the optical element, and an analysis unit configured to estimate a film thickness of the object based on a signal from the imaging unit photographing light, in which the light irradiation unit emits light having a wavelength included in the predetermined wavelength range of the optical element.
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