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公开(公告)号：US20090056918A1
公开(公告)日：2009-03-05
申请号：US11845735
申请日：2007-08-27
IPC分类号： F28D15/00
CPC分类号： H01L23/4093 , H01L23/40 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , Y10T24/44026 , Y10T24/44034 , Y10T24/44556 , H01L2924/00
摘要： A heat dissipation device for dissipating heat from an electronic component (12) mounted on a printed circuit board (10) includes a retention module (30) resting on the printed circuit board, a heat sink (20) disposed on the retention module for contacting the electronic component, a clip (40) for securing the heat sink to the retention module, and a back plate unit mounted below the printed circuit board for engaging with the retention module and supporting the electronic component. The back plate unit includes a back plate (50), a gasket (62) engaging with the back plate, and a bracket (64) being sandwiched between the gasket and the back plate. The gasket has an annular top face contacting the printed circuit board, and a plurality of blocks (6202) contacting the back plate, whereby the gasket can provide a sufficient and uniform support to the electronic component.
摘要翻译： 一种用于从安装在印刷电路板（10）上的电子部件（12）散热的散热装置，包括搁置在印刷电路板上的保持模块（30），设置在保持模块上的散热片（20） 电子部件，用于将散热器固定到保持模块的夹子（40），以及安装在印刷电路板下方的用于与保持模块接合并支撑电子部件的背板单元。 背板单元包括背板（50），与背板接合的垫圈（62）和夹在垫圈和背板之间的托架（64）。 垫圈具有接触印刷电路板的环形顶面和与背板接触的多个块（6202），由此垫圈可以向电子部件提供足够和均匀的支撑。
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公开(公告)号：US20090034205A1
公开(公告)日：2009-02-05
申请号：US11831930
申请日：2007-07-31
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44026 , Y10T24/44034 , H01L2924/00
摘要： A heat sink assembly includes a heat sink having a first shoulder and a second shoulder, and a locking device having a retention module, a first clip and a second clip. The first clip has two extension portions engaging with the retention module and a pressing portion between the two extension portions. The second clip comprises a pressing portion located on the second shoulder, an axle connecting with the pressing portion and pivotably engaging with the retention module and a locking portion connecting with the pressing portion. The second clip can rotate around the axle thereof when the heat sink assembly is in an unlocked position; the locking portion engages with the retention module and the pressing portion presses the second shoulder of the heat sink toward the retention module when the heat sink assembly is in a locked position.
摘要翻译： 散热器组件包括具有第一肩部和第二肩部的散热器，以及具有保持模块，第一夹子和第二夹子的锁定装置。 第一夹子具有与保持模块接合的两个延伸部分和两个延伸部分之间的按压部分。 所述第二夹具包括位于所述第二肩部上的按压部，与所述按压部分连接并与所述保持模块可枢转地接合的轴和与所述按压部连接的锁定部。 当散热器组件处于解锁位置时，第二夹子可绕其轴线旋转; 当散热器组件处于锁定位置时，锁定部分与保持模块接合并且按压部分将散热器的第二肩部朝向保持模块按压。
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公开(公告)号：US20090154099A1
公开(公告)日：2009-06-18
申请号：US11959272
申请日：2007-12-18
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating assembly for dissipating heat from a graphic card and a hard disk driver (30), includes a heat sink (10) for contacting the graphic card and a fan duct (20) fixed on the heat sink. The fan duct is made by bending a planar metal plate and has a first portion soldered to a top face of the heat sink and a second portion slantwise and upwardly extending from the first portion. When a fan (40) generates an airflow towards the heat sink, a part of the airflow flows through the heat sink to remove heat in the heat sink, and another part of the airflow is guided slantwise and upwardly by the second portion of the fan duct to flow through the hard disk driver, thereby to cool the hard driver.
摘要翻译： 一种用于从图形卡和硬盘驱动器（30）散热的散热组件，包括用于接触图形卡的散热片（10）和固定在散热片上的风扇导管（20）。 风扇管道是通过弯曲平面金属板制成的，并且具有焊接到散热器的顶面的第一部分和从第一部分倾斜向上延伸的第二部分。 当风扇（40）朝向散热器产生气流时，一部分气流流过散热器以去除散热器中的热量，另一部分气流被风扇的第二部分倾斜向上引导 管道流过硬盘驱动器，从而冷却硬盘驱动器。
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公开(公告)号：US20080043445A1
公开(公告)日：2008-02-21
申请号：US11616839
申请日：2006-12-27
申请人： WAN-LIN XIA , TAO LI , WEI-QIANG TIAN
发明人： WAN-LIN XIA , TAO LI , WEI-QIANG TIAN
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a retention module surrounding a heat-generating component therein and a heat sink secured in the retention module. The retention module has a plurality of sidewalls. The heat sink includes a base positioned in the retention module for contacting with the heat-generating component. The base includes a plurality of first walls and a plurality of second walls. The sidewalls of the retention module enclose a periphery of the base, and the first walls and the second walls respectively abut against the sidewalls of the retention module when the base is located at a first position and a second position. A rotation of the base from the first position to the second position reduces an adhering force generated by a thermal grease located between the base and the heat-generating component.
摘要翻译： 散热装置包括围绕其中的发热部件的保持模块和固定在保持模块中的散热器。 保持模块具有多个侧壁。 散热器包括位于保持模块中的用于与发热部件接触的基座。 底座包括多个第一壁和多个第二壁。 保持模块的侧壁围绕基座的周边，并且当基座位于第一位置和第二位置时，第一壁和第二壁分别抵靠保持模块的侧壁。 基座从第一位置到第二位置的旋转减小了由位于基座和发热部件之间的导热油脂产生的粘合力。
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公开(公告)号：US20080039050A1
公开(公告)日：2008-02-14
申请号：US11457949
申请日：2006-07-17
IPC分类号： H04M11/00
CPC分类号： H04M17/02 , H04M15/28 , H04M15/49 , H04M15/51 , H04M15/67 , H04M15/83 , H04M15/84 , H04M15/844 , H04M15/85 , H04M15/851 , H04M15/854 , H04M2215/0168 , H04M2215/2026 , H04M2215/32 , H04M2215/46 , H04M2215/48 , H04M2215/54 , H04M2215/8129 , H04M2215/8137 , H04M2215/815 , H04M2215/8166 , H04M2215/82 , H04W4/20 , H04W4/24
摘要： Described are methods of a mobile communication device for processing a balance information message from a service provider in response to a balance information query. A method includes obtaining a service provider identity from a SIM, determining a format of a balance information message and identifying a balance information message from the service provider according to the format of the balance information message. Also described is a mobile communication device that includes a transceiver, a controller, and a memory configured to store format information including a format of a balance information message. The controller is configured to generate a communication to the service provider for transmission via the wireless transceiver, the communication being based on format information including the format of a balance information query, and to determine whether an incoming message received by the wireless transceiver from the service provider conforms to the balance information message.
摘要翻译： 描述了用于响应于平衡信息查询来处理来自服务提供商的余额信息消息的移动通信设备的方法。 一种方法包括从SIM卡获取服务提供商身份，根据平衡信息消息的格式确定平衡信息消息的格式并从服务提供商识别余额信息消息。 还描述了一种移动通信设备，其包括收发器，控制器和配置为存储包括平衡信息消息格式的格式信息的存储器。 所述控制器被配置为产生到所述服务提供商的通信，用于经由所述无线收发器进行传输，所述通信基于包括所述平衡信息查询的格式的格式信息，并且确定所述无线收发器从所述服务接收到的输入消息 提供者符合余额信息消息。
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公开(公告)号：US20120184697A1
公开(公告)日：2012-07-19
申请号：US13424881
申请日：2012-03-20
申请人： GEORGE J. SAMUELS , GREGORY J. SHAFER , TAO LI , CLINTON A. THRELFALL , NANCY IWAMOTO , ERIC J. RAINAL
发明人： GEORGE J. SAMUELS , GREGORY J. SHAFER , TAO LI , CLINTON A. THRELFALL , NANCY IWAMOTO , ERIC J. RAINAL
IPC分类号： C08F214/22
CPC分类号： B60C1/0008 , C01B5/00 , C01B13/0255 , C01B2210/0062 , C08F214/18 , C08F214/22 , C08F214/225 , C08J5/18 , C08J2327/16 , Y02E60/324 , Y02P20/582
摘要： A polyvinylidene difluoride copolymer with a fluoroolefin selected from 2,3,3,3-tetrafluoropropene, 1,1,3,3,3-pentafluoropropene, 2-chloro-pentafluoropropene, hexafluoropropylene, trifluoroethylene, chlorotrifluoroethylene, 3,3,3-trifluoro-2-trifluoromethylpropene and a mixture thereof, wherein the stoichiometry of the co-monomers defines the barrier properties of the copolymer. Such polymers include moisture barrier copolymers and oxygen barrier copolymer. Processes for preparing such moisture barrier copolymers and oxygen barrier copolymers are also provided.
摘要翻译： 具有选自2,3,3,3-四氟丙烯，1,1,3,3,3-五氟丙烯，2-氯 - 五氟丙烯，六氟丙烯，三氟乙烯，三氟氯乙烯，3,3,3-三氟乙烯的氟烯烃的聚偏二氟乙烯共聚物 -2-三氟甲基丙烯及其混合物，其中共聚单体的化学计量定义了共聚物的阻隔性质。 这种聚合物包括防潮共聚物和氧阻隔共聚物。 还提供了制备这种防潮共聚物和氧阻隔共聚物的方法。
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公开(公告)号：US20080170364A1
公开(公告)日：2008-07-17
申请号：US11681735
申请日：2007-03-02
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device adapted for cooling a heat-generating electronic component includes a heat sink (30), a fan (40) mounted on the heat sink (30), a fan duct (70) mounted on the fan (40) and a clip (50) securing the fan duct (70) on the fan (40). The fan (40) is sandwiched between a top of the heat sink (30) and a bottom of the fan duct (70). The clip (70) includes an axis (51) pivotably mounted on to a bottom of the fan duct (70), a locking portion (52) extending from an end of the axis (51) and buckled with the fan duct (70), and a pressing portion (53) bent from the axis (51) and engaging with a bottom surface of the top plate (42) of the fan (40).
摘要翻译： 适于冷却发热电子部件的散热装置包括：散热器（30），安装在散热器（30）上的风扇（40）;安装在风扇（40）上的风扇导管（70） 将风扇导管（70）固定在风扇（40）上的夹子（50）。 风扇（40）夹在散热器（30）的顶部和风扇导管（70）的底部之间。 夹子（70）包括可枢转地安装在风扇导管（70）的底部上的轴线（51），从轴线（51）的端部延伸并与风扇导管（70）一起弯曲的锁定部分（52） 以及从轴线（51）弯曲并与风扇（40）的顶板（42）的底面接合的按压部（53）。
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公开(公告)号：US20070107871A1
公开(公告)日：2007-05-17
申请号：US11308862
申请日：2006-05-16
申请人： WAN-LIN XIA , TAO LI , MIN-QI XIAO , YONG ZHONG
发明人： WAN-LIN XIA , TAO LI , MIN-QI XIAO , YONG ZHONG
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , F28D15/0275 , F28F3/02 , F28F2215/04 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for dissipating heat from an electronic component comprises a heat spreader and a plurality of first fins and second fins provided thereon. The first and second fins are parallel to each other and arranged in alternating order so as to define a plurality of air passages. The first and second fins are so arranged that thinner air passages and denser fin distribution in the middle along the extension direction of the air passages and wider air passages and lower fin distribution density at two ends are provided.
摘要翻译： 用于从电子部件散热的散热器包括散热器和设置在其上的多个第一散热片和第二散热片。 第一和第二散热片彼此平行并且以交替的顺序布置以便限定多个空气通道。 第一和第二散热片设置成使得沿着空气通道的延伸方向在中间更薄的空气通道和更密集的翅片分布，并且提供了更宽的空气通道，并且在两端具有较低的翅片分布密度。
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