公开(公告)号：US20160346714A1

公开(公告)日：2016-12-01

申请号：US15033000

申请日：2013-10-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Roger A. McKay

IPC: B01D29/00 ,  C23F1/00 ,  B81B7/00 ,  B01D35/02

CPC classification number: B01D29/0093 ,  B01D35/02 ,  B01D67/0062 ,  B01D69/02 ,  B01D2325/021 ,  B81B7/0061 ,  C23C14/5873 ,  C23C18/1603 ,  C23F1/00 ,  C23F1/02

Abstract: A method comprises forming etching islands on a substrate and exposing the substrate with etching islands to a solution that reacts with the etching islands to form a filter passage of interconnected pores in the substrate. The filter passage has an inlet into the substrate and an outlet from the substrate.

Abstract translation: 一种方法包括在衬底上形成蚀刻岛，并将具有蚀刻岛的衬底暴露于与蚀刻岛反应的溶液，以在衬底中形成互连孔的过滤通道。 过滤通道具有进入衬底的入口和来自衬底的出口。

公开(公告)号：US10086317B2

公开(公告)日：2018-10-02

申请号：US15033000

申请日：2013-10-30

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Roger A. McKay ,  Patrick W. Sadik

IPC: C23F1/00 ,  B01D35/02 ,  B01D29/00 ,  B81B7/00 ,  B01D69/02 ,  B01D67/00 ,  B81C1/00 ,  C23C14/58 ,  C23C18/16 ,  C23F1/02

Abstract: A method comprises forming etching islands on a substrate and exposing the substrate with etching islands to a solution that reacts with the etching islands to form a filter passage of interconnected pores in the substrate. The filter passage has an inlet into the substrate and an outlet from the substrate.

公开(公告)号：US09938139B2

公开(公告)日：2018-04-10

申请号：US15033015

申请日：2013-10-30

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Roger A. McKay ,  Patrick W. Sadik

IPC: B81C1/00 ,  H01M4/38 ,  H01M4/04 ,  C23C14/58 ,  C23F1/16 ,  C23F1/02

CPC classification number: B81C1/00539 ,  B81B2201/058 ,  B81C1/00119 ,  B81C2201/0115 ,  B81C2201/014 ,  C23C14/5873 ,  C23F1/02 ,  C23F1/16 ,  H01M4/0492 ,  H01M4/386

Abstract: Etching islands are formed on a first face of a substrate and a second face of the substrate non-parallel to the first face. The first face and the second face of the substrate are concurrently exposed to a solution that reacts with the etching islands to concurrently form porous regions extending into the first face and the second face.

公开(公告)号：US09988263B2

公开(公告)日：2018-06-05

申请号：US14914215

申请日：2013-08-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Patrick Wayne Sadik ,  Roger A. McKay

IPC: H01L21/306 ,  B81C1/00 ,  B41J2/16

CPC classification number: B81C1/00063 ,  B41J2/162 ,  B41J2/1626 ,  B81B2201/052 ,  B81C2201/0115 ,  B81C2201/0133 ,  B81C2201/0181

Abstract: An example provides a method including sputtering a metal catalyst onto a substrate, exposing the substrate to a solution that reacts with the metal catalyst to form a plurality of pores in the substrate, and etching the substrate to remove the plurality of pores to form a recess in the substrate.

公开(公告)号：US20160244885A1

公开(公告)日：2016-08-25

申请号：US15033015

申请日：2013-10-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Roger A. McKay ,  Patrick W. Sadik

IPC: C23F1/16

CPC classification number: B81C1/00539 ,  B81B2201/058 ,  B81C1/00119 ,  B81C2201/0115 ,  B81C2201/014 ,  C23C14/5873 ,  C23F1/02 ,  C23F1/16 ,  H01M4/0492 ,  H01M4/386

Abstract: Etching islands are formed on a first face of a substrate and a second face of the substrate non-parallel to the first face. The first face and the second face of the substrate are concurrently exposed to a solution that reacts with the etching islands to concurrently form porous regions extending into the first face and the second face.

Abstract translation: 在基板的第一面和不平行于第一面的基板的第二面上形成蚀刻岛。 衬底的第一面和第二面同时暴露于与蚀刻岛反应的溶液，以同时形成延伸到第一面和第二面的多孔区域。