公开(公告)号：US20210327929A1

公开(公告)日：2021-10-21

申请号：US17285201

申请日：2019-09-11

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Ryo TAKIGUCHI ,  Makoto KONO ,  Keiichi OTA ,  Tetsuya TAKA

IPC: H01L27/146

Abstract: A solid-state imaging device according to the disclosure includes a semiconductor substrate which has a main surface having a plurality of photosensitive regions, and an insulating film which is provided on the main surface of the semiconductor substrate. When the main surface of the semiconductor substrate is taken as a reference surface, a thickness of the insulating film from the reference surface is 0.5 μm or more, a surface (a main surface) of the insulating film on the side opposite to the main surface is a surface having flatness, and a plurality of types of bottom surfaces of which depths from the reference surface are different from each other are provided on the main surface of the semiconductor substrate in the photosensitive regions.

公开(公告)号：US20210067725A1

公开(公告)日：2021-03-04

申请号：US16321570

申请日：2017-08-22

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Tetsuya TAKA

IPC: H04N5/3745 ,  H01L27/146

Abstract: A linear image sensor includes N units, a readout circuit, and a control unit. Each unit includes a photodiode and a source follower amplifier. The source follower amplifier includes a MOS transistor, an operation control switch, and a current source. A gate of the MOS transistor is connected to a cathode of the photodiode via the MOS transistor. The operation control switch is provided between a source of the MOS transistor and a connection node. The current source is provided between the connection node and a second reference potential input terminal.

公开(公告)号：US20230258580A1

公开(公告)日：2023-08-17

申请号：US18025215

申请日：2021-08-10

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Tetsuya TAKA ,  Toshiyasu SUYAMA

IPC: G01N23/04 ,  G01N23/083

CPC classification number: G01N23/04 ,  G01N23/083 ,  G01N2223/505 ,  G01N2223/643

Abstract: An imaging unit includes a housing having an entrance window that allows radiation transmitted through an object to pass through, a scintillator having an input surface to which radiation passing through the entrance window is input, and a line scan sensor having an imaging surface that captures an image of scintillation light output from the input surface. The imaging unit further includes a slit member placed between the entrance window and the scintillator and configured to guide radiation passing through the entrance window toward the input surface and a 1X lens placed between the scintillator and the line scan sensor and configured to form scintillation light output from the input surface into an image on the imaging surface of the line scan sensor.

公开(公告)号：US20240310534A1

公开(公告)日：2024-09-19

申请号：US18681210

申请日：2022-05-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Hiroyuki TOMIYAMA ,  Tetsuya TAKA

IPC: G01T1/20

CPC classification number: G01T1/2002

Abstract: A radiation detector includes a positioning member having a through hole through which radiation passes, a scintillator having an input surface to which the radiation passing through the through hole is input and configured to convert the radiation into scintillation light, a sensor unit having a light-receiving surface that receives the scintillation light converted by the scintillator and configured to detect the scintillation light, and a lens unit having a lens configured to perform image capturing on the input surface of the scintillator and the light-receiving surface of the sensor unit. The positioning member has a first positioning portion with which the input surface of the scintillator comes into contact to position the scintillator and a second positioning portion with which one end face of the lens unit comes into contact to position the lens unit.