IC test system
    1.
    发明授权

    公开(公告)号:US10527669B2

    公开(公告)日:2020-01-07

    申请号:US15756435

    申请日:2015-08-31

    申请人: HAPPYJAPAN, INC.

    IPC分类号: G01R31/28 G01R31/26 G01R1/04

    摘要: An IC device 4 of the present invention includes a robot arm 6 for conveying IC devices D to a test head 2 for testing the IC devices. The test head 2 includes sockets 3 having placement surfaces 3a onto which the IC devices D are placed and for attaching the IC devices placed on the placement surfaces to the test head. The robot arm 6 includes a contact head 61 for holding the IC devices while the IC devices are conveyed and for pressing the IC devices onto the test head during testing, and a non-contact displacement meter 71 that moves in association with the movement of the contact head 61. The non-contact displacement meter 71 is mounted on the robot arm 6 so as to measure a distance by emitting a beam in a direction perpendicular to the placement surfaces 3a.

    IC HANDLER
    2.
    发明申请
    IC HANDLER 审中-公开
    IC手柄

    公开(公告)号:US20160356843A1

    公开(公告)日:2016-12-08

    申请号:US15101386

    申请日:2013-12-03

    申请人: HAPPYJAPAN, INC.

    IPC分类号: G01R31/28

    摘要: An IC handler (4) of the present invention transfers an IC device (D) to a test head (2). The test head (2) is provided with a socket (3), which has a placing surface (3a) having the IC device (D) placed thereon, and which attaches the IC device (D) placed on the placing surface (3a) to the test head (2). The IC handler (4) is provided with a non-contact displacement meter (71) that is disposed by being spaced apart from the socket (3) in the direction perpendicular to the placing surface (3a). The non-contact displacement meter (71) measures a distance from the non-contact displacement meter (71) to the IC device (D) placed on the placing surface (3a) by emitting a laser beam toward the placing surface (3a) of the socket (3).

    摘要翻译: 本发明的IC处理器(4)将IC器件(D)传送到测试头(2)。 测试头(2)设置有插座(3),其具有放置有IC器件(D)的放置面(3a),并且将放置在放置面(3a)上的IC器件(D) 到测试头(2)。 IC处理器(4)设置有非接触式位移计(71),该非接触位移计(71)通过在垂直于放置表面(3a)的方向上与插座(3)间隔开来设置。 非接触式位移计(71)通过向激光束朝向放置面(3a)的放置面(3a)发射激光,测量从非接触位移计(71)到放置在放置面(3a)上的IC器件(D)的距离 插座(3)。

    IC handler
    3.
    发明授权

    公开(公告)号:US10222413B2

    公开(公告)日:2019-03-05

    申请号:US15101386

    申请日:2013-12-03

    申请人: HAPPYJAPAN, INC.

    IPC分类号: G01R31/28 G01R31/308

    摘要: An IC handler (4) of the present invention transfers an IC device (D) to a test head (2). The test head (2) is provided with a socket (3), which has a placing surface (3a) having the IC device (D) placed thereon, and which attaches the IC device (D) placed on the placing surface (3a) to the test head (2). The IC handler (4) is provided with a non-contact displacement meter (71) that is disposed by being spaced apart from the socket (3) in the direction perpendicular to the placing surface (3a). The non-contact displacement meter (71) measures a distance from the non-contact displacement meter (71) to the IC device (D) placed on the placing surface (3a) by emitting a laser beam toward the placing surface (3a) of the socket (3).

    IC TEST SYSTEM
    4.
    发明申请
    IC TEST SYSTEM 审中-公开

    公开(公告)号:US20180267097A1

    公开(公告)日:2018-09-20

    申请号:US15756435

    申请日:2015-08-31

    申请人: HAPPYJAPAN, INC.

    IPC分类号: G01R31/28 G01R1/04

    摘要: An IC device 4 of the present invention includes a robot arm 6 for conveying IC devices D to a test head 2 for testing the IC devices. The test head 2 includes sockets 3 having placement surfaces 3a onto which the IC devices D are placed and for attaching the IC devices placed on the placement surfaces to the test head. The robot arm 6 includes a contact head 61 for holding the IC devices while the IC devices are conveyed and for pressing the IC devices onto the test head during testing, and a non-contact displacement meter 71 that moves in association with the movement of the contact head 61. The non-contact displacement meter 71 is mounted on the robot arm 6 so as to measure a distance by emitting a beam in a direction perpendicular to the placement surfaces 3a.