METHOD AND APPARATUS FOR GAS DISTRIBUTION AND PLASMA APPLICATION IN A LINEAR DEPOSITION CHAMBER
    2.
    发明申请
    METHOD AND APPARATUS FOR GAS DISTRIBUTION AND PLASMA APPLICATION IN A LINEAR DEPOSITION CHAMBER 审中-公开
    气体分布和等离子体在线性沉积室应用中的方法与装置

    公开(公告)号:US20130059092A1

    公开(公告)日:2013-03-07

    申请号:US13605449

    申请日:2012-09-06

    IPC分类号: C23C16/513 H05H1/24

    摘要: A method and apparatus for processing a substrate is described. One embodiment of the invention provides an apparatus for forming thin films. The apparatus comprises a chamber defining an internal volume, a plasma source disposed within the internal volume, and at least one gas injection source disposed adjacent the plasma source within the internal volume, wherein the at least one gas injection source comprises a first channel and a second channel for delivering gases to the internal volume, the first channel delivering a gas at a first pressure or a first density and the second channel delivering a gas at a second pressure or a second density, the first pressure or the first density being different than the second pressure or the second density.

    摘要翻译: 描述了用于处理衬底的方法和设备。 本发明的一个实施例提供了一种用于形成薄膜的装置。 该装置包括限定内部体积的室,设置在内部体积内的等离子体源以及在内部体积内与等离子体源相邻设置的至少一个气体注入源,其中至少一个气体注入源包括第一通道和 用于将气体输送到内部容积的第二通道,所述第一通道以第一压力或第一密度输送气体,所述第二通道输送处于第二压力或第二密度的气体,所述第一压力或所述第一密度不同于 第二压力或第二密度。