公开(公告)号：US20190232423A1

公开(公告)日：2019-08-01

申请号：US16256031

申请日：2019-01-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yoshio MIZUTA ,  Takashi KURITA ,  Takeshi WATARI ,  Yuki KABEYA ,  Norio KURITA ,  Toshiyuki KAWASHIMA

IPC: B23K26/0622 ,  B23K26/356 ,  B23K26/00 ,  C21D10/00

CPC classification number: B23K26/0622 ,  B23K26/009 ,  B23K26/356 ,  C21D10/005

Abstract: A laser processing apparatus includes a light source which outputs a laser light, and a waveform control unit which controls a pulse waveform of the laser light irradiating the workpiece, in which the pulse waveform of the laser light controlled by the waveform control unit includes a main pulse and a foot pulse temporally preceding the main pulse, and a peak intensity of the foot pulse is smaller than a peak intensity of the main pulse, and a peak position of the main pulse is positioned in a retention time period of plasma generated due to an incidence of the foot pulse on the workpiece.