公开(公告)号：US20230226639A1

公开(公告)日：2023-07-20

申请号：US18007808

申请日：2021-06-04

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takashi KURITA ,  Takeshi WATARI ,  Yuki KABEYA ,  Ryo YOSHIMURA

IPC: B23K26/0622 ,  B23K26/356 ,  C21D10/00

CPC classification number: B23K26/0622 ,  B23K26/356 ,  C21D10/005

Abstract: A processed product manufacturing method includes preparing a workpiece containing metal and forming a plurality of first regions and a second region along a surface of the workpiece by the irradiation of a laser beam. The first regions are applied with a tensile residual stress. In the second region applied with a compressive residual stress, a plurality of irradiation points separated from each other in the surface of the workpiece are irradiated with the laser beam. The first regions are formed to be separated from each other and each of the first regions is surrounded by the second region when viewed from a direction orthogonal to the surface.

公开(公告)号：US20220268948A1

公开(公告)日：2022-08-25

申请号：US17625894

申请日：2020-07-06

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi WATARI

IPC: G01T1/20

Abstract: A signal readout circuit is a circuit for reading out a signal from a photodetection element having a plurality of photodetection pixels each generating a detection signal according to light incidence, and includes N light incidence detection units (N is an integer of 2 or more) each for inputting the detection signal from each of N photodetection pixels and outputting a signal indicating the light incidence, and a total value detection unit for detecting a total value of the output signals from the N light incidence detection units. Each light incidence detection unit outputs the signal weighted differently corresponding to each photodetection pixel. A weight thereof is set such that the total values are different for respective photodetection pixels and all combination patterns of the photodetection pixels.

公开(公告)号：US20240218140A1

公开(公告)日：2024-07-04

申请号：US18397004

申请日：2023-12-27

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Atsushi NAKANISHI ,  Yuta KINE ,  Takeshi WATARI ,  Takashi KURITA ,  Hiroshi SATOZONO

IPC: C08J7/12

CPC classification number: C08J7/123 ,  C08J2323/12 ,  C08J2355/02 ,  C08J2377/02 ,  C08J2497/02

Abstract: Provided is a method of manufacturing a resin member. The method includes irradiating a surface of a member containing a resin and a plant powder dispersed in the resin with laser light to change the plant powder or both the resin and the plant powder into diamond-like carbon in a surface layer region including the surface of the member.

公开(公告)号：US20240208822A1

公开(公告)日：2024-06-27

申请号：US18545069

申请日：2023-12-19

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Atsushi NAKANISHI ,  Yuta KINE ,  Takeshi WATARI ,  Takashi KURITA

IPC: C01B32/184 ,  B23K26/0622 ,  B23K26/70

CPC classification number: C01B32/184 ,  B23K26/0624 ,  B23K26/705

Abstract: A graphene manufacturing method includes a step of preparing a workpiece including a base material made of a resin material and a plant powder dispersed in the base material, a step of irradiating a surface of the workpiece with a terahertz wave and an evaluation laser beam and detecting the terahertz wave from the surface, a step of irradiating a processing region of the surface with a processing laser beam to form graphene in the processing region, a step of irradiating the processing region with the terahertz wave and the evaluation laser beam and detecting the terahertz wave from the processing region, and a step of evaluating quality of the graphene in the processing region based on an intensity difference between the terahertz wave detected in the step and the terahertz wave detected in the step.

公开(公告)号：US20230330779A1

公开(公告)日：2023-10-19

申请号：US18027440

申请日：2021-07-05

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yuki KABEYA ,  Takashi KURITA ,  Ryo YOSHIMURA ,  Takeshi WATARI

IPC: B23K26/082 ,  B23K26/38

CPC classification number: B23K26/38 ,  B23K26/082

Abstract: Disclosed is a laser processing method for imparting compressive residual stress to an object along an objective area on a surface of the object by irradiating the objective area with laser light. The laser processing method includes a processing step of scanning the objective area with an irradiation spot of the laser light while increasing a moving average in intensity of the laser light per unit area.

公开(公告)号：US20230330774A1

公开(公告)日：2023-10-19

申请号：US18027388

申请日：2021-07-05

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yuki KABEYA ,  Takashi KURITA ,  Ryo YOSHIMURA ,  Takeshi WATARI

IPC: B23K26/073 ,  B23K26/356

CPC classification number: B23K26/073 ,  B23K26/356

Abstract: Disclosed is a laser processing method for imparting compressive residual stress to an object along an objective area on a surface of the object by irradiating the objective area with laser light. The laser processing method includes: a first step of expanding an area irradiated with the laser light toward a first side in the objective area; and a second step of expanding the area irradiated with the laser light toward a second side different from the first side in the objective area.

公开(公告)号：US20190232423A1

公开(公告)日：2019-08-01

申请号：US16256031

申请日：2019-01-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yoshio MIZUTA ,  Takashi KURITA ,  Takeshi WATARI ,  Yuki KABEYA ,  Norio KURITA ,  Toshiyuki KAWASHIMA

IPC: B23K26/0622 ,  B23K26/356 ,  B23K26/00 ,  C21D10/00

CPC classification number: B23K26/0622 ,  B23K26/009 ,  B23K26/356 ,  C21D10/005

Abstract: A laser processing apparatus includes a light source which outputs a laser light, and a waveform control unit which controls a pulse waveform of the laser light irradiating the workpiece, in which the pulse waveform of the laser light controlled by the waveform control unit includes a main pulse and a foot pulse temporally preceding the main pulse, and a peak intensity of the foot pulse is smaller than a peak intensity of the main pulse, and a peak position of the main pulse is positioned in a retention time period of plasma generated due to an incidence of the foot pulse on the workpiece.