公开(公告)号：US20230226639A1

公开(公告)日：2023-07-20

申请号：US18007808

申请日：2021-06-04

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takashi KURITA ,  Takeshi WATARI ,  Yuki KABEYA ,  Ryo YOSHIMURA

IPC: B23K26/0622 ,  B23K26/356 ,  C21D10/00

CPC classification number: B23K26/0622 ,  B23K26/356 ,  C21D10/005

Abstract: A processed product manufacturing method includes preparing a workpiece containing metal and forming a plurality of first regions and a second region along a surface of the workpiece by the irradiation of a laser beam. The first regions are applied with a tensile residual stress. In the second region applied with a compressive residual stress, a plurality of irradiation points separated from each other in the surface of the workpiece are irradiated with the laser beam. The first regions are formed to be separated from each other and each of the first regions is surrounded by the second region when viewed from a direction orthogonal to the surface.

公开(公告)号：US20230330779A1

公开(公告)日：2023-10-19

申请号：US18027440

申请日：2021-07-05

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yuki KABEYA ,  Takashi KURITA ,  Ryo YOSHIMURA ,  Takeshi WATARI

IPC: B23K26/082 ,  B23K26/38

CPC classification number: B23K26/38 ,  B23K26/082

Abstract: Disclosed is a laser processing method for imparting compressive residual stress to an object along an objective area on a surface of the object by irradiating the objective area with laser light. The laser processing method includes a processing step of scanning the objective area with an irradiation spot of the laser light while increasing a moving average in intensity of the laser light per unit area.

公开(公告)号：US20230330774A1

公开(公告)日：2023-10-19

申请号：US18027388

申请日：2021-07-05

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yuki KABEYA ,  Takashi KURITA ,  Ryo YOSHIMURA ,  Takeshi WATARI

IPC: B23K26/073 ,  B23K26/356

CPC classification number: B23K26/073 ,  B23K26/356

Abstract: Disclosed is a laser processing method for imparting compressive residual stress to an object along an objective area on a surface of the object by irradiating the objective area with laser light. The laser processing method includes: a first step of expanding an area irradiated with the laser light toward a first side in the objective area; and a second step of expanding the area irradiated with the laser light toward a second side different from the first side in the objective area.

公开(公告)号：US20190372299A1

公开(公告)日：2019-12-05

申请号：US16423387

申请日：2019-05-28

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yuki KABEYA ,  Takashi SEKINE ,  Yoshinori KATO

IPC: H01S3/10 ,  H01S3/23

Abstract: A laser device includes a laser medium for amplifying seed light, a first optical system for outputting excitation light for exciting the laser medium and causing the excitation light to be incident on the laser medium and input to an excitation region of the laser medium, and a second optical system for causing the seed light of first polarization to be incident on the laser medium at an incidence angle larger than 0° with respect to the laser medium and input to the excitation region.

公开(公告)号：US20190232423A1

公开(公告)日：2019-08-01

申请号：US16256031

申请日：2019-01-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yoshio MIZUTA ,  Takashi KURITA ,  Takeshi WATARI ,  Yuki KABEYA ,  Norio KURITA ,  Toshiyuki KAWASHIMA

IPC: B23K26/0622 ,  B23K26/356 ,  B23K26/00 ,  C21D10/00

CPC classification number: B23K26/0622 ,  B23K26/009 ,  B23K26/356 ,  C21D10/005

Abstract: A laser processing apparatus includes a light source which outputs a laser light, and a waveform control unit which controls a pulse waveform of the laser light irradiating the workpiece, in which the pulse waveform of the laser light controlled by the waveform control unit includes a main pulse and a foot pulse temporally preceding the main pulse, and a peak intensity of the foot pulse is smaller than a peak intensity of the main pulse, and a peak position of the main pulse is positioned in a retention time period of plasma generated due to an incidence of the foot pulse on the workpiece.