公开(公告)号：US20230059410A1

公开(公告)日：2023-02-23

申请号：US17404097

申请日：2021-08-17

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Jaime E. Llinas ,  Saravanan Rathakrishnan ,  Yanyan Xia ,  ZeLin Wu ,  Yanli Li ,  JunHui Li ,  Jian Miremadi

IPC: G01B15/00 ,  G01B11/02

Abstract: Example implementations relate to an inspection method for training a measurement machine to accurately measure side joint lengths and detecting a defect among a plurality of solder joints. The method includes receiving a first data representing the side joint lengths of the plurality of solder joints measured by a first measurement machine and a second data representing the side joint lengths measured by a second measurement machine. Further, the method includes determining a correlation value based on a statistical analysis of a relationship between the first data and the second data. The method further includes updating an algorithm used by the first measurement machine to measure the side joint lengths, based on the correlation value to reduce deviation between the first data and the second data. Later, the updated algorithm is used as a dimensional metrology in the first measurement machine for detecting the defect in the solder joints.

公开(公告)号：US11927436B2

公开(公告)日：2024-03-12

申请号：US17404097

申请日：2021-08-17

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Jaime E. Llinas ,  Saravanan Rathakrishnan ,  Yanyan Xia ,  ZeLin Wu ,  Yanli Li ,  JunHui Li ,  Jian Miremadi

IPC: G01B15/00 ,  G01B9/04 ,  G01B11/02 ,  G01N21/956 ,  G01B21/04

CPC classification number: G01B15/00 ,  G01B9/04 ,  G01B11/02 ,  G01N21/956 ,  G01B21/042 ,  G01N2021/95638 ,  G01N2021/95669

Abstract: Example implementations relate to an inspection method for training a measurement machine to accurately measure side joint lengths and detecting a defect among a plurality of solder joints. The method includes receiving a first data representing the side joint lengths of the plurality of solder joints measured by a first measurement machine and a second data representing the side joint lengths measured by a second measurement machine. Further, the method includes determining a correlation value based on a statistical analysis of a relationship between the first data and the second data. The method further includes updating an algorithm used by the first measurement machine to measure the side joint lengths, based on the correlation value to reduce deviation between the first data and the second data. Later, the updated algorithm is used as a dimensional metrology in the first measurement machine for detecting the defect in the solder joints.