公开(公告)号：US20210402783A1

公开(公告)日：2021-12-30

申请号：US16763450

申请日：2019-12-03

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Anthony D. STUDER ,  Quinton B. WEAVER ,  David N. N. OLSEN ,  James Michael GARDNER ,  Jim RING ,  David Owen ROETHIG ,  Christopher Hans BAKKER

IPC: B41J2/175

Abstract: This disclosure describes integrated circuits which may be provided in logic circuitry packages and/or replaceable print apparatus components with print material reservoirs. An integrated circuit or logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit and at least one logic circuit.

公开(公告)号：US20220001673A1

公开(公告)日：2022-01-06

申请号：US16959394

申请日：2019-10-25

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Daryl Eugene ANDERSON ,  James Michael GARDNER ,  Christopher Hans BAKKER

IPC: B41J2/175

Abstract: A replaceable print apparatus component includes a print material reservoir, a print material within the reservoir having a first print material level, and a logic circuitry package including an interface and a logic circuit. The logic circuit may receive, via the interface, a first calibration parameter and receive, via the interface, a first request corresponding to a first sensor ID associated with a second print material level above the first print material level. The logic circuit may transmit, via the interface, a first digital value in response to the first request and receive, via the interface, a second calibration parameter less than the first calibration parameter. The logic circuit may receive, via the interface, a second request corresponding to the first sensor ID, and transmit, via the interface, a second digital value in response to the second request. The second digital value is less than the first digital value.

公开(公告)号：US20250033042A1

公开(公告)日：2025-01-30

申请号：US18715100

申请日：2021-12-10

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Viktor SHKOLNIKOV ,  Angela BAKKOM ,  Christopher Hans BAKKER ,  Matthew David SMITH

IPC: B01L3/00 ,  G01N15/02

Abstract: An example microfluidic device comprises a microfluidic channel fluidically coupled to a reservoir containing a fluid, a first sensor disposed within the microfluidic channel, a second sensor disposed within the microfluidic channel, a first dielectrophoretic (DEP) actuator disposed within the microfluidic channel between the first sensor and the second sensor, and a fluid ejection device fluidically coupled to the microfluidic channel.

公开(公告)号：US20210402784A1

公开(公告)日：2021-12-30

申请号：US16769923

申请日：2019-10-25

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Stephen D. PANSHIN ,  Jefferson P. WARD ,  James Michael GARDNER ,  Anthony D. STUDER ,  David N. OLSEN ,  Quinton B. WEAVER ,  David Owen ROETHIG ,  Christopher Hans BAKKER ,  David B. NOVAK

IPC: B41J2/175

Abstract: A logic circuitry package for a replaceable print apparatus component includes an interface to communicate with a print apparatus logic circuit, and a logic circuit having a communication address to communicate with the print apparatus logic circuit. The logic circuit is configured to detect, via the interface, communications that include an other communication address. The logic circuit is configured to respond, via the interface, to a command series directed to the logic circuit that include the communication address of the logic circuit, based on the detected communications.

公开(公告)号：US20210216491A1

公开(公告)日：2021-07-15

申请号：US16764710

申请日：2019-12-03

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Quinton B. WEAVER ,  David N. OLSEN ,  Anthony D. STUDER ,  Christopher Hans BAKKER ,  Jefferson P. WARD

IPC: G06F13/42 ,  G06F21/44

Abstract: An integrated circuit for a replaceable print apparatus component comprising a communication interface to communicate with a print apparatus logic circuit over the bus, and at least one logic circuit.